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| 20130197693 | System, Method, and Apparatus for Dispensing Oral Medications - A pill dispenser includes a housing, a pill-dispensing mechanism, a receptacle, a pill-viewing camera, an identifying camera, one or more processors, and a storage medium (e.g., a memory). The pill-dispensing mechanism is coupled to an opening of the housing. The first pill-viewing camera is positioned to capture an image of the receptacle, and the identifying camera is positioned to capture an image of an area adjacent to the housing. The one or more processors are in operative communication with the pill-dispensing mechanism, the pill-viewing camera, and the identifying camera. The storage medium stores processor-executable instructions for: instructing the pill-dispensing mechanism to dispense a pill; instructing the pill-viewing camera to capture a first image of the pill to determine a presence of the pill; instructing the pill-viewing camera to capture a second image to determine an absence of the pill; and instructing the identifying camera to capture a third image. | 08-01-2013 |
| 20140209121 | APPARATUS AND METHOD FOR CLEANING OBJECTS - A container is disclosed. The container includes a top portion and a bottom portion, both including a mesh portion, at least one hinging feature attached to the bottom portion, wherein the at least one hinging feature hingably attaches the top portion to the bottom portion, wherein the top portion and the bottom portion having an open configuration and a closed configuration and wherein the top portion and the bottom portion, when in the closed configuration, forming an inner portion, also a latching mechanism wherein when the latching mechanism is in a locked position the top portion and bottom portion are locked into the closed configuration, also at least one spring holder attached to the at least one hinging feature and located within the inner portion wherein when the top portion and bottom portion move from the closed position to the open position, the at least one spring holder lifts upwards. | 07-31-2014 |
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| 20090321039 | TELECOM SHELTER COOLING AND CONTROL SYSTEM - A system configured to provide cooling of electronic equipment in a shelter in combination with an air conditioning (A/C) system. The system includes one or more blowers for drawing air into the shelter, a damper arrangement for controlling air exhaust. The system further includes a DC powered controller coupled to the one or more blowers, the damper arrangement, and the A/C system. The controller is configured to receive at least a first analog input signal associated with a shelter-interior temperature, a second analog input signal associated with a shelter-exterior temperature, and a plurality of alarm input signals and to generate the one or more first control signals to control blower rotational speed, the second control signal to open/close the damper arrangement, and a third control signal to inhibit/activate the A/C system based on at least the first analog input signal, or the second analog input signal, or a plurality of alarm input signals, or a combination of these. | 12-31-2009 |
| 20130032638 | Telecom Shelter Cooling and Control System - A system configured to provide cooling of electronic equipment in a shelter in combination with an air conditioning (A/C) system. The system includes one or more blowers fur drawing air into the shelter, a damper arrangement for controlling air exhaust. The system further includes a DC powered controller coupled to the one or more blowers, the damper arrangement, and the A/C system. The controller is configured to receive at least a first analog input signal associated with a shelter-interior temperature, a second analog input signal associated with a shelter-exterior temperature, and a plurality of alarm input signals and to generate the one or more first control signals to control blower rotational speed, the second control signal to open/close the damper arrangement, and a third control signal to inhibit/activate the A/C system based on at least the first analog input signal, or the second analog input signal, or a plurality of alarm input signals, or a combination of these. | 02-07-2013 |
| 20130035031 | Telecom Shelter Cooling and Control System - A system configured to provide cooling of electronic equipment in a shelter in combination with an air conditioning (A/C) system. The system includes one or more blowers for drawing air into the shelter, a damper arrangement for controlling air exhaust. The system further includes a DC powered controller coupled to the one or more blowers, the damper arrangement, and the A/C system. The controller is configured to receive at least a first analog input signal associated with a shelter-interior temperature, a second analog input signal associated with a shelter-exterior temperature, and a plurality of alarm input signals and to generate the one or more first control signals to control blower rotational speed, the second control signal to open/close the damper arrangement, and a third control signal to inhibit/activate the A/C system based on at least the first analog input signal, or the second analog input signal, or a plurality of alarm input signals, or a combination of these. | 02-07-2013 |
