Patent application number | Description | Published |
20080239124 | SOLID-STATE IMAGING DEVICE, SIGNAL PROCESSING METHOD OF SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS - A solid-state imaging device is disclosed. The device includes: a pixel array unit in which unit pixels including photoelectric conversion elements are two-dimensionally arranged and a first signal and a second signal are outputted to a signal line as a pixel signal; a signal processing unit including a variable gain amplifier, and an analog/digital converter; a signal supply unit supplying a reference signal; plural memory units holds the reference signal passed through the signal processing unit so as to correspond to the plural gains respectively when the variable gain amplifier is set at the plural gains respectively; and a correction unit subtracting the reference signal held in the plural memory units from the pixel signal outputted from each unit pixel in an active pixel area of the pixel array unit and passed through the signal processing unit when the variable gain amplifier is set at the plural gains respectively. | 10-02-2008 |
20100097510 | IMAGE PICKUP ELEMENT AND CONTROL METHOD THEREFOR, AND CAMERA - An image pickup element includes a plurality of read signal lines; a pixel unit in which a plurality of pixel circuits are arranged in a matrix form, the plurality of pixel circuits in the pixel unit being divided into groups of pixel circuits so that each of the groups is provided in a corresponding one of columns, each of the groups of pixel circuits being connected to a corresponding one of the plurality of read signal lines; and a processing unit configured to process read signals that the plurality of pixel circuits, which are divided into groups, output to the plurality of read signal lines, which are connected to the plurality of pixel circuits. | 04-22-2010 |
20100245639 | Imaging device, method of converting read-out signal, and camera - An imaging device includes: a pixel unit that converts incident light into an electrical signal corresponding to the amount of the incident light; and a read-out unit that reads out a read-out signal from the pixel unit for a first period and a second period, wherein the read-out unit includes a clock signal generating section that generates clock signals having a frequency corresponding to the voltage of the read-out signal, a first counter section that counts the clock signals generated by the clock signal generating section, a second counter section that counts output clock signals of the first counter section, a first correction section that corrects the voltage of the read-out signal to be constant before start of counting of the first and second counter sections for the first period and stops correction of the voltage of the read-out signal after the start of counting of the first and second counting sections for the first period and during the second period, and a second correction section that corrects a frequency of the output clock signal of the first counter section to a frequency that is higher than the frequency of the output clock signal. | 09-30-2010 |
20120175719 | X-Y ADDRESS TYPE SOLID STATE IMAGE PICKUP DEVICE AND METHOD OF PRODUCING THE SAME - In an X-Y address type solid state image pickup device represented by a CMOS image sensor, a back side light reception type pixel structure is adopted in which a wiring layer is provided on one side of a silicon layer including photo-diodes formed therein, and visible light is taken in from the other side of the silicon layer, namely, from the side (back side) opposite to the wiring layer. Wiring can be made without taking a light-receiving surface into account, and the degree of freedom in wiring for the pixels is enhanced. | 07-12-2012 |
20120267691 | X-Y ADDRESS TYPE SOLID STATE IMAGE PICKUP DEVICE AND METHOD OF PRODUCING THE SAME - In an X-Y address type solid state image pickup device represented by a CMOS image sensor, a back side light reception type pixel structure is adopted in which a wiring layer is provided on one side of a silicon layer including photo-diodes formed therein. and visible light is taken in from the other side of the silicon layer, namely, from the side (back side) opposite to the wiring layer. wiring can be made without taking a light-receiving surface into account, and the degree of freedom in wiring for the pixels is enhanced. | 10-25-2012 |
20120267692 | X-Y ADDRESS TYPE SOLID STATE IMAGE PICKUP DEVICE AND METHOD OF PRODUCING THE SAME - In an X-Y address type solid state image pickup device represented by a CMOS image sensor, a back side light reception type pixel structure is adopted in which a wiring layer is provided on one side of a silicon layer including photo-diodes formed therein. and visible light is taken in from the other side of the silicon layer, namely, from the side (back side) opposite to the wiring layer. wiring can be made without taking a light-receiving surface into account, and the degree of freedom in wiring for the pixels is enhanced. | 10-25-2012 |
20120273912 | X-Y ADDRESS TYPE SOLID STATE IMAGE PICKUP DEVICE AND METHOD OF PRODUCING THE SAME - In an X-Y address type solid state image pickup device represented by a CMOS image sensor, a back side light reception type pixel structure is adopted in which a wiring layer is provided on one side of a silicon layer including photo-diodes formed therein. and visible light is taken in from the other side of the silicon layer, namely, from the side (back side) opposite to the wiring layer. wiring can be made without taking a light-receiving surface into account, and the degree of freedom in wiring for the pixels is enhanced. | 11-01-2012 |