Patent application number | Description | Published |
20090039504 | SEMICONDUCTOR DEVICE - The present invention is intended to obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity. | 02-12-2009 |
20090114372 | HEAT SINK - A heat sink includes a heat-transfer container incorporating a flow path through which a cooling fluid flows, for cooling a heating element in contact with the heat-transfer container The flow path includes a first cross-sectional portion that becomes narrower as the distance between a given point in the flow path and a side of the heat-transfer container which makes contact with the heating element becomes longer in a direction perpendicular to the direction in which the cooling fluid flows, and a second cross-sectional portion that is approximately constant in the direction perpendicular to the direction in which the cooling fluid flows. The first cross-sectional portion and the second cross-sectional portion alternately continue in the direction in which the cooling fluid flows causing a three-dimensional flow so the heat-transfer properties are enhanced with a simplified structure. | 05-07-2009 |
20100084123 | COOLING APPARATUS, ELECTRONIC APPARATUS, AND BLOWER APPARATUS - Disclosed is a cooling apparatus including a heat sink, a blower mechanism, an opening member, and a movement mechanism. The blower mechanism has a blower opening that has a predetermined area and is opposed to the heat sink. The opening member has a first opening that has an area smaller than the area of the blower opening. The movement mechanism moves the opening member so that switching between a first state and a second state is performed. The first state is a state in which the first opening is disposed between the blower opening and the heat sink, and the second state is a state in which the first opening is removed from between the blower opening and the heat sink. | 04-08-2010 |
20100266953 | COPOLYMER AND TOP COATING COMPOSITION - A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which has a recurring unit (I) having a carboxyl group, a recurring unit (II) having a sulfo group and a recurring unit obtained by copolymerizing fluoroalkyl(meth)acrylates having 1 to 20 carbon atoms in a fluoroalkyl group thereof other than a recurring unit having a side chain that includes an alcoholic hydroxyl group having a fluoroalkyl group at least in an α-position thereof, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000. | 10-21-2010 |
20110031612 | POWER SEMICONDUCTOR CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME - A power semiconductor circuit device and a method for manufacturing the same, both of which are provided with: a base board on which at least a power semiconductor element is mounted; a resin which molds the base board and the power semiconductor element in a state where partial surfaces of the base board, including a base board surface opposite to a surface on which the power semiconductor element is mounted, are exposed; and a heat dissipating fin joined to the base board by a pressing force. A groove is formed in the base board at a portion to be joined to the heat dissipating fin, and the heat dissipating fin is joined by caulking to the groove. | 02-10-2011 |
20120082935 | RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM FORMED USING THE SAME - [Problem] To provide a resist film that exhibits high surface hydrophobicity during liquid immersion lithography, suppresses occurrence of defects due to development failure, and exhibits excellent lithographic performance | 04-05-2012 |
20120101205 | COPOLYMER AND TOP COATING COMPOSITION - A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which includes at least one recurring unit (I) selected from the group consisting of a recurring unit having a group shown by the following formula (1), a recurring unit having a group shown by the following formula (2), and a recurring unit having a carboxyl group, and a recurring unit (II) having a sulfo group, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000. | 04-26-2012 |
20120129353 | METHOD FOR PATTERN FORMATION, METHOD AND COMPOSITION FOR RESIST UNDERLAYER FILM FORMATION, AND RESIST UNDERLAYER FILM - Provided by the present invention is a method including: (1) forming a resist underlayer film on the upper face side of a substrate to be processed using a composition for forming a resist underlayer film, the composition containing (A) a compound having a group represented by the following formula (1); (2) forming a resist coating film by applying a resist composition on the resist underlayer film; (3) exposing the resist coating film by selectively irradiating the resist coating film with a radiation; (4) forming a resist pattern by developing the exposed resist coating film; and (5) forming a predetermined pattern on the substrate to be processed by sequentially dry etching the resist underlayer film and the substrate using the resist pattern as a mask. | 05-24-2012 |
20120178024 | POLYMER, RADIATION-SENSITIVE COMPOSITION, MONOMER, AND METHOD OF PRODUCING COMPOUND - A polymer includes a repeating unit shown by a general formula (1). R | 07-12-2012 |
20120212307 | ELECTROMAGNETICALLY OPERATED SWITCHING DEVICE - An electromagnetically operated switching device according to the present invention includes a pair of electromagnetically operated mechanisms for driving a main circuit contact of a switch via a link mechanism symmetrically arranged with respect to an operational center axis, and a length of a spring retaining plate can be regulated in accordance with a change of a link ratio, which is caused by a design change of the main circuit contact. | 08-23-2012 |