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| 20100306412 | Method and apparatus for content-aware and adaptive deduplication - A method, a system, an apparatus, and a computer readable medium for transmission of data across a network are disclosed. The method includes receiving a data stream, analyzing the received data stream to determine a starting location and an ending location of each zone within the received data stream, based on the starting and ending locations, generating a zone stamp identifying the zone, the zone stamp includes a sequence of contiguous characters representing at least a portion of data in the zone, wherein the order of characters in the zone stamp corresponds to the order of data in the zone, comparing the zone stamp with another zone stamp of another zone in any data stream received, determining whether the zone is substantially similar to another zone by detecting that the zone stamp is substantially similar to another zone stamp, delta-compressing zones within any data stream received that have been determined to have substantially similar zone stamps, thereby deduplicating zones having substantially similar zone stamps within any data stream received, and transmitting the deduplicated zones across the network from one storage location to another storage location. | 12-02-2010 |
| 20130290474 | Method And Apparatus For Content-Aware And Adaptive Deduplication - A method, a system, an apparatus, and a computer readable medium for transmission of data across a network are disclosed. The method includes receiving a data stream, analyzing the received data stream to determine a starting location and an ending location of each zone within the received data stream, based on the starting and ending locations, generating a zone stamp identifying the zone, the zone stamp includes a sequence of contiguous characters representing at least a portion of data in the zone, wherein the order of characters in the zone stamp corresponds to the order of data in the zone, comparing the zone stamp with another zone stamp of another zone in any data stream received, determining whether the zone is substantially similar to another zone by detecting that the zone stamp is substantially similar to another zone stamp, delta-compressing zones within any data stream received that have been determined to have substantially similar zone stamps, thereby deduplicating zones having substantially similar zone stamps within any data stream received, and transmitting the deduplicated zones across the network from one storage location to another storage location. | 10-31-2013 |
| 20140052700 | Delta Version Clustering and Re-Anchoring - A system, a method, and a computer program product for delta version clustering and re-anchoring are provided. A first anchor having a plurality of delta-compressed versions of data dependent on the first anchor is generated. The first anchor and the plurality of delta-compressed versions form a cluster. A second anchor is generated. The first anchor is replaced with the second anchor. The replacing includes re-computing at least one delta-compressed version in the plurality of delta-compressed versions to be dependent on the second anchor. The second anchor replaces the first anchor as an anchor of the cluster. | 02-20-2014 |
| 20140143219 | ADAPTIVE SCHEDULED PERIODIC CACHING - A system, a method, and a computer program product for adaptive scheduled periodic caching are disclosed. A data stream is received. The data stream contains a plurality of versions of data arranged in a plurality of data clusters. Each data cluster includes an anchor version having a plurality of versions of data dependent on the anchor version. A size of each anchor version of each data cluster is determined. A number of versions of data dependent on each anchor version is also determined. For each anchor version, a ratio of the determined number of dependent versions of data to the determined size of each anchor is computed. At least one anchor version for storing in a memory location is selected based on the computed ratio. | 05-22-2014 |
| 20140337299 | Method And Apparatus For Content-Aware And Adaptive Deduplication - A method, a system, an apparatus, and a computer readable medium for transmission of data across a network are disclosed. The method includes receiving a data stream, analyzing the received data stream to determine a starting location and an ending location of each zone within the received data stream, based on the starting and ending locations, generating a zone stamp identifying the zone, the zone stamp includes a sequence of contiguous characters representing at least a portion of data in the zone, wherein the order of characters in the zone stamp corresponds to the order of data in the zone, comparing the zone stamp with another zone stamp of another zone in any data stream received, determining whether the zone is substantially similar to another zone by detecting that the zone stamp is substantially similar to another zone stamp, delta-compressing zones within any data stream received that have been determined to have substantially similar zone stamps, thereby deduplicating zones having substantially similar zone stamps within any data stream received, and transmitting the deduplicated zones across the network from one storage location to another storage location. | 11-13-2014 |
