Patent application number | Description | Published |
20080239170 | LOW PROFILE, HIGH EFFICIENCY PROJECTOR FOR HANDHELD ELECTRONIC DEVICES - A low profile projector ( | 10-02-2008 |
20090034215 | Method and Apparatus for Providing Electrically Isolated Closely Spaced Features on a Printed Circuit Board - A method and apparatus for forming controlled stress fractures in metal produces electrically isolated, closely spaced circuit sub-entities for use on a metallized printed wiring board. A polymeric substrate has a layer of metal adhered to the surface, and the metal layer is formed into entities. Each entity has a fracture initiating feature formed into it, which serves to initiate and/or direct a stress crack that is induced in the metal. The entities are fractured in a controlled manner by subjecting the substrate and the entities to mechanical stress by a rapid thermal excursion, creating a stress fracture in the entity extending from the fracture initiating feature. The stress fracture divides each entity into two or more sub-entities that are electrically isolated from each other by the stress fracture. The resulting structure can be used to form circuitry requiring very fine spaces for high density printed circuit boards. The rapid thermal stress may be induced by a high intensity, strobed xenon arc lamp. | 02-05-2009 |
20090079945 | Image Stabilization in a Laser-Scanning Based Projector - A projector assembly includes a multi-pixel frame projector that sequentially projects each pixel making up a frame to a viewing surface, a movement detector coupled to the projector to detect a physical movement of the projector, and a movement compensator coupled to the projector, the movement compensator operable to transmit a correction signal to the projector, the correction signal capable of causing the projector to compensate for the detected movement. | 03-26-2009 |
20090159565 | Method to Pattern Metallized Substrates Using a High Intensity Light Source - A method for delineating a metallization pattern in a layer of sputtered aluminum or sputtered copper using a broad spectrum high intensity light source. The metal is deposited on a polymeric substrate by sputtering, so that it has a porous nanostructure. An opaque mask that is a positive representation of the desired metallization pattern is then situated over the metallization layer, exposing those portions of the metallization layer intended to be removed. The masked metallization layer is then exposed to a rapid burst of high intensity visible light from an arc source sufficient to cause complete removal of the exposed portions of the metallization layer, exposing the underlying substrate and creating the delineated pattern. | 06-25-2009 |
20090231494 | IMAGE PROJECTOR WITH INTERNALLY TILED INTERMEDIATE IMAGES - Disclosed are a system and method for microprojection that uses multiple imagers to produce a high resolution output image. Each of a set of imagers produces a portion of the final image. Relay lenses then tile the individual image portions together into a combined image. Because the height of the individual imagers is smaller than the height of a monolithic imager, they can fit into a very thin device. The combined image has a resolution equal to the sum of the resolutions of the individual imagers. The individual images are tiled together within the microprojector itself rather than on a projection screen. This allows the tiling to be adjusted once at the factory and set forever. In some embodiments, the light created for use by the microprojector is split by a polarizing beamsplitter. Each resultant polarized beam is then sent to an imager. Another polarizing beamsplitter combines the individual images. | 09-17-2009 |
20090257030 | IMAGE PROJECTOR WITH TIME-SEQUENTIAL INTERLACING - Disclosed are a system and method for microprojection that uses a “reduced-height” imager to sequentially display a series of partial images within one frame time. The partial images visually combine on a projection surface (e.g., a screen or a wall) into one high-resolution projected image. As a result, the microprojector projects an image with a resolution equal to the sum of the resolutions of the individual partial images while avoiding the use of very small imager optics with their lowered efficiency. For example, one embodiment projects exactly two partial images during each frame. During a first state of operation, a “half-height” imager displays the odd-numbered lines of the projected image. During a second state of operation, the imager displays the even-numbered lines of the projected image. By quickly cycling through these two states, no image flickering between phases is visible, and the combined image appears as a seamless whole. | 10-15-2009 |