Tomoyuki Abe
Tomoyuki Abe, Akita JP
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20100012362 | RESIN COMPOSITION, RESIN FILM, COVER LAY FILM, INTERLAYER ADHESIVE, METAL-CLAD LAMINATE AND MULTILAYER PRINTED CIRCUIT BOARD - The present invention provides a resin composition for use as an adhesive material of a printed circuit board, comprising a polyimide siloxane resin. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, in which flowing out during heating/pressing is prevented and which provide excellent adhesion strength. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, which exhibit excellent heat resistance. | 01-21-2010 |
Tomoyuki Abe, Fukuoka JP
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20090031493 | WATER DISCHARGE SYSTEM - There is provided a water discharge system. A water discharge system includes a water discharge portion; a sensor unit which acquires movement information about an object based on a radiated electric wave, and outputs a detecting signal; and a control unit which controls water discharge of the water discharge portion based on the detecting signal. When it is detected that the object is decelerated to a first threshold velocity or less, the control unit controls the water discharge portion to start the water discharge. | 02-05-2009 |
20110199251 | RADIO WAVE SENSOR - The object of the present invention is to provide a low power consumption, compact radio wave sensor capable of accurately detecting the presence and mobile status of a detected object present within a detection area, and having a superior S/N ratio. The radio wave sensor comprising: an oscillator circuit | 08-18-2011 |
Tomoyuki Abe, Fukushima JP
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20130096233 | EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD - The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg. | 04-18-2013 |
Tomoyuki Abe, Tochigi JP
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20140154500 | DOUBLE-SIDED ADHESIVE TAPE AND METHOD FOR PRODUCING THE SAME - In a double-sided adhesive tape in which acrylic-based adhesive layers are formed on respective sides of an electron beam cross-linked polyethylene foam substrate, the acrylic-based adhesive layers are formed from a cured resin composition formed by irradiating a solvent-free photopolymerizable monomer composition containing an acrylic-based monomer and a photopolymerization initiator with ultraviolet rays to photo-polymerize the acrylic-based monomer. The cured resin composition contains an adhesion-imparting polymer having a weight average molecular weight of 2,000 to 10,000, an acrylic-based polymer A obtained by photopolymerization in the absence of a cross-linking agent and having a weight average molecular weight of 700,000 to 3,000,000, and an acrylic-based polymer B obtained by photopolymerization in the absence of a cross-linking agent and having a weight average molecular weight of 350,000 to 650,000. The molecular weight distribution of the cured resin composition measured by gel permeation chromatography using tetrahydrofuran is 2.4 to 4.4. | 06-05-2014 |
Tomoyuki Abe, Tokyo JP
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20140309027 | VIDEO GAME PROCESSING APPARATUS AND VIDEO GAME PROCESSING PROGRAM - A video game processing apparatus for controlling progress of a video game while displaying a three-dimensional avatar, arranged within a virtual space, on a display screen of a the display device is provided. A three-dimensional partial model is generated on the basis of two-dimensional image data inputted by a user of the video game processing apparatus. The three-dimensional partial model constitutes at least apart of a body of a three-dimensional avatar, including a face portion of the three-dimensional avatar. A plurality of three-dimensional partial models thus generated is stored in a three-dimensional partial model memory. At least one three-dimensional partial model for each scene in the video game is specified from the plurality of three-dimensional partial models. The display device is caused to display the three-dimensional avatar, which includes the specified three-dimensional partial model, in a corresponding scene on the display screen. | 10-16-2014 |
Tomoyuki Abe, Isehara JP
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20140367081 | COOLING SYSTEM - An object in one aspect is to supply, to an electronic device, cooling fluid of a temperature lower than a temperature of an environment in which the electronic device is set. A cooling system has an electronic device, a supply pipe, a discharge pipe, and a heat exchange portion. The supply pipe supplies cooling fluid to the electronic device, and the discharge pipe discharges cooling fluid from the electronic device. The heat exchange portion exchanges heat between the supply pipe and the discharge pipe in a case in which a temperature of cooling fluid flowing through the supply pipe is lower than a dew point of an environment in which the electronic device is set. | 12-18-2014 |