Patent application number | Description | Published |
20090212668 | PIEZOELECTRIC VIBRATING PIECE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIOWAVE TIMEPIECE AND METHOD OF FABRICATING PIEZOELECTRIC VIBRATING PIECE - To achieve small-sized formation by shortening a total length after ensuring a length of a base portion capable of sufficiently reducing vibration leakage, there is provided a piezoelectric vibrating piece | 08-27-2009 |
20100290201 | ELECTRONIC COMPONENT, MANUFACTURING METHOD FOR ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE - To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component ( | 11-18-2010 |
20110050043 | METHOD FOR MANUFACTURING PACKAGE, METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Providing a method for manufacturing a package capable of achieving reliable anodic bonding between the bonding material | 03-03-2011 |
20110050045 | PACKAGE, METHOD FOR MANUFACTURING THE SAME, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Providing a package and a method for manufacturing the package capable of achieving improvement in the degree of vacuum in the cavity, and to provide a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. There is provided a package which includes a plurality of kinds of gettering materials | 03-03-2011 |
20110220383 | WAFER AND PACKAGE PRODUCT MANUFACTURING METHOD - A wafer is provided that is stacked on and anodically bonded to another wafer to form a plurality of package products each having a cavity in which an operation piece is contained between the wafers. The wafers has a product area in which a plurality of concave portions are formed each of which will be part of the cavity when stacked on the another wafer, and grooves or slits are formed extending from the central portion in radial direction to the outside in radial direction of the wafer and reaching the outside of the product area. | 09-15-2011 |
20110223363 | WAFER AND PACKAGE PRODUCT MANUFACTURING METHOD - A wafer is provided that is stacked on and anodically bonded to another wafer to form a plurality of package products each having a cavity in which an operation piece is contained between the wafers. In a portion of the wafer located inward with respect to the outer circumference of a product area in which a plurality of concave portions are formed each of which will be part of the cavity when stacked on the another wafer, a depressed area or through hole is formed having a plane area larger than that of one of the concave portions. | 09-15-2011 |
20110250369 | PACKAGE, METHOD OF MANUFACTURING PACKAGES, AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATORS - This package is a package formed by bonding a plurality of substrates including a first substrate and a second substrate and forming a cavity between the plurality of substrates, including a corrosion-resistant bonding film arranged on opposed surfaces of the first substrate and the second substrate so as to surround the cavity, and a high-bonding-property bonding film arranged on the opposed surfaces of the first substrate and the second substrate inward of the corrosion-resistant bonding film and having a bonding force stronger than the corrosion-resistant bonding film. | 10-13-2011 |
20110285250 | PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR MOUNTING BODY, AND PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD - This piezoelectric vibrator is provided with a package that is structured to include a first substrate and a second substrate that are bonded to each other such that a cavity is formed therebetween, an internal electrode portion that is formed on the first substrate and housed in the cavity, a piezoelectric vibrating reed that is sealed in the cavity and also is electrically connected to the internal electrode portion in the cavity, an external electrode portion that is formed on an external surface of the first substrate, a through electrode portion that is disposed so as not to be overlapped by the external electrode portion in a thickness direction of the first substrate, while one end of the through electrode portion is electrically connected to the internal electrode portion and another end of the through electrode portion is formed on the external surface of the first substrate while penetrating through the first substrate, and a routing wiring portion that electrically connects the through electrode portion and the external electrode portion. | 11-24-2011 |
20120249254 | MANUFACTURING METHOD OF PACKAGE - Provided is a manufacturing method of a package where a gas generated between a base substrate forming wafer and a lid substrate forming wafer at the time of bonding these two wafers to each other can be easily discharged to the outside. In the method, the base substrate forming wafer and the lid substrate forming wafer are laminated to each other by sandwiching the base substrate forming wafer and the lid substrate forming wafer from both sides in the laminating direction using a lower jig and an upper jig arranged in a vacuum chamber thus forming a wafer bonded body having a plurality of cavities in each of which a piezoelectric vibrating piece is sealed, and the wafer bonded body is cut for every one of plurality of cavities thus forming a plurality of packages. | 10-04-2012 |
Patent application number | Description | Published |
20100068088 | HOT BRIQUETTE IRON AND METHOD FOR PRODUCING THE SAME - Hot briquette iron includes a plurality of reduced iron particles which are bonded to each other by hot forming, wherein the reduced iron particles each have a surface region having an average carbon content of 0.1 to 2.5% by mass and a central region positioned inside the surface region and having an average carbon content higher than that of the surface region. | 03-18-2010 |
