Patent application number | Description | Published |
20080264568 | GREENSHEET VIA REPAIR/FILL TOOL - A method and apparatus are provided for filling vias in a product greensheet and/or repairing vias in a product greensheet. The method and apparatus utilize a transfer greensheet having filled vias in a fixed array, which vias are punched into the product greensheet to either repair or fill the via of the product greensheet. The method and apparatus employ position determining means such as a camera, a punch head and a corresponding punch die and an activating means to activate the punch head to punch the transfer greensheet via to fill the product greensheet via. The transfer greensheet has a fixed array of filled vias and a transfer greensheet station employs a fixed plate having a plurality of vacuum ports positioned in the non-via areas of the transfer greensheet which secures the transfer greensheet during the method. The product greensheet is held by a vacuum plate. | 10-30-2008 |
20090008020 | GREENSHEET VIA REPAIR/FILL TOOL - A method and apparatus are provided for filling vias in a product greensheet and/or repairing vias in a product greensheet. The method and apparatus utilize a transfer greensheet having filled vias in a fixed array, which vias are punched into the product greensheet to either repair or fill the via of the product greensheet. The method and apparatus employ position determining means such as a camera, a punch head and a corresponding punch die and an activating means to activate the punch head to punch the transfer greensheet via to fill the product greensheet via. The transfer greensheet has a fixed array of filled vias and a transfer greensheet station employs a fixed plate having a plurality of vacuum ports positioned in the non-via areas of the transfer greensheet which secures the transfer greensheet during the method. The product greensheet is held by a vacuum plate. | 01-08-2009 |
20090242614 | METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD - A tool and method is provided for repositioning a solder injection head. The tool includes a first moveable platform positioned on a first side of a workpiece chuck and a second moveable platform positioned on a second side of the workpiece chuck. A solder injection head has a seal configured to seal molten solder within the solder injection head when contacting a surface of the first moveable platform or the second moveable platform. The method includes moving a workpiece chuck and a starting platform to a position such that the starting platform is at a finishing position and a finishing platform is in a starting position. | 10-01-2009 |
20100084437 | Dispensing Assembly with a Controlled Gas Environment - Techniques for dispensing fusible material onto a surface, wherein the fusible material is in molten form, are provided. In accordance with aspects of the invention, a dispensing assembly dispenses the fusible material and a gas environment surrounding a portion of a seal structure of the dispensing assembly is controlled to regulate an oxidation rate of the fusible material. | 04-08-2010 |
20100084438 | Dispensing Assembly with an Injector Controlled Gas Environment - An apparatus for dispensing fusible material onto a surface, wherein the fusible material is in molten form, is provided. The apparatus comprises a dispensing assembly comprising a seal structure. The seal structure controls dispensing of the fusible material. One or more gas injectors are coupled to the dispensing assembly. Each of the one or more gas injectors is adapted to inject at least one gas to the dispensing assembly for controlling a gas environment surrounding at least a portion of the seal structure. An oxidation rate of the fusible material is controlled as a function of at least one characteristic of the at least one gas. | 04-08-2010 |
20100200197 | LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD - A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink. | 08-12-2010 |
20130320069 | METHOD FOR SHAPING A LAMINATE SUBSTRATE - A method for shaping a laminate substrate includes characterizing the laminate substrate for warpage characteristics. The laminate substrate is placed into a fixture with a correction to shape the laminate substrate based on the warpage characteristics. The laminate substrate is fluxed. A chip is placed onto the laminate substrate. The fixture is placed into a reflow furnace to join the chip and the laminate substrate. The fixture is removed from the reflow furnace. A warpage measurement is performed on the joined chip and laminate substrate. The correction may be modified if shorts are observed at the chip site. | 12-05-2013 |
20130323345 | FIXTURE FOR SHAPING A LAMINATE SUBSTRATE - A fixture for shaping a laminate substrate includes a trap ring, a base plate and a center button. The base plate includes a recess adapted to receive the laminate substrate. The center button is disposed in an opening in the base plate. The center button may be adjusted to shape the laminate substrate. | 12-05-2013 |
20140239569 | UNIVERSAL CLAMPING FIXTURE TO MAINTAIN LAMINATE FLATNESS DURING CHIP JOIN - A clamping apparatus and method for maintaining a workpiece flatness during processing includes a base having a planar surface for receiving a first workpiece. Two sets of opposing clamping mechanisms are mounted to the base and include a clamp head at a distal end of a rod extending from a housing in removable overlapping relation to the first workpiece. Each set of the clamp heads are in opposing spaced relationship to each other defining a second workpiece area, and the clamp heads are configured to mate with a top surface of the first workpiece. A biasing member is coupled to each of the housings and apply a downward vertical force to the housings, rods, and the clamp heads for applying a downward vertical pressure to the first workpiece. The first workpiece is thereby discouraged from thermally expanding in a vertical direction and is thermally expandable horizontally along the planar surface. | 08-28-2014 |
20150014836 | Electronic Module Assembly With Patterned Adhesive Array - An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress. | 01-15-2015 |
20150077944 | MULTICHIP MODULE WITH STIFFENING FRAME AND ASSOCIATED COVERS - A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings. | 03-19-2015 |