Patent application number | Description | Published |
20080266033 | HIGH FREQUENCY FILTER HAVING RESONANCE PATTERN OF MICROSTRIP LINE OR STRIP LINE STRUCTURE - A resonance pattern ( | 10-30-2008 |
20080274899 | SUPERCONDUCTING DISK RESONATOR - A superconducting disk resonator is disclosed that includes a dielectric base substrate having dielectric anisotropy, a disk type superconducting resonator pattern that is formed on the dielectric base substrate with superconducting material, and a pair of signal input/output lines arranged on the dielectric base substrate and extending in a straight line towards the disk type superconducting resonator pattern. The direction of dielectric anisotropy of the dielectric base substrate is oriented at ±90 degrees with respect to an extending direction of the pair of signal input/output lines. | 11-06-2008 |
20080297284 | DUAL-MODE FILTER AND TUNING METHOD OF THE SAME - A dual-mode filter capable of providing a high degree of design freedom and/or tunability is disclosed. The dual-mode filter includes a ring resonator; an input feeder and an output feeder disposed substantially orthogonal with respect to each other and with respect to the ring resonator so as to be electromagnetically coupled to the ring resonator; and a dual-mode generating line disposed inside the ring resonator in a manner so that the dual-mode generating line does not overlap with a line extending from the input feeder or a line extending from the output feeder. | 12-04-2008 |
20090239752 | Superconducting device, fabrication method thereof, and filter adjusting method - A superconducting device comprises a dielectric substrate, and a plane-figure type resonator pattern made of a superconductive material and formed on a first face of the dielectric substrate. The resonator pattern has a notch at least a portion of which is round. | 09-24-2009 |
20100009854 | FILTER WITH DISK-SHAPED ELECTRODE PATTERN - A filter includes a dielectric substrate; an electrode layer continuously formed covering a first side of the dielectric substrate; a disk-shaped electrode pattern provided on a second side of the dielectric substrate, the disk-shaped electrode pattern and the electrode layer holding the dielectric substrate therebetween; a ground slot having an opening that is formed asymmetrically with respect to the center of a circular area included in the electrode layer and exposes the dielectric substrate, the circular area and the disk-shaped electrode pattern holding the dielectric substrate therebetween. | 01-14-2010 |
20100073146 | Method Of Controlling Communication Frequencies Of Wireless Communication System, Controller Of The System, And Wireless Communication System - The wireless communication system sets at least one of the multiple wireless frequencies as a reception frequency from the wireless tag, and controls the temperature of a superconducting filter in response to the selected reception frequency, thereby the pass band or the rejection band of the superconducting filter is controlled. | 03-25-2010 |
20100105563 | SUPERCONDUCTIVE FILTER WITH PLURALITY OF RESONATOR PATTERNS FORMED ON SURFACE OF DIELECTRIC SUBSTRATE - A superconductive filter includes a superconductive filter substrate having a dielectric substrate and a plurality of resonator patterns formed on a surface of the dielectric substrate, the plurality of resonator patterns including a superconductive material; a package accommodating the superconductive filter substrate; and an intermediate substrate disposed between an inner surface of the package and the superconductive filter substrate, and thermally coupling the package and the superconductive filter substrate wherein a difference between a degree of contraction of the intermediate substrate and the degree of contraction of the dielectric substrate is smaller than a difference between the degree of contraction of the dielectric substrate and the degree of contraction of the package, when the package, the intermediate substrate, and the dielectric substrate are cooled from room temperature to a critical temperature of the resonator patterns. | 04-29-2010 |
20110063812 | ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT - An electronic device includes a circuit board having a first electrode formed on a main surface thereof, a semiconductor device disposed toward the main surface of the circuit board, the semiconductor device having a second electrode formed on a surface thereof opposed to the main surface, and a connection member electrically connecting between the first and second electrodes. The connection member includes a hollow cylindrical member and a conductive member disposed within the hollow cylindrical member. | 03-17-2011 |
20110147918 | ELECTRONIC DEVICE AND METHOD OF PRODUCING THE SAME - An electronic device includes a wiring board; a semiconductor device arranged at an upper side of the wiring board with an electrically conductive member being arranged therebetween; a covering member arranged at an upper side of the semiconductor device; and a supporting member arranged at a lower side of the wiring board, the supporting member having a convex portion facing the wiring board, the supporting member being connected to the covering member and supporting the wiring board at the convex portion. | 06-23-2011 |
20110299255 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT - A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection. | 12-08-2011 |
20120014068 | ELECTRONIC DEVICE - An electronic device includes an electronic component mounted on a substrate; a cooling system for cooling the electronic component; and a fastening structure for fastening the cooling system to the substrate. The fastening structure includes a first magnet provided to one of the substrate and the cooling system, a second magnetic material fixed to the other of the substrate and the cooling system and magnetically coupled with the first magnet, and a magnetic shield that covers a part or all of the first magnet except for a coupling face to be coupled with the second magnetic material. | 01-19-2012 |
20120176759 | ELECTRONIC DEVICE, INTERPOSER AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad. | 07-12-2012 |