Patent application number | Description | Published |
20090103256 | ELECTRONIC EQUIPMENT - An electronic equipment includes: a main unit that is provided with a printed circuit board; a display unit that is provided with a display device; a hinge mechanism that is provided with a rotation shaft that connects the display unit to the main unit to be rotatable between a first position where the display unit is opened relative to the main unit and a second position where the display unit is closed relative to the main unit; an urging mechanism that urges the display unit toward the second position at a position between the first position and the second position; and a relaxation mechanism that is provided separately from the urging mechanism and relaxes an urging force applied to the display unit by the urging mechanism. | 04-23-2009 |
20090168378 | ELECTRONIC APPARATUS - According to an aspect of the present invention, there is provided an electronic apparatus including: a wiring that is formed on a mounting surface; a terminal that is electrically connected with the wiring; a terminal holder that is disposed above the mounting surface to face the wiring and that holds the terminal in a space between the terminal; and a blocking member that is disposed on the terminal holder at a side facing the mounting surface, that surrounds the terminal and that is separated from the mounting surface to regulate a gap between blocking member and the mounting surface so that the terminal is prevented from passing therethrough when the terminal is broken off from the terminal holder. | 07-02-2009 |
20100073861 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a chassis, a housing, a communication unit, and a holder. The chassis includes a conductive portion. The housing, in the chassis, has structure to hold a first storage device. The housing is configured to house the first storage device or a second storage device that requires structure to hold it to be conductive. The communication unit is configured to be located between the chassis and the first or second storage device. The communication unit includes a communication module and a case made of a nonconductive material to ensure the wireless communication function of the communication module. The holder made of a conductive material is provided to the case to hold the second storage device in the housing. The holder includes a fixing portion to fix the second storage device and a conducting portion electrically connectable to the conductive portion. | 03-25-2010 |
20100073887 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes, a conductive housing, a substrate, a flexible substrate, a reinforcing element, and a conductor. The substrate is configured to be housed in the housing and is mounted with an electronic component. The flexible substrate includes a conductive signal layer stacked on a flexible insulating base material and electrically connected to the substrate, a cover layer covering the signal layer, a first surface mounted with the substrate, and a second surface on the reverse side of the first surface, having a portion where the signal layer is partially exposed. The reinforcing element is provided on the second surface to reinforce the flexible substrate and has an opening corresponding to the portion where the signal layer is partially exposed. The conductor is inserted from the opening of the reinforcing element and connects the signal layer to the housing. | 03-25-2010 |
20120236214 | TELEVISION RECEIVER AND ELECTRONIC APPARATUS - According to one embodiment, a television receiver includes: a housing; a circuit board arranged in the housing; an electronic component mounted on the circuit board; a reinforcing member comprising a first surface in contact with the circuit board, and a second surface located on an opposite side of the first surface and exposed to an inside of the housing; a component contained in the housing, the component comprising a first supported area located at a distance from a surface of the circuit board; and a support member configured to support the component, the support member comprising a first end portion fixed to the first supported area of the component, and a second end portion fixed to the second surface of the reinforcing member. | 09-20-2012 |
20130114214 | Television Receiver and Electronic Apparatus - According to one embodiment, a television receiver includes: a housing; a circuit board arranged in the housing; an electronic component mounted on the circuit board; a reinforcing member comprising a first surface in contact with the circuit board, and a second surface located on an opposite side of the first surface and exposed to an inside of the housing; a component contained in the housing, the component comprising a first supported area located at a distance from a surface of the circuit board; and a support member configured to support the component, the support member comprising a first end portion fixed to the first supported area of the component, and a second end portion fixed to the second surface of the reinforcing member. | 05-09-2013 |
Patent application number | Description | Published |