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| 20120311813 | Robotic Vacuum - An autonomous mobile robot comprise: a chassis having a drive system in communication with a control system; a cleaning head assembly having a lower cage and mounted to the chassis; a debris collection bin mounted to the chassis; a vacuum airway having a vacuum inlet and an airway outlet positioned adjacent the debris collection bin, and configured to deliver debris from the cleaning head assembly to a debris collection bin, the vacuum airway extending between the cleaning assembly and debris collection bin and being in fluid communication with an impeller disposed within the debris collection bin; and a cleaning head module connected to the chassis and having a front roller including a front shape-changing resilient tube and an adjacent rear roller including a rear shape-changing resilient tube rotatably opposing therewith beneath the vacuum inlet. | 12-13-2012 |
| 20120317744 | Robotic Vacuum - An autonomous coverage robot includes a chassis having forward and rearward portions. A drive system is mounted to the chassis and configured to maneuver the robot over a cleaning surface. A cleaning assembly is mounted on the forward portion of the chassis and has two counter-rotating rollers mounted therein for retrieving debris from the cleaning surface, the longitudinal axis of the forward roller lying in a first horizontal plane positioned above a second horizontal plane on which the longitudinal axis of the rearward roller lies. The cleaning assembly is movably mounted to the chassis by a linkage affixed at a forward end to the chassis and at a rearward end to the cleaning assembly. When the robot transitions from a firm surface to a compressible surface, the linkage lifts the cleaning assembly from the cleaning surface. | 12-20-2012 |
| 20140289983 | Robotic Vacuum Cleaning System - An autonomous coverage robot includes a cleaning assembly having forward roller and rearward rollers counter-rotating with respect to each other. The rollers are arranged to substantially maintain a cross sectional area between the two rollers yet permitting collapsing therebetween as large debris is passed. Each roller includes a resilient elastomer outer tube and a partially air-occupied inner resilient core configured to bias the outer tube to rebound. The core includes a hub and resilient spokes extending between the inner surface of the outer tube and the hub. The spokes suspend the outer tube to float about the hub and transfer torque from the hub to the outer tube while allowing the outer tube to momentarily deform or move offset from the hub during impact with debris larger than the cross sectional area between the two rollers. | 10-02-2014 |
| 20140289999 | Robotic Vacuum Cleaning System - A robot cleaning system includes a debris collection volume, a vacuum airway configured to deliver debris to the debris collection volume, and a cleaning head in pneumatic communication with the vacuum airway. The cleaning head includes two shape-changing resilient tubes separated by an air gap opposing the vacuum airway. The cleaning head is operable in a first configuration, where the two shape-changing resilient tubes rotate against a cleaning surface engaged by the cleaning head to agitate debris on the cleaning surface to pass through the air gap and into the vacuum airway, and a second configuration, where both shape changing resilient tubes deform opposite one another to roll an object larger than the air gap to pass into the vacuum airway. | 10-02-2014 |
| 20150107037 | Robotic Vacuum Cleaning System - An autonomous coverage robot includes a cleaning assembly having forward roller and rearward rollers counter-rotating with respect to each other. The rollers are arranged to substantially maintain a cross sectional area between the two rollers yet permitting collapsing therebetween as large debris is passed. Each roller includes a resilient elastomer outer tube and a partially air-occupied inner resilient core configured to bias the outer tube to rebound. The core includes a hub and resilient spokes extending between the inner surface of the outer tube and the hub. The spokes suspend the outer tube to float about the hub and transfer torque from the hub to the outer tube while allowing the outer tube to momentarily deform or move offset from the hub during impact with debris larger than the cross sectional area between the two rollers. | 04-23-2015 |
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| 20080246058 | GALLIUM NITRIDE MATERIAL TRANSISTORS AND METHODS ASSOCIATED WITH THE SAME - Gallium nitride material transistors and methods associated with the same are provided. The transistors may be used in power applications by amplifying an input signal to produce an output signal having increased power. The transistors may be designed to transmit the majority of the output signal within a specific transmission channel (defined in terms of frequency), while minimizing transmission in adjacent channels. This ability gives the transistors excellent linearity which results in high signal quality and limits errors in transmitted data. The transistors may be designed to achieve low ACPR values (a measure of excellent linearity), while still operating at high drain efficiencies and/or high output powers. Such properties enable the transistors to be used in RF power applications including third generation (3G) power applications based on W-CDMA modulation. | 10-09-2008 |
| 20090109646 | PACKAGED GALLIUM NITRIDE MATERIAL TRANSISTORS AND METHODS ASSOCIATED WITH THE SAME - The invention provides semiconductor material (e.g., gallium nitride material) devices (e.g., transistors) and methods associated with the same. The devices may be supported within a package that is formed, in part, of a polymeric material. In other embodiments, the devices may be mounted to a support (e.g., circuit board) and a polymeric material may encapsulate a portion of the device extending from the support. | 04-30-2009 |
