Patent application number | Description | Published |
20100264223 | METHOD FOR FABRICATING AN ORGANIC DIODE-BASED IDENTIFICATION AND AUTHENTICATION DEVICE, DEVICE AND METHOD FOR USE - The fabrication method comprises a step of exposing at least one organic diode to a gas, before packaging of the device, to form a plurality of randomly distributed black spots by impairment. Increasing the exposure time enables the size of the black spots to be increased, also randomly. The surface distribution of the black spots, visible by electroluminescence, enables an object associated with this distribution to be identified in reliable manner. | 10-21-2010 |
20100276818 | DEVICE COMPRISING AN ORGANIC COMPONENT AND AN ENCAPSULATION LAYER WITH A MOISTURE-REACTIVE MATERIAL - The device includes at least one optoelectronic component positioned on a substrate and at least one transparent face. The component is covered by a packaging layer which includes at least one barrier layer and a moisture-reactive layer. The reactive layer includes a moisture-reactive material chosen from alkaline-earth metals, alkali metals and organo-metallic derivatives. The material can be positioned in the moisture-reactive layer in the form of a continuous layer or in the form of a plurality of nodules dispersed in an organic matrix. | 11-04-2010 |
20110032177 | Method for Making an Electronic Display Device Covered by a Protection Plate - The invention relates to a method for making an electronic display device ( | 02-10-2011 |
20110186871 | ELECTROLUMINESCENT DISPLAY, ILLUMINATION OR INDICATING DEVICE, AND ITS FABRICATION PROCESS - The invention relates to an electroluminescent display, illumination or indicating device and to its fabrication process. This device ( | 08-04-2011 |
20110198627 | Organic Optoelectronic Device And A Method For Encapsulating Said Device - The invention relates to an organic optoelectronic device, such as a display, lighting or signalling device, that is protected from the ambient air by a sealed encapsulation in the form of a thin film, and to a method for encapsulating such a device. An optoelectronic device ( | 08-18-2011 |
20130280833 | Reactor for Atomic Layer Deposition (ALD), Application to Encapsulation of an OLED Device by Deposition of a Transparent Al2O3 Film - The present invention relates to a reactor for atomic layer deposition (ALD), comprising a reaction chamber comprising a platen and bounded internally by surfaces; at least one inlet orifice and at least one outlet orifice, each emerging from one of the surfaces bounding the chamber. The reactor furthermore comprises, within it, at least one wall apertured with at least one orifice, the apertured wall extending around the platen and over at least most of the height between the lower surface and the upper surface, at least one orifice in at least one of the apertured walls not facing the inlet orifice so as to form chicanes in the flow of gaseous precursor from each inlet orifice to the platen. | 10-24-2013 |
20140124767 | Organic Optoelectronic Device And The Encapsulation Method Thereof - An organic optoelectronic device incorporating a hermetic thin-film encapsulation, and encapsulation method are provided. This device-has a useful emission or absorption face and, behind this face, a substrate coated with an array of radiation-emitting or radiation-absorbing organic structures inserted between, and electrically contacting, electrodes that are respectively proximal and distal relative to the substrate. Separating beads between structures, composed of an insulating material, extend between the respective proximal electrodes of the structures from peripheral edges of these electrodes. The device includes a hermetic encapsulation that has at least one inorganic internal film surmounting the distal electrode, a photosensitive polymer layer covering this internal film, and a dielectric inorganic external film acting as a barrier covering the polymer layer. The polymer layer is etched with a discontinuous geometry formed of segments that respectively surmount the structures and end beyond the structures in line with the beads. | 05-08-2014 |
20140138719 | Organic Optoelectronic Device And Method For The Encapsulation Thereof - The invention relates to an organic optoelectronic device which is protected from ambient air by a sealed encapsulation structure of the type including at least one thin layer. The device includes a substrate; at least one light-emitting unit deposited on the substrate, incorporating internal electrodes and external electrodes defining an active zone and, between the electrodes, a stack of organic; and a sealed encapsulation structure having one or more thin layers including at least one inorganic layer placed on top of the light-emitting unit and encasing same laterally. The device also includes a pre-encapsulation structure located between the external electrode and the encapsulation structure and which includes a buffer layer covering the external electrode and contains a heterocyclic organometallic complex having a glass transition temperature above 80° C., and a barrier layer covering the buffer layer and contains a silicon oxide SiOx, wherein x is 005-22-2014 | |
20140284807 | ENCAPSULATION PROCESS AND ASSOCIATED DEVICE - The invention relates to an encapsulation process for an electronic component ( | 09-25-2014 |