Tien-Szu Chen
Tien-Szu Chen, Guanyin Shiang TW
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20100068886 | METHOD OF FABRICATING A DIFFERENTIAL DOPED SOLAR CELL - A method of fabricating a differential doped solar cell is described. The method includes the following steps. First, a substrate is provided. A doping process is conducted thereon to form a doped layer. A heavy doping portion of the doped layer is partially or fully removed. Subsequently, an anti-reflection coating layer is formed thereon. A metal conducting paste is printed on the anti-reflection coating layer and is fired to form the metal electrodes for the solar cell. | 03-18-2010 |
20100071754 | STRUCTURE OF SOLAR CELL PANEL AND MANUFACTURING METHOD OF ELECTRODE OF SOLAR CELL PANEL - A manufacturing method of electrode of solar cell panel of the present invention comprises steps of providing a semiconductor substrate with an antireflection layer/a dielectric layer and a first metal layer in sequence, forming a first metal layer on the antireflection layer, projecting a pattern on the first metal layer by a laser beam to form a metal silicide on the semiconductor substrate in accordance with the outline of the pattern, removing the first metal layer by a chosen solution, forming a first electrode connecting to the metal silicide and exposed to a surface of the antireflection layer; and forming a second electrode on a surface of the semiconductor substrate opposite to the antireflection layer. | 03-25-2010 |
Tien-Szu Chen, Jhunan Township TW
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20100068848 | ONE-STEP DIFFUSION METHOD FOR FABRICATING A DIFFERENTIAL DOPED SOLAR CELL - A one-step diffusion method for fabricating a differential doped solar cell is described. The one-step diffusion method includes the following step. First, a substrate is provided. A doping control layer is formed on the substrate. The doping control layer includes a plurality of openings therein. A doping process is conducted on the substrate to form heavy doping regions under the openings of the doping control layer and light doping regions on the other portion of the substrate | 03-18-2010 |
20110240339 | CONDUCTIVE CHANNEL OF PHOTOVOLTAIC PANEL AND METHOD FOR MANUFACTURING THE SAME - An electrically conductive ribbon, which is soldered on an electrically conductive busbar of a photovoltaic panel, includes a cooper core and a tin based solder. The tin based solder fully wraps an outer surface of the cooper core, and has a convex solder surface, which has a first curvature to be fitted with a second curvature of a concave solder surface of the electrically conductive busbar. | 10-06-2011 |
20120276686 | CONDUCTIVE CHANNEL OF PHOTOVOLTAIC PANEL AND METHOD FOR MANUFACTURING THE SAME - An electrically conductive ribbon, which is soldered on an electrically conductive busbar of a photovoltaic panel, includes a cooper core and a tin based solder. The tin based solder fully wraps an outer surface of the cooper core, and has a convex solder surface, which has a first curvature to be fitted with a second curvature of a concave solder surface of the electrically conductive busbar. | 11-01-2012 |
20130056055 | SOLAR ENERGY CELL - A solar energy cell includes a photoelectric conversion layer, an anti-reflection layer and a plurality of electrical conductive channels. The anti-reflection layer is disposed on the photoelectric conversion layer. The electrical conductive channels are disposed on the anti-reflection layer and electrically connected with the photoelectric conversion layer, wherein the electrical conductive channels include a conductive paste and pigments to enable a color thereof to be substantially the same as a color of the anti-reflection layer. | 03-07-2013 |
Tien-Szu Chen, Taoyuan City TW
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20140084475 | SEMICONDUCTOR PACKAGE SUBSTRATES HAVING PILLARS AND RELATED METHODS - The substrate includes a first dielectric layer, a first circuit pattern, a plurality of pillars and a second circuit pattern. The first dielectric layer has opposing first and second dielectric surfaces. The first circuit pattern is embedded in the first dielectric layer and defines a plurality of curved trace surfaces. Each of the pillars has an exterior surface adapted for making external electrical connection and a curved base surface abutting a corresponding one of the trace surfaces. The second circuit pattern is on the second dielectric surface of the first dielectric layer and electrically connected to the first circuit pattern. | 03-27-2014 |
Tien-Szu Chen, Zhongli City TW
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20150021766 | SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND PROCESS FOR MANUFACTURING - A semiconductor package substrate includes a core portion, an upper circuit layer and a plurality of pillars. The pillars are disposed on and project upward from the upper circuit layer. Top surfaces of the pillars are substantially coplanar. The pillars provide an electrical interconnect to a semiconductor die. Solder joint reliability as between the substrate and the semiconductor die is improved. | 01-22-2015 |
Tien-Szu Chen, Kaohsiung TW
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20140327125 | SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A semiconductor package structure and a fabrication method thereof are provided. The fabrication method comprises: providing a substrate strip, the substrate strip comprising a plurality of substrate units; disposing a plurality of chips on the plurality of substrate units; disposing a packaging encapsulant on the substrate strip to encapsulate the chips; forming a warp-resistant layer on a top surface of the packaging encapsulant; and dividing the substrate strip to separate the plurality of substrate units to further fabricate a plurality of semiconductor package structures, wherein the warp-resistant layer is formed of a selected material with a selected thickness to make a variation of warpage of the semiconductor package structure at a temperature between 25° C. and 260° C. to be smaller than 560 μm. | 11-06-2014 |