Patent application number | Description | Published |
20100000663 | ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS - A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding. | 01-07-2010 |
20100276723 | DEVICE AND DEVICE MANUFACTURE METHOD - A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate. | 11-04-2010 |
20110011536 | ROOM TEMPERATURE BONDING APPARATUS - A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate. Further, the room temperature bonding apparatus can use the angle adjustment mechanism to change a direction of the first substrate such that the first substrate and the second substrate come into parallel contact with each other, and uniformly impose the larger load on a bonding surface. | 01-20-2011 |
20110083801 | ROOM TEMPERATURE BONDING MACHINE AND ROOM TEMPERATURE BONDING METHOD - Provided is a cold jointing apparatus, which comprises a discharge device, a gas feeding device, a pressure gauge, a clarifying device, a pressure controller and a pressing mechanism. The discharge device discharges a gas from the inside of a chamber. The gas feeding device feeds an introduction gas to the inside of the chamber. The pressure gauge measures the pressure in the chamber. The clarifying device clarifies a first board and a second board in the chamber when the measured pressure is at a predetermined degree of vacuum. The pressure controller controls both the discharge device and the gas feeding device so that the measured pressure may be equal to a target pressure. The pressing mechanism presses the first board and the second board in the chamber when the measured pressure is that target pressure. | 04-14-2011 |
20110214816 | ROOM-TEMPERATURE BONDING METHOD AND ROOM-TEMPERATURE BONDING APPARATUS - A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding. | 09-08-2011 |
20120285624 | Room Temperature Bonding Apparatus - A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface. | 11-15-2012 |
Patent application number | Description | Published |
20090103836 | SYSTEM FOR ENDOSCOPE DATA MANAGEMENT, AND SYSTEM AND DATA MANAGER FOR WASHING DATA MANAGEMENT - A system for endoscope data management of an endoscopic image of a body acquired by an endoscope is provided. An image filing apparatus retrieves the image from the endoscope, and records data of the image and scope ID assigned to the endoscope in association with one another. A washer washes the endoscope. A memory is incorporated in the washer, for storing log information of washing of the endoscope. A data manager retrieves the log information on line with the washer, to record the scope ID and the log information in association with one another. A server device records the data of the image, the scope ID and the log information on line with the image filing apparatus and the data manager. Furthermore, the data manager includes an editor for editing the log information of the washer. | 04-23-2009 |
20100104345 | PROPELLING CONTAINER - A highly air-tight propelling container is provided, in which it is easy to recognize how much the content is extruded, and rotation of the rotator is prevented to avoid that the component are damaged by a wrong operation. | 04-29-2010 |
20110062107 | Safety cap and container with safety cap - There is provided a safety cap which requires manual dexterity for a cover opening operation and is difficult for an infant or the like to open a cover, in which a safety function can be released, as necessary. In the safety cap configured such that a part of an outer circumferential wall of a cap main body is formed on an inward elastically deformable operating plate, a pair of engaging means and engageable with each other are provided on a peripheral wall of a cover connected to the upper portion of the cap main body via a hinge and at the upper portion of the operating plate, respectively, and the engagement is released by elastically deforming the operating plate inward so as to open the cover, the operating plate can be fixed to the cap main body or a neck portion of the container except for the operating plate by the fixing member in the inward deformed state. | 03-17-2011 |
20120031557 | BONDING UNIT CONTROL UNIT AND MULTI-LAYER BONDING METHOD - A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost. | 02-09-2012 |
20120247645 | BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM - The present invention includes an activating step S | 10-04-2012 |
20130112334 | ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD - A room temperature bonding method of the present invention includes a step of activating two substrates to prepare two activated substrates; a step of bonding the two activated substrates to produce a bonding resultant substrate; a step of performing annealing of the bonding resultant substrate to reduce residual stress of the bonding resultant substrate. According to such a room temperature bonding method, the residual stress of the bonding resultant substrate can be reduced and the quality can be improved. | 05-09-2013 |
20140022427 | SOLID STATE IMAGING APPARATUS, SIGNAL READING METHOD, AND ELECTRONIC APPARATUS - There is provided a solid state imaging apparatus including a pixel array in which a plurality of unit pixels are arranged two-dimensionally. Each pixel includes a photoelectric conversion element, a transfer transistor which transfers a charge accumulated in the photoelectric conversion element to floating diffusion, a reset transistor which resets the charge of the floating diffusion, and an output transistor which outputs the charge of the floating diffusion. The floating diffusion of at least one of the plurality of unit pixels is electrically connected via the output transistor. | 01-23-2014 |
20150111876 | SULFUR-CONTAINING BICYCLIC COMPOUND - A sulfur-containing bicyclic compound having a PAM action of GABA | 04-23-2015 |
Patent application number | Description | Published |
20120222784 | MAGNESIUM-LITHIUM ALLOY, ROLLED MATERIAL, FORMED ARTICLE, AND PROCESS FOR PRODUCING SAME - The present invention provides a magnesium-lithium alloy having both corrosion resistance and cold workability balanced at high levels, a certain degree of tensile strength, and very light weight, as well as a rolled material and a formed article made of this alloy. The alloy of the invention contains not less than 10.5 mass % and not more than 16.0 mass % Li, not less than 0.50 mass % and not more than 1.50 mass % Al, and the balance of Mg, and has an average crystal grain size of not smaller than 5 μm and not larger than 40 μm, and a tensile strength of not lower than 150 MPa or a Vickers hardness (HV) of not lower than 50. | 09-06-2012 |
20120227868 | MAGNESIUM-LITHIUM ALLOY, ROLLED MATERIAL, MOLDED ARTICLE, AND PROCESS FOR PRODUCING SAME - The present invention provides a very lightweight magnesium-lithium alloy which has both corrosion resistance and cold workability balanced at high levels, a certain degree of tensile strength, low surface electrical resistivity, as well as a rolled material and a formed article made of the alloy, and a method of producing the alloy, by means of a magnesium-lithium alloy containing not less than 10.5 mass % and not more than 16.0 mass % Li, not less than 0.50 mass % and not more than 1.50 mass % Al, and the balance of Mg, and having an average crystal grain size of not smaller than 5 μm and not larger than 40 μm, a tensile strength of not lower than 150 MPa, and a surface electrical resistivity of not higher than 1Ω as measured with an ammeter by pressing a cylindrical two-point probe with a pin-to-pin spacing of 10 mm and a pin tip diameter of 2 mm (contact surface area of one pin is 3.14 mm | 09-13-2012 |