| Patent application number | Description | Published |
|---|
| 20120219777 | Ultrathin Laminates - Ultrathin copper clad laminates including a fabric sheet material layer having a first planar surface, a second planar surface and an original thickness of from about 10 to about 30 microns and at least one copper foil sheet that is adhered to a planar surface of the fabric sheet material by a cured resin wherein the base laminate has a thickness of from about 1.0 to about 1.75 mils. | 08-30-2012 |
| 20140011962 | Synthesized Resins and Varnishes and Prepegs and Laminates Made Therefrom - Synthesized base resin compositions that include a raw resin and a maleimide and/or bismaleimide monomer as well as compounded varnishes that include a raw resin or synthesized base resin as well as a monomer, flame retardant and initiator as well as prepregs and laminates made using the synthesized base resin and compounded varnishes. | 01-09-2014 |
| 20140024278 | Synthesized Resins and Varnishes and Prepegs and Laminates Made Therefrom - Synthesized base resin compositions that include a raw resin and a maleimide and/or bismaleimide monomer as well as compounded varnishes that include a raw resin or synthesized base resin as well as a monomer, flame retardant and initiator as well as prepregs and laminates made using the synthesized base resin and compounded varnishes. | 01-23-2014 |
| 20140220844 | Prepregs and Laminates Having Homogeneous Dielectric Properties - Resin compositions including one or more base resins and one or more high dielectric constant materials wherein the one or more high dielectric constant materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured Dk that matches the Dk of the reinforcing material to which the resin composition is to be applied to within plus or minus (±) 15% as well as prepregs and laminates made using the resin compositions. | 08-07-2014 |
| 20140231007 | Ultrathin Laminates - Ultrathin copper clad laminates including a fabric sheet material layer having a first planar surface, a second planar surface and an original thickness of from about 10 to about 30 microns and at least one copper foil sheet that is adhered to a planar surface of the fabric sheet material by a cured resin wherein the base laminate has a thickness of from about 1.0 to about 1.75 mils. | 08-21-2014 |
| 20150030822 | Prepregs and Laminates Having Homogeneous Dielectric Properties - Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured Dk | 01-29-2015 |
| 20150105505 | Varnishes and Prepregs and Laminates Made Therefrom - Varnishes useful in manufacturing prepregs and laminates including at least one polymer selected from the group consisting of polyphenylene ether, polyphenylene oxide and combinations thereof; at least on reactive monomer; and at least one initiator. | 04-16-2015 |
| 20160075839 | High Tg Epoxy Formulation with Good Thermal Properties - Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3. | 03-17-2016 |