| 20100019248 | GALLIUM NITRIDE MATERIAL DEVICES INCLUDING CONDUCTIVE REGIONS AND METHODS ASSOCIATED WITH THE SAME - Semiconductor structures comprising a III-nitride (e.g., gallium nitride) material region and methods associated with such structures are provided. In some embodiments, the structures include an electrically conductive material (e.g., gold) separated from certain other region(s) of the structure (e.g., a silicon substrate) by a barrier material in order to limit, or prevent, undesirable reactions between the electrically conductive material and the other component(s) which can impair device performance. In certain embodiments, the electrically conductive material may be formed in a via. For example, the via can extend from a topside of the device to a backside so that the electrically conductive material connects a topside contact to a backside contact. The structures described herein may form the basis of a number of semiconductor devices including transistors (e.g., FET), Schottky diodes, light-emitting diodes and laser diodes, amongst others. | 01-28-2010 |
| 20100019850 | GALLIUM NITRIDE MATERIAL TRANSISTORS AND METHODS ASSOCIATED WITH THE SAME - Gallium nitride material transistors and methods associated with the same are provided. The transistors may be used in power applications by amplifying an input signal to produce an output signal having increased power. The transistors may be designed to transmit the majority of the output signal within a specific transmission channel (defined in terms of frequency), while minimizing transmission in adjacent channels. This ability gives the transistors excellent linearity which results in high signal quality and limits errors in transmitted data. The transistors may be designed to achieve low ACPR values (a measure of excellent linearity), while still operating at high drain efficiencies and/or high output powers. Such properties enable the transistors to be used in RF power applications including third generation (3G) power applications based on W-CDMA modulation. | 01-28-2010 |
| 20120068190 | Gallium Nitride Devices with Electrically Conductive Regions - Semiconductor structures comprising a III-nitride (e.g., gallium nitride) material region and methods associated with such structures are provided. In some embodiments, the structures include an electrically conductive material (e.g., gold) separated from certain other region(s) of the structure (e.g., a silicon substrate) by a barrier material in order to limit, or prevent, undesirable reactions between the electrically conductive material and the other component(s) which can impair device performance. In certain embodiments, the electrically conductive material may be formed in a via. For example, the via can extend from a topside of the device to a backside so that the electrically conductive material connects a topside contact to a backside contact. The structures described herein may form the basis of a number of semiconductor devices including transistors (e.g., PET), Schottky diodes, light-emitting diodes and laser diodes, amongst others. | 03-22-2012 |
| 20120070967 | Method for Forming Gallium Nitride Devices with Conductive Regions - Semiconductor structures comprising a III-nitride (e.g., gallium nitride) material region and methods associated with such structures are provided. In some embodiments, the structures include an electrically conductive material (e.g., gold) separated from certain other region(s) of the structure (e.g., a silicon substrate) by a barrier material in order to limit, or prevent, undesirable reactions between the electrically conductive material and the other component(s) which can impair device performance. In certain embodiments, the electrically conductive material may be formed in a via. For example, the via can extend from a topside of the device to a backside so that the electrically conductive material connects a topside contact to a backside contact. The structures described herein may form the basis of a number of semiconductor devices including transistors (e.g., FET), Schottky diodes, light-emitting diodes and laser diodes, amongst others. | 03-22-2012 |
| 20130126895 | Gallium Nitride Devices with Vias - Semiconductor structures comprising a III-nitride (e.g., gallium nitride) material region and methods associated with such structures are provided. In some embodiments, the structures include an electrically conductive material (e.g., gold) separated from certain other region(s) of the structure (e.g., a silicon substrate) by a barrier material in order to limit, or prevent, undesirable reactions between the electrically conductive material and the other component(s) which can impair device performance. In certain embodiments, the electrically conductive material may be formed in a via. For example, the via can extend from a topside of the device to a backside so that the electrically conductive material connects a topside contact to a backside contact. The structures described herein may form the basis of a number of semiconductor devices including transistors (e.g., FET), Schottky diodes, light-emitting diodes and laser diodes, amongst others. | 05-23-2013 |
