Patent application number | Description | Published |
20140133575 | ELECTRONIC DEVICE AND METHOD FOR SPLITTING IMAGE - In a method for splitting an image for encoding purposes, a largest coding unit (LCU) of the image is obtained, the LCU divided into a plurality of 2N×2N blocks, the 2N×2N blocks examined sequentially, and a determination made as to whether or not the current 2N×2N block needs to be split according to a pixel variance of the current 2N×2N block. The method further determines whether a block merging operation needs to be executed for the LCUs according to an average value of pixels of each of the 2N×2N blocks if the current 2N×2N block does not need to be split. | 05-15-2014 |
20140133768 | ELECTRONIC DEVICE AND METHOD FOR SPLITTING IMAGE - In a method for splitting an image for encoding purposes, a largest coding unit (LCU) of the image is obtained, the LCU is divided into a plurality of coding unit (CU) blocks, the CU blocks examined sequentially, and a determination made as to whether or not a current CU block needs to be split according to a pixel variance of the current CU block. The current CU block is split into four sub-blocks if the current CU block needs to be split. | 05-15-2014 |
20140133769 | ELECTRONIC DEVICE AND IMAGE BLOCK MERGING METHOD - In a method for merging image blocks for encoding purposes, a largest coding unit (LCU) of an image is obtained, the LCU divided into a plurality of N×N blocks, the N×N blocks examined sequentially, and a determination made as to whether a block merging operation needs to be executed for the LCU according to an average value of pixels of each of the N×N blocks. | 05-15-2014 |
20140133771 | ELECTRONIC DEVICE AND METHOD FOR SPLITTING IMAGE - In a method for splitting an image, a largest coding unit (LCU) of the image is obtained. The method divides the LCU into a plurality of N×N blocks and coding unit (CU) blocks, calculates an angle of each N×N block, obtains angles of the N×N blocks in each CU block, and determines a split mode of each CU block according to the angles of the N×N blocks in each CU block. The method splits the current CU block into four sub-blocks if the split mode of the current CU block is a continuation mode, and stops splitting of the current CU block if the split mode of the current CU block is a termination mode. | 05-15-2014 |
20140133772 | ELECTRONIC DEVICE AND METHOD FOR SPLITTING IMAGE - In a method for splitting an image, a largest coding unit (LCU) of the image is obtained. The method divides the LCU into a plurality of N×N blocks and coding unit (CU) blocks, calculates an angle of each N×N block, obtains angles of the N×N blocks in each CU block, and determines a split mode of a current CU block according to the angles of the N×N blocks in the current CU block. The method splits the current CU block into four sub-blocks if the split mode of the current CU block is a continuation mode, or stops splitting of the current CU block if the split mode of the current CU block is a termination mode. | 05-15-2014 |
20140325581 | ELECTRONIC DEVICE AND METHOD FOR MANAGING VIDEO SNAPSHOT - Method of managing video snapshot of receiving bitstreams of a video and bitstream parameters of the received bitstreams from a server through a network channel. The electronic device is connected to the server. The server encodes the video into an encoded file using an encoder of the server. The encoded file comprises a plurality of bitstreams. The plurality of bitstreams in the encoded file comprising a plurality of enhancement layers. According to a selection of a user of the electronic device, a snapshot grade is determined. According to the received bitstreams and the determined snapshot grade, additional enhancement layers which are not comprised in the received bitstreams are acquired from the encoded file in the server through the network channel. Based on the acquired additional enhancement layers, a video snapshot is generated. | 10-30-2014 |
20140376625 | INTRA PREDICTION METHOD AND ELECTRONIC DEVICE THEREFOR - An intra prediction method executed by a processor of an electronic device is disclosed. The method allows the electronic device to obtain a prediction unit of an image, and to set a search range for the prediction unit based on a reconstruction region of the image. The search range includes a plurality of predicted blocks. The electronic device further measures similarities between the prediction unit and each of the plurality of predicted blocks, determines a reference block based on the similarities, and predicts the prediction unit based on the reference block. | 12-25-2014 |
Patent application number | Description | Published |
20140153200 | PRINTED CIRCUIT BOARD - A printed circuit board includes a ground layer, a metal board, a via, and a power layer. The metal board is arranged between the ground layer and the power layer. The via is electrically connected between the metal board and the power layer. The power layer is made of a number of wires. | 06-05-2014 |
20140182893 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bounded by the first bonding pad, and a second signal via in a central portion of a space bounded by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground via are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots. | 07-03-2014 |
20140209369 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bound by the first bonding pad, and a second signal via in a central portion of a space bound by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground via are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots. | 07-31-2014 |
20140291007 | STACKED ELECTROMAGNETIC BANDGAP STRUCTURE - An EBG (electromagnetic bandgap) device with a stacked structure includes a first ground plane, a first power plane, a via, a second power plane, a second ground plane; a third power plane, and several ground vias. The first ground plane, the second power plane, and the second ground plane are connected through the several ground vias. The ground vias and the second power plane do not have actually electrical connection. The first ground plane, the first power plane, the second power plane, and the via form a first EBG structure and the first ground plane, the second ground plane, the third power plane and the several ground vias form a second EBG structure. | 10-02-2014 |
20140337704 | SYSTEM AND METHOD FOR CONVERTING BETWEEN DATA FORMATS - A system and a method for converting between data formats converts air flow data from a thermal simulation tool into a format readable by a DC power analyzing tool. Air flow data associated with the locations of certain points on a printed circuit board are taken and an EXCEL document including Main, Data, and Final worksheets is created. The data to be converted is obtained, and the data imported into the Data worksheet. Parameters in the Main worksheet to set an analysis area of the printed circuit board are set, and air flow data associated with the analysis areas from the Data worksheet are obtained and divided into groups, according to the parameters set in the Main worksheet. An equivalence value for each group of data is calculated and the equivalence values are saved in the Final worksheet for reading by the DC power analyzing tool. | 11-13-2014 |
20150041207 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bound by the first bonding pad, and a second signal via in a central portion of a space bound by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground vias are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots. | 02-12-2015 |