Patent application number | Description | Published |
20090250249 | INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME - Electronic modules and interposers are formed by encapsulating microelectronic dies and/or posts within cavities in a substrate. | 10-08-2009 |
20090250823 | Electronic Modules and Methods for Forming the Same - Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate. | 10-08-2009 |
20100206216 | Method of Producing High Quality Relaxed Silicon Germanium Layers - A method for minimizing particle generation during deposition of a graded Si.sub.1-xGe.sub.x layer on a semiconductor material includes providing a substrate in an atmosphere including a Si precursor and a Ge precursor, wherein the Ge precursor has a decomposition temperature greater than germane, and depositing the graded Si.sub.1-xGe.sub.x layer having a final Ge content of greater than about 0.15 and a particle density of less than about 0.3 particles/cm.sup.2 on the substrate. | 08-19-2010 |
20110049568 | Lattice-Mismatched Semiconductor Structures with Reduced Dislocation Defect Densities and Related Methods for Device Fabrication - Fabrication of monolithic lattice-mismatched semiconductor heterostructures with limited area regions having upper portions substantially exhausted of threading dislocations, as well as fabrication of semiconductor devices based on such lattice-mismatched heterostructures. | 03-03-2011 |
20110073908 | III-V Semiconductor Device Structures - The benefits of strained semiconductors are combined with silicon-on-insulator approaches to substrate and device fabrication. | 03-31-2011 |
20110177681 | Method of Producing High Quality Relaxed Silicon Germanium Layers - A method for minimizing particle generation during deposition of a graded Si | 07-21-2011 |
20110260800 | DEVICES, SYSTEMS, AND METHODS FOR CONTROLLING THE TEMPERATURE OF RESONANT ELEMENTS - A thermoelectric device transfers heat away from or toward an object using the Peltier effect. In some embodiments, the length of at least one thermoelectric element is at least ten times greater than a combined average cross-sectional dimension, orthogonal to the length, of two thermoelectric elements. | 10-27-2011 |
20110309528 | Electronic Modules and Methods for Forming the Same - Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate. | 12-22-2011 |
20110318893 | METHODS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURES - The benefits of strained semiconductors are combined with silicon-on-insulator approaches to substrate and device fabrication. | 12-29-2011 |
20120086135 | INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME - In various embodiments, an electronic module features a first cavity in a first side of a substrate, a fill hole extending from the first cavity, and a second cavity in a second side of the substrate. The second cavity is in fluidic communication with the fill hole, and a die is encapsulated within the second cavity. | 04-12-2012 |
20120299662 | DEVICES, SYSTEMS, AND METHODS FOR CONTROLLING THE TEMPERATURE OF RESONANT ELEMENTS - A thermoelectric device transfers heat away from or toward an object using the Peltier effect. In some embodiments, the length of at least one thermoelectric element is at least ten times greater than a combined average cross-sectional dimension, orthogonal to the length, of two thermoelectric elements. | 11-29-2012 |
20130105860 | Lattice-Mismatched Semiconductor Structures with Reduced Dislocation Defect Densities and Related Methods for Device Fabrication | 05-02-2013 |
20130329376 | ELECTRONIC MODULES - Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate. | 12-12-2013 |
20140051230 | Methods for Forming Semiconductor Device Structures - The benefits of strained semiconductors are combined with silicon-on-insulator approaches to substrate and device fabrication. | 02-20-2014 |
20140106546 | Lattice-Mismatched Semiconductor Structures with Reduced Dislocation Defect Densities and Related Methods for Device Fabrication - Fabrication of monolithic lattice-mismatched semiconductor heterostructures with limited area regions having upper portions substantially exhausted of threading dislocations, as well as fabrication of semiconductor devices based on such lattice-mismatched heterostructures. | 04-17-2014 |
20140242778 | Methods of Forming Strained-Semiconductor-on-Insulator Device Structures - The benefits of strained semiconductors are combined with silicon-on-insulator approaches to substrate and device fabrication. | 08-28-2014 |
20140374327 | METHOD AND APPARATUS FOR POINT OF USE WATER FILTRATION - An apparatus for water filtration includes a base a filtration receptacle coupled to the base and a carafe removably coupled to the base. The filtration receptacle includes a water inlet and a water outlet. The filtration receptacle includes a pleated filter positioned between the water inlet and the water outlet. The pleated filter has a pleat face characterized by a surface having a plurality of peaks and a plurality of valleys, such that the surface is disposed in a plurality of planes. The filtration receptacle is structurally configured to maintain the pleated filter in an orientation wherein the pleat face of the pleated filter transverses a water-flow path extending from the water inlet to the water outlet. The filtration receptacle is further configured to induce water-flow along the water-flow path by at least one of a receptacle orientation and a receptacle geometry. The carafe includes an inlet coupled to the water outlet in the filtration receptacle. | 12-25-2014 |
20140374798 | Lattice-Mismatched Semiconductor Structures with Reduced Dislocation Defect Densities and Related Methods for Device Fabrication - Fabrication of monolithic lattice-mismatched semiconductor heterostructures with limited area regions having upper portions substantially exhausted of threading dislocations, as well as fabrication of semiconductor devices based on such lattice-mismatched heterostructures. | 12-25-2014 |