20110265603 | METHOD FOR PRODUCING GRANULAR IRON - A method for producing granular iron comprising: charging agglomerates formed from a raw material mixture containing an iron oxide-containing substance and a carbonaceous reducing agent onto a carbonaceous material spread on a hearth of a furnace; and heating the agglomerates to thereby reduce and melt iron oxides in the agglomerates, wherein the temperature of the agglomerates in the furnace is set in a range between 1200° C. and 1500° C.; the oxygen partial pressure in atmospheric gas under which the agglomerates are heated is set to 2.0×10 | 11-03-2011 |
20120103136 | APPARATUS AND METHOD FOR PRODUCING REDUCED IRON FROM ALKALI-CONTAINING IRONMAKING DUST SERVING AS MATERIAL - Provided is a movable hearth furnace for thoroughly removing alkali metal elements and producing high-strength reduced iron when producing reduced iron using iron production dust containing alkali metal elements in a movable hearth furnace. The movable hearth furnace comprises: a reduction zone for heating and reducing a carbon composite briquette (C) to produce a reduced briquette (D) having an iron metallization rate of 80% or greater; an alkali removal zone, disposed after the reduction zone, for heating the reduced briquette in a reducing atmosphere and removing the alkali metal elements from the reduced briquette to obtain an alkali-free reduced briquette; and a strengthening zone, disposed after the alkali removal zone, for heating the alkali-free reduced briquette in an oxidizing atmosphere and raising the crushing strength of the alkali-free reduced briquette to produce reduced iron product. | 05-03-2012 |
20130201976 | COMMUNICATION SYSTEM AND TRANSMISSION UNIT - A signal transceiving section transmits a transmission signal to a transmission path, each frame in the transmission signal is divided into a plurality of periods in a time axis direction, and the plurality of periods includes superimposing period for superimposing a superimposed signal. A transmission unit includes a signal adjustment section for changing the proportion of the superimposing period in one frame of the transmission signal. The signal adjustment section adjusts the proportion of the superimposing period in accordance with a transmission state of the superimposed signal transmitted between second communication terminals. The signal adjustment section may adjust the proportion of the superimposing period so that the proportion of the superimposing period in one frame of the transmission signal increase with increasing the volume of transmission data transmitted between the second communication terminals through the superimposed signal. | 08-08-2013 |
20130208733 | COMMUNICATION SYSTEM AND SUPERIMPOSING APPARATUS - The communication system includes: first terminal devices connected to a transmission path and having terminal information; a second terminal device connected to the path and sending an information request requesting the information from the first terminal device; a first superimposing apparatus interposed between the first terminal device and the path; and a second superimposing apparatus interposed between the second terminal device and the path and receiving the request from the second terminal device. The first superimposing apparatus acquires the information from the connected first terminal device at predetermined timings and stores it. Upon receiving the request, the second superimposing apparatus sends the request to the first superimposing apparatus using a superimposed signal superimposed on a transmission signal transmitted via the path. Upon receiving the request, the first superimposing apparatus sends the information to the second superimposing apparatus using the superimposed signal. Upon receiving the information, the second superimposing apparatus provides the information to the second terminal device. | 08-15-2013 |
20130250846 | RELAY DEVICE - The relay device includes a first switch interposed between a first extraction unit and a second superimposing unit and a second switch interposed between a second extraction unit and a first superimposing unit. The first switch opens and closes a path where a superimposed signal is relayed from a first transmission path to a second transmission path. The second switch opens and closes a path where a superimposed signal is relayed from the second transmission path to the first transmission path. The first switch is controlled in response to reception of a first control signal to be turned off when a superimposed signal is relayed from the second transmission path to the first transmission path. The second switch is controlled in response to reception of a second control signal to be turned off when a superimposed signal is relayed from the first transmission path to the second transmission path. | 09-26-2013 |
20140088775 | APPARATUS CONTROL SYSTEM, MOBILE TERMINAL AND PROGRAM - Apparatus control system includes control device controlling operation of apparatuses and portable mobile terminal communicable with the control device. In the control device, control unit controls each apparatus in accordance with control schedule stored in device-side storage unit and control request from the mobile terminal. In the mobile terminal, date and time setting unit sets arbitrary date and time as set date and time. Terminal-side storage unit stores terminal-side schedule in which control contents are associated with control dates and times for each apparatus. Simulation unit simulates operating state of each apparatus assuming that the apparatus is operating at the set date and time set by the date and time setting unit, using the terminal-side schedule. Apparatus state reflection unit outputs control request to the control device to cause the control device to control each apparatus such that the apparatus is in the operating state simulated by the simulation unit. | 03-27-2014 |