20100112790 | METHOD OF MANUFACTURING SEMICONDUCTOR THIN FILM AND SEMICONDUCTOR DEVICE - On a translucent substrate, an insulating film having a refractive index n and an amorphous silicon film are deposited successively. By irradiating the amorphous silicon film with a laser beam having a beam shape of a band shape extending along a length direction with a wavelength λ, a plurality of times from a side of amorphous silicon film facing the insulating film, while an irradiation position of the laser beam is shifted each of the plurality of times in a width direction of the band shape by a distance smaller than a width dimension of the band shape, a polycrystalline silicon film is formed from the amorphous silicon film. Forming the polycrystalline silicon film forms crystal grain boundaries which extend in the width direction and are disposed at a mean spacing measured along the length direction and ranging from (λ/n)×0.95 to (λ/n)×1.05 inclusive, and crystal grain boundaries which, in a region between crystal grain boundaries adjacent to each other and extending in the width direction, extend in the length direction and are disposed at a mean spacing measured along the width direction and ranging from (λ/n)×0.95 to (λ/n)×1.05 inclusive. | 05-06-2010 |
20100176399 | BACK-CHANNEL-ETCH TYPE THIN-FILM TRANSISTOR, SEMICONDUCTOR DEVICE AND MANUFACTURING METHODS THEREOF - A back-channel-etch type TFT includes a gate electrode, an SiN film that is formed on the gate electrode, and an SiO film that is formed and patterned on the SiN film. The TFT further includes an polycrystalline semiconductor film that is formed and patterned on the SiO film in contact with the SiO film in such a way that all pattern ends of the polycrystalline semiconductor film are located in close proximity to pattern ends of the SiO film. | 07-15-2010 |
20110079780 | METHOD OF CRYSTALLIZING AMORPHOUS SEMICONDUCTOR FILM, THIN-FILM TRANSISTOR, SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND METHOD OF MANUFACTURING THE SAME - A method of crystallizing an amorphous semiconductor film, the method comprising the steps of: forming a gate electrode on a transparent insulating substrate; forming a gate insulating film on the transparent insulating substrate and on an upper part of the gate electrode; forming an amorphous semiconductor film on the gate insulating film; forming a light-transmissive insulating film on the amorphous semiconductor film; forming a metal film having an opening on the light-transmissive insulating film; irradiating laser light onto both a region of the light-transmissive insulating film exposed by the opening and the metal film, which is used as a mask for shielding the laser light; and performing laser annealing to make the laser light to be absorbed through the light-transmissive insulating film into a region of the amorphous semiconductor film exposed by the opening, so that the amorphous semiconductor film is heated and converted to a crystalline semiconductor film. | 04-07-2011 |
20110210347 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device including: a thin film transistor substrate; and a driving circuit, wherein the thin film transistor substrate includes: a thin film transistor includes: a gate electrode; a gate insulating film that is formed on the insulating substrate and the gate electrode; a semiconductor layer that is formed on the gate insulating film; a channel protecting film; and a source electrode and a drain electrode that are formed to connect with the semiconductor layer; and a wiring converting unit that directly and electrically connects a first wiring layer and a second wiring layer through a first contact hole formed in the gate insulating film in the driving circuit, wherein the first wiring layer is formed at the same layer as the gate electrode on the insulating substrate; and wherein the second wiring layer is formed at the same layer as the source electrode and the drain electrode. | 09-01-2011 |
20110299005 | ACTIVE MATRIX SUBSTRATE AND LIQUID CRYSTAL DEVICE - In an active matrix substrate, the source electrode side and/or the drain electrode side of a crystalline semiconductor film extends to an area located outside both the thin-film transistor and the gate electrode, and a metal light-shielding film is provided, in the same layer as the gate electrode, between the contacting portion between the source electrode or the source line and the crystalline semiconductor film and the gate electrode, and/or between the contacting portion between the drain electrode and the crystalline semiconductor film and the gate electrode. An impurity-implanted region implanted with n-type impurity may be formed between the contacting portion between the source electrode or the source line and the crystalline semiconductor film and the gate electrode, and/or between the contacting portion between the drain electrode and the crystalline semiconductor film and the gate electrode. | 12-08-2011 |
20140204324 | DISPLAY PANEL AND DISPLAY DEVICE - A display panel includes a first substrate in which a display region and a circuit component mounting region are defined and a second substrate, an end of which is cut to expose the circuit component mounting region. The first substrate includes a plurality of first source wirings formed from the display region to the circuit component mounting region and a wiring protection pattern formed in a region corresponding to the cut end of the second substrate between any adjacent first source wirings. In a cross sectional view, an upper end of the wiring protection pattern is located above an upper end of the first source wirings. | 07-24-2014 |