| 20130134437 | METHOD FOR FORMING GALLIUM NITRIDE DEVICES WITH CONDUCTIVE REGIONS - Semiconductor structures comprising a III-nitride (e.g., gallium nitride) material region and methods associated with such structures are provided. In some embodiments, the structures include an electrically conductive material (e.g., gold) separated from certain other region(s) of the structure (e.g., a silicon substrate) by a barrier material in order to limit, or prevent, undesirable reactions between the electrically conductive material and the other component(s) which can impair device performance. In certain embodiments, the electrically conductive material may be formed in a via. For example, the via can extend from a topside of the device to a backside so that the electrically conductive material connects a topside contact to a backside contact. The structures described herein may form the basis of a number of semiconductor devices including transistors (e.g., FET), Schottky diodes, light-emitting diodes and laser diodes, amongst others. | 05-30-2013 |
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| 20140203294 | Gallium Nitride Devices - Semiconductor structures comprising a III-nitride (e.g., gallium nitride) material region and methods associated with such structures are provided. In some embodiments, the structures include an electrically conductive material (e.g., gold) separated from certain other region(s) of the structure (e.g., a silicon substrate) by a barrier material in order to limit, or prevent, undesirable reactions between the electrically conductive material and the other component(s) which can impair device performance. In certain embodiments, the electrically conductive material may be formed in a via. For example, the via can extend from a topside of the device to a backside so that the electrically conductive material connects a topside contact to a backside contact. The structures described herein may form the basis of a number of semiconductor devices including transistors (e.g., FET), Schottky diodes, light-emitting diodes and laser diodes, amongst others. | 07-24-2014 |
| 20150137141 | Gallium Nitride Devices - Semiconductor structures comprising a III-nitride (e.g., gallium nitride) material region and methods associated with such structures are provided. In some embodiments, the structures include an electrically conductive material (e.g., gold) separated from certain other region(s) of the structure (e.g., a silicon substrate) by a barrier material in order to limit, or prevent, undesirable reactions between the electrically conductive material and the other component(s) which can impair device performance. In certain embodiments, the electrically conductive material may be formed in a via. For example, the via can extend from a topside of the device to a backside so that the electrically conductive material connects a topside contact to a backside contact. The structures described herein may form the basis of a number of semiconductor devices including transistors (e.g., FET), Schottky diodes, light-emitting diodes and laser diodes, amongst others. | 05-21-2015 |
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| 20120216848 | THIN-FILM HETEROSTRUCTURE THERMOELECTRICS IN A GROUP IIA AND IV-VI MATERIALS SYSTEM - Embodiments of a thin-film heterostructure thermoelectric material and methods of fabrication thereof are disclosed. In general, the thermoelectric material is formed in a Group IIa and IV-VI materials system. The thermoelectric material includes an epitaxial heterostructure and exhibits high heat pumping and figure-of-merit performance in terms of Seebeck coefficient, electrical conductivity, and thermal conductivity over broad temperature ranges through appropriate engineering and judicious optimization of the epitaxial heterostructure. | 08-30-2012 |
| 20120217548 | THIN-FILM HETEROSTRUCTURE THERMOELECTRICS IN A GROUP IIA AND IV-VI MATERIALS SYSTEM - Embodiments of a thin-film heterostructure thermoelectric material and methods of fabrication thereof are disclosed. In general, the thermoelectric material is formed in a Group IIa and IV-VI materials system. The thermoelectric material includes an epitaxial heterostructure and exhibits high heat pumping and figure-of-merit performance in terms of Seebeck coefficient, electrical conductivity, and thermal conductivity over broad temperature ranges through appropriate engineering and judicious optimization of the epitaxial heterostructure. | 08-30-2012 |
| 20130069110 | LOW RESISTIVITY CONTACT - Embodiments of a low resistivity contact to a semiconductor structure are disclosed. In one embodiment, a semiconductor structure includes a semiconductor layer, a semiconductor contact layer having a low bandgap on a surface of the semiconductor layer, and an electrode on a surface of the semiconductor contact layer opposite the semiconductor layer. The bandgap of the semiconductor contact layer is in a range of and including 0 to 0.2 electron-volts (eV), more preferably in a range of and including 0 to 0.1 eV, even more preferably in a range of and including 0 to 0.05 eV. Preferably, the semiconductor layer is p-type. In one particular embodiment, the semiconductor contact layer and the electrode form an ohmic contact to the p-type semiconductor layer and, as a result of the low bandgap of the semiconductor contact layer, the ohmic contact has a resistivity that is less than 1×10 | 03-21-2013 |
| 20130291555 | THERMOELECTRIC REFRIGERATION SYSTEM CONTROL SCHEME FOR HIGH EFFICIENCY PERFORMANCE - Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s). | 11-07-2013 |
