Patent application number | Description | Published |
20080214029 | Shieldless, High-Speed Electrical Connectors - An electrical connector that includes a mass disposed within the connector such that the connector has a first center of gravity in the absence of the mass and a second center of gravity with the mass is disclosed. Such a connector may include a connector housing and an insert molded leadframe assembly (IMLA) positioned within the connector housing. The IMLA may include an array of electrically-conductive contacts and a dielectric leadframe housing overmolded onto the array of contacts. The mass may be disposed within the connector such that the mass causes the connector to be balanced. The connector may be unbalanced about the first center of gravity and balanced about the second center of gravity. The connector may be a right angle, ball grid array connector. | 09-04-2008 |
20080248693 | SHIELDLESS, HIGH-SPEED ELECTRICAL CONNECTORS - A shieldless, high-speed electrical connector is disclosed. Such a connector may include a first column of electrical contacts comprising a first arrangement of differential signal pairs separated from one another by first ground contacts, and a second column of electrical contacts adjacent to the first column, the second column of electrical contacts comprising a second arrangement of differential signal pairs separated from one another by second ground contacts. The connector may be devoid of electrical shield plates between the first column of electrical contacts and the second column of electrical contacts. The connector may be capable of transferring differential signals at data transfer rates of at least ten gigabits per second through the connector while producing no more than an acceptable level of cross talk on any of the differential signal pairs. | 10-09-2008 |
20090191731 | HIGH DENSITY CONNECTOR AND METHOD OF MANUFACTURE - Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume. | 07-30-2009 |
20090201658 | INTERCONNECTION ASSEMBLY FOR PRINTED CIRCUIT BOARDS - A backplane has through holes for conductors to project through the backplane in arrays corresponding to respective circuit boards arranged along the front side of the backplane. The through holes include ground holes for receiving ground conductors in connection with a ground plane, and signal holes for receiving signal conductors free of connections with the ground plane. In accordance with a principal feature, the backplane is free of circuitry configured to interconnect signal conductors in the signal holes. This avoids problems associated with circuit density within the structure of a backplane. In accordance with another principal feature, each signal hole is wide enough to provide clearance for a respective signal conductor to extend fully through the signal hole free of contact with the backplane. The clearance contains air that serves as a dielectric to increase the impedance between adjacent signal holes, and thereby to reduce crosstalk and other problems associated with close proximity between signal holes. Additional through holes provide additional impedance at locations between adjacent conductor through holes. Such additional through holes for impedance control can be included in the circuit boards as well as the backplane. | 08-13-2009 |
20090203263 | Interconnection assembly for printed circuit boards - An apparatus electrically interconnects pins that project from the rear side of a backplane in separate arrays corresponding to respective circuit boards at the front side of the backplane. The apparatus comprises a connector board assembly extending across the rear side of the backplane between separate arrays of pins. The connector board assembly has signal routing circuitry that electrically interconnects those separate arrays of pins. This enables the respective printed circuit boards to be electrically interconnected independently of any signal routing circuitry within the structure of the backplane. Accordingly, the apparatus preferably includes a backplane that is free of signal routing circuitry for interconnecting pins that extend through the backplane. | 08-13-2009 |
20100099306 | INTERCONNECTION ASSEMBLY FOR PRINTED CIRCUIT BOARDS - An apparatus electrically interconnects pins that project from the rear side of a backplane in separate arrays corresponding to respective circuit boards at the front side of the backplane. The apparatus comprises a connector board assembly extending across the rear side of the backplane between separate arrays of pins. The connector board assembly has signal routing circuitry that electrically interconnects those separate arrays of pins. This enables the respective printed circuit boards to be electrically interconnected independently of any signal routing circuitry within the structure of the backplane. Accordingly, the apparatus preferably includes a backplane that is free of signal routing circuitry for interconnecting pins that extend through the backplane. | 04-22-2010 |
20110076897 | High Density Connector and Method of Manufacture - Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side of the into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portion of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the housing, thereby reducing warpage. Solder resist areas are formed on central portions of the contacts to promote uniformity of solder volume. As a result of these features, substantial coplanarity of the BGA array along the mounting interface of the connector is achieved. | 03-31-2011 |
20130034978 | Crosstalk Reduction - An apparatus includes a backplane having a ground plane. Conductor through holes extend through the backplane in rows and columns for conductors to project through the backplane in orthogonal arrays. Each row and column of the conductor through holes includes ground holes, each of which is sized to receive only a single ground conductor, with the single ground conductor in connection with the ground plane. Each row and column of the conductor through holes also includes signal holes, each of which is sized to receive only a single signal conductor, with the single signal conductor free of a connection with the ground plane. The backplane further has a plurality of nonconductor through holes at locations between and offset from the rows and columns of conductor through holes, with each of the plurality of nonconductor through holes having plating electrically connected to the ground plane. | 02-07-2013 |