Patent application number | Description | Published |
20140179999 | CAPSULE TYPE MEDICAL DEVICE - A capsule endoscope includes a capsule type housing and a circuit board on which a plurality of board sections are arranged in a row, the circuit board being housed inside the housing in a bent state. Connection electrodes for electronic component mounting are not formed on a second principal plane of the circuit board. | 06-26-2014 |
20140180005 | CAPSULE ENDOSCOPE - In a capsule endoscope, inside a housing, a plurality of connecting sections of a circuit board formed by arranging a plurality of board sections to one another in a row via the connecting sections are bent at 180 degrees and the plurality of board sections are arranged such that principal planes of the respective board sections are orthogonal to a center axis of the housing. The capsule endoscope includes two transducer sections, a first image pickup chip connected to the transducer section via two signal lines and configured to generate a clock signal and acquire first image data according to the generated clock signal, a second image pickup chip configured to acquire second image data according to the clock signal transmitted by one signal line from the first image pickup chip, and a transmitting section configured to transmit the first image data and the second image data by radio. | 06-26-2014 |
20140180040 | CAPSULE TYPE MEDICAL DEVICE - In a capsule endoscope, on an inside of a capsule type housing including a cylindrical main body section and two semispherical end cover sections and having a rotationally symmetrical shape with respect to a center axis of the housing, an image pickup board section, a transmission board section, and a reception board section are housed such that principal planes of the image pickup board section, the transmission board section, and the reception board section are orthogonal to the center axis. A coil wire of at least one of a transmission coil formed by a transmission coil wire and a reception coil formed by a reception coil wire, respective principal planes of which are orthogonal to the center axis, is disposed on the end cover section side of the housing. | 06-26-2014 |
20150085094 | IMAGE PICKUP APPARATUS, SEMICONDUCTOR APPARATUS, AND IMAGE PICKUP UNIT - An image pickup apparatus includes: an image pickup chip including a light receiving section and electrode pads, on a first main face, and a plurality of connection electrodes, each of which is connected to each of the electrode pads via each of a plurality of through-hole interconnections, on a second main face; a transparent cover glass having a larger plan-view dimension than the image pickup chip; a transparent adhesive layer that bonds the first main face of the image pickup chip and the cover glass; and a sealing member that covers a side face of the image pickup chip and a side face of the adhesive layer, and is made of an insulating material having a same plan-view dimension as the cover glass. | 03-26-2015 |
20150085169 | METHOD FOR PRODUCING IMAGE PICKUP APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS - A method for producing an image pickup apparatus includes: a process of cutting an image pickup chip substrate where electrode pads are formed around each of the light receiving sections to fabricate image pickup chips; a process of bonding image pickup chips determined as non-defective products to a glass wafer to fabricate a joined wafer; a process of filling a sealing member among the image pickup chips on the joined wafer; a machining process including a thinning a thickness of the joined wafer to flatten a machining surface and a forming through-hole interconnections, each of which is connected to each of the electrode pads; a process of forming a plurality of external connection electrodes, each of which is connected to each of the electrode pads via each of the through-hole interconnections; and a process of cutting the joined wafer. | 03-26-2015 |
20150087086 | METHOD FOR PRODUCING IMAGE PICKUP APPARATUS, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS - A method for producing an image pickup apparatus includes: a process of fabricating a plurality of image pickup chips by cutting an image pickup chip substrate where light receiving sections and electrode pads are formed; a process of fabricating a joined wafer by bonding the image pickup chips to a glass wafer; a process of filling a gap between the plurality of image pickup chips with a sealing member; a process of machining the joined wafer to reduce a thickness; a process of forming through-hole vias; a process of forming an insulating layer that covers the image pickup chips; a process of forming through-hole interconnections; a process of forming external connection electrodes, each of which is connected to each of the through-hole interconnections; and a process of cutting the joined wafer. | 03-26-2015 |
20150087088 | METHOD FOR PRODUCING IMAGE PICKUP APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS - A method for producing an image pickup apparatus includes processes of: cutting an image pickup chip substrate to fabricate a plurality of image pickup chips; bonding the image pickup chips to a glass wafer via a transparent adhesive layer as well as bonding dummy chips to an outer peripheral region of the glass wafer where the image pickup chips are not bonded to fabricate a joined wafer; filling a sealing member between the image pickup chips and the dummy chips; machining the joined wafer to thin a thickness; and cutting the joined wafer. | 03-26-2015 |
20150190040 | IMAGE PICKUP APPARATUS AND ENDOSCOPE INCLUDING IMAGE PICKUP APPARATUS - An image pickup apparatus includes a substrate, on a first surface of which a light receiving section and a peripheral circuit section are formed, a multilayer wiring layer stacked on the first surface and including a plurality of metal layers and insulating layers, a translucent cover located on the multilayer wiring layer, and a side surface sealing member which extends from a peripheral section of a surface in the translucent cover to the substrate side while having a frame shape, and protects outer peripheral side surfaces of the multilayer wiring layer. | 07-09-2015 |