| 20130291556 | SYSTEMS AND METHODS TO MITIGATE HEAT LEAK BACK IN A THERMOELECTRIC REFRIGERATION SYSTEM - Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s). | 11-07-2013 |
| 20130291557 | THERMOELECTRIC REFRIGERATION SYSTEM CONTROL SCHEME FOR HIGH EFFICIENCY PERFORMANCE - Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s). | 11-07-2013 |
| 20130291558 | THERMOELECTRIC HEAT EXCHANGE SYSTEM COMPRISING CASCADED COLD SIDE HEAT SINKS - Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s). | 11-07-2013 |
| 20130291559 | THERMOELECTRIC HEAT EXCHANGER COMPONENT INCLUDING PROTECTIVE HEAT SPREADING LID AND OPTIMAL THERMAL INTERFACE RESISTANCE - Embodiments of a thermoelectric heat exchanger component having a heat spreading lid that optimizes thermal interface resistance between the heat spreading lid and multiple thermoelectric devices and methods of fabrication thereof are disclosed. In one embodiment, a thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a heat spreading lid over the thermoelectric devices and a thermal interface material between the thermoelectric devices and the heat spreading lid. An orientation (i.e., a tilt) of the heat spreading lid is such that a thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices. | 11-07-2013 |
| 20130291560 | CARTRIDGE FOR MULTIPLE THERMOELECTRIC MODULES - Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s). | 11-07-2013 |
| 20130291561 | PARALLEL THERMOELECTRIC HEAT EXCHANGE SYSTEMS - Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s). | 11-07-2013 |
| 20130291562 | PHYSICALLY SEPARATED HOT SIDE AND COLD SIDE HEAT SINKS IN A THERMOELECTRIC REFRIGERATION SYSTEM - Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s). | 11-07-2013 |
| 20130291563 | TWO-PHASE HEAT EXCHANGER MOUNTING - Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s). | 11-07-2013 |
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| 20090303266 | SENSING OBJECTS FOR PRINTING - A printing apparatus including a conveyor capable of moving an object in a process direction, a drop ejection device, a sensor array that substantially spans the conveyor in a cross-process direction that is perpendicular to the process direction, the sensor array being configured to detect a position of the object in the process direction and cross-process direction, and a controller configured to receive position data about the object from the sensor array and to cause the drop ejection device to deposit fluid droplets on the object based on the position of the object on the conveyor. | 12-10-2009 |
| 20090322815 | INK JETTING - Among other things, for use in ink jetting, a method includes reducing an anticipated variation in a characteristic of ink drops being jetted from an ink jet assembly, the reducing comprising causing a voltage that is applied on a jetting assembly to respond to the anticipated variation. | 12-31-2009 |
| 20090322826 | INK JETTING - Among other things, for jetting ink, a first set of orifices of an apparatus are arranged to print at a first maximum resolution along a direction different from a process direction. A second set of orifices is coupled to the first set of orifices. The second set of orifices is arranged to print at a second maximum resolution lower than the first maximum resolution along a direction different from the process direction. | 12-31-2009 |
| 20090322830 | INK DELIVERY - Among other things, an apparatus for use in ink jetting includes a reservoir system including a reservoir to contain a volume of ink to be delivered to and jetted from at least two jetting assemblies onto a substrate in an ink jetting direction. The reservoir system is located adjacent to at least two of the jetting assemblies along the ink jetting direction. | 12-31-2009 |
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| 20130063872 | INTERLOCKING UTILITY METER COVER - A utility meter cover and complementary base are disclosed, the cover including a window section and a shroud. The shroud is for covering a complementary portion of a meter base, and includes: a radially extending base portion; an axial extension extending from the base portion, the axial extension for obstructing access to the complementary portion of the meter base; and a key member extending axially from the base portion, the key member having a bidirectional tab for engaging a slot in the complementary portion of the meter base. | 03-14-2013 |
| 20130098744 | UTILITY METER SERVICE SWITCH - Systems for disconnecting and/or connecting service between a utility network and a utility meter are disclosed. In one embodiment, a switch system includes: an actuator connected to a sliding cam for moving the sliding cam between a first position and a second position, the sliding cam slidingly receiving a terminal blade of the utility meter and including a pair of camming surfaces for disengaging a pair of conductors from the terminal blade in response to being moved from the first position to the second position by the actuator. | 04-25-2013 |
| 20140097074 | UTILITY METER SERVICE SWITCH - Systems for disconnecting and/or connecting service between a utility network and a utility meter are disclosed. In one embodiment, a switch system includes: an actuator connected to a sliding cam for moving the sliding cam between a first position and a second position, the sliding cam slidingly receiving a terminal blade of the utility meter and including a pair of camming surfaces for disengaging a pair of conductors from the terminal blade in response to being moved from the first position to the second position by the actuator. | 04-10-2014 |