20120227952 | RADIATOR AND METHOD OF MANUFACTURING RADIATOR - A radiator including: a plurality of radiation fins; and a radiation fin support base having a heater element mounted to one surface thereof and a plurality of parallel fin grooves to which the radiation fins are installed and a projection configured to fix the radiation fin formed to the other surface thereof, wherein a top of the projection pushes one side surface of the radiation fin to push the other side surface of the radiation fin toward a side surface of the fin groove, and wherein the fin groove and the projection are each divided in a plurality of pieces in a longitudinal direction of the fin groove, and each of the divided fin grooves and each of the divided projections have a same length in the longitudinal direction of the fin groove and are paired with each other. | 09-13-2012 |
20120282553 | IMMERSION UPPER LAYER FILM FORMING COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN - An immersion upper layer film composition includes a resin and a solvent. The resin forms a water-stable film during irradiation and is dissolved in a subsequent developer. The solvent contains a monovalent alcohol having 6 or less carbon atoms. The composition is to be applied to form a coat on a photoresist film in an immersion exposure process in which the photoresist film is irradiated through water provided between a lens and the photoresist film. | 11-08-2012 |
20140023968 | RESIST PATTERN-FORMING METHOD, RESIST PATTERN-FORMING RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM - A resist pattern-forming method includes providing a resist film having a surface free energy of 30 to 40 mN/m on a substrate using a radiation-sensitive resin composition. The resist film is exposed by applying radiation via a mask. The exposed resist film is developed. It is preferable that the exposing of the resist film includes exposing the resist film via an immersion liquid that is provided over the resist film | 01-23-2014 |
20140042125 | TANK-TYPE VACUUM CIRCUIT BREAKER - A tank-type vacuum circuit breaker includes: a pressure tank; an insulating frame that is detachably supported by a support member provided in the pressure tank using a coupling; a vacuum interrupter that is supported by the insulating frame and includes a stationary electrode and a moving electrode; a stationary-electrode side terminal that is connectably/disconnectably connected to a bushing-terminal side internal conductor; a moving-electrode side terminal that is connectably/disconnectably connected to a bushing-terminal side internal conductor; and an insulating rod, the inside end of which is detachably coupled to the moving electrode and the outside end of which is coupled to an opening/closing actuation mechanism that opens/closes the contacts of the stationary contact and moving contact. The vacuum interrupter, the stationary-electrode side terminal, the moving-electrode side terminal and the insulating frame are integrated into a unit, and the unit can be removed and mounted by disconnecting the connections and the couplings. | 02-13-2014 |
20140132373 | ELECTROMAGNETICALLY OPERATED DEVICE AND SWITCHING DEVICE INCLUDING THE SAME - An electromagnetically operated device includes: a moving member of the electromagnetically operated device; a drive coil that is energized to generate magnetic flux for driving the moving member; a permanent magnet provided between a stationary member and the moving member for holding the moving member; and a holding force adjusting member for adjusting the holding force applied to the moving member by the permanent magnet, wherein the holding force adjusting member is placed at a position that will not be included in the main magnetic path of the magnetic flux caused by the drive coil so as to be removable. | 05-15-2014 |
20140157319 | PROGRAM SWITCHING CONTROL DEVICE AND PROGRAM - A terminal ( | 06-05-2014 |
20140209569 | TANK TYPE VACUUM CIRCUIT BREAKER - A pressure tank which seals and contains an electrical device, is formed with an opening portion corresponding to a terminal portion provided on the electrical device. A porcelain tube which is disposed so as to protrude with respect to the pressure tank, is fixed to the opening portion at a base portion thereof, and is provided with a terminal conductor at a leading end portion thereof. A first connection conductor is led out into a center portion of the porcelain tube at one end thereof, and is connected to the terminal conductor at the other end thereof. A second connection conductor which has a concave section to be fitted onto the first connection conductor at one side thereof, is connected to the terminal portion at the other side thereof. A contact is disposed between the first connection conductor and the concave section of the second connection conductor. | 07-31-2014 |
20140220783 | PATTERN-FORMING METHOD AND RESIST UNDERLAYER FILM-FORMING COMPOSITION - A pattern-forming method includes providing a resist underlayer film on a substrate using a resist underlayer film-forming composition. The resist underlayer film-forming composition includes a first polymer having a glass transition temperature of 0 to 180° C. A silicon-based oxide film is provided on a surface of the resist underlayer film. A resist pattern is provided on a surface of the silicon-based oxide film using a resist composition. The silicon-based oxide film and the resist underlayer film are sequentially dry-etched using the resist pattern as a mask. The substrate is dry-etched using the dry-etched resist underlayer film as a mask. | 08-07-2014 |
20140367702 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - An object is to provide a fin integrated type semiconductor device and a method of manufacturing the same, which are provided with a simple structure and good heat dissipation characteristics. The semiconductor device includes: a base plate on which fins arranged in a standing condition are formed on a first main face; an insulating layer formed on a second main face of the base plate, the second main face being opposite to the first main face of the base plate; a circuit pattern fixed to the insulating layer; and a semiconductor element joined to the circuit pattern. The fins are formed with slits that pass through in the thickness direction of the fins. | 12-18-2014 |