Patent application number | Description | Published |
20110263058 | METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT - A method of manufacturing the semiconductor light emitting element comprises a semiconductor layer forming step of forming the multilayered nitride semiconductor layer on the first wafer having a transparent property; a bonding step of bonding the multilayered nitride semiconductor layer to the first wafer; a groove forming step of forming the groove extending from the lower surface of the first wafer to the multilayered nitride semiconductor layer; a light applying step of applying a first light to the lower surface of the multilayered nitride semiconductor layer through the first wafer to reduce a bonding force between the multilayered nitride semiconductor layer and the first wafer; a separating step of separating the first wafer from the multilayered nitride semiconductor layer; and a cutting step of cutting the second wafer along the groove to divide into a plurality of the semiconductor light emitting element. | 10-27-2011 |
20110297989 | LIGHT EMITTING DEVICE - The light emitting device comprises a mounting substrate and an LED chip which comprises an n-type nitride semiconductor layer, a nitride light emission layer on the n-type nitride semiconductor layer, p-type nitride semiconductor layer on the nitride light emission layer, an anode electrode opposite of the nitride light emission layer from the p-type nitride semiconductor layer, and a cathode electrode on the n-type nitride semiconductor layer. The mounting substrate has a patterned conductor which is connected to the cathode electrode through a bump and also connected to the anode electrode through a bump. The LED chip further comprises one or more dielectric layer between the p-type nitride semiconductor layer and the anode electrode to have an arrangement which resembles an island. The p-type nitride semiconductor layer has a first region which is overlapped with the bump. The dielectric layer is not formed within the first region. | 12-08-2011 |
20150194412 | LIGHT EMITTING DEVICE, LIGHT SOURCE FOR ILLUMINATION, AND ILLUMINATION APPARATUS - A light emitting device includes: a substrate; a first light emitting element and a second light emitting element that are mounted above the substrate; and a heat transfer pattern that is formed on the substrate. A rate of decrease in light output with respect to a temperature increase is greater for the second light emitting element than for the first light emitting element. The second light emitting element is mounted above the substrate via the heat transfer pattern, and the first light emitting element is mounted above the substrate without the heat transfer pattern | 07-09-2015 |
20150260351 | LIGHT-EMITTING DEVICE, ILLUMINATION LIGHT SOURCE, AND ILLUMINATION DEVICE - A light-emitting device includes a board; and light-emitting element arrays connected in parallel and each including light-emitting elements mounted on the board and connected in series. The light-emitting elements in each of the light-emitting element arrays include one or more red LED chips and one or more blue LED chips. Each of the red LED chips on the board is disposed non-successively to any other one of the red LED chips along a Y direction and along an X direction. The Y direction is parallel to a direction along which the red LED chips included in one of the light emitting arrays including the red LED chip are arranged. The X direction is perpendicular to the Y direction. | 09-17-2015 |
20150263246 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME, ILLUMINATION LIGHT SOURCE, AND ILLUMINATION DEVICE - A light-emitting device includes a board; and a first light-emitting element array and a second light-emitting element array connected in parallel and each including light-emitting elements mounted on the board and connected in series. The light-emitting elements includes a red LED chip and a blue LED chip. The red LED chip is sealed with a dot of a first sealant, and the blue LED chip is sealed with a dot of a second sealant which is different from the first sealant. | 09-17-2015 |
20150264772 | LIGHTING EQUIPMENT, ILLUMINATION DEVICE AND LIGHT EMITTING MODULE - Lighting equipment | 09-17-2015 |
20150276150 | LIGHTING EQUIPMENT, LIGHTING DEVICE, AND LIGHT-EMITTING MODULE - Lighting equipment is provided that enables illumination light having a stable FCI to be obtained, without influence from the lighting conditions. To this end, lighting equipment | 10-01-2015 |
20160076712 | LIGHT EMITTING APPARATUS, LIGHTING LIGHT SOURCE, AND LIGHTING APPARATUS - Light emitting apparatus includes: substrate; red LED chip on substrate; blue LED chip on substrate, blue LED chip being connected in series with red LED chip and having an emission color different from red LED chip; and second sealing member that includes green phosphor and yellow phosphor and seals at least blue LED chip, and light-emission by red LED chip, blue LED chip, green phosphor, and yellow phosphor produces white light. | 03-17-2016 |