Patent application number | Description | Published |
20090250812 | FLIP-CHIP MOUNTING SUBSTRATE AND FLIP-CHIP MOUNTING METHOD - A solder resist and a central pad to which a central Au bump provided on a semiconductor chip is flip-chip bonded are formed on a substrate main body. In a flip-chip mounting substrate where an underfill resin is provided after the semiconductor chip is mounted, a central opening portion for exposing the central pad is formed in the solder resist, and also, an edge portion forming the central opening portion of the solder resist is partially overlapped with the outer peripheral portion of the central pad. | 10-08-2009 |
20100127370 | WIRING BOARD, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ELEMENT - On a semiconductor element loading face, wiring patterns are drawn out from those formed in the vicinity of the edge of the semiconductor element of the loading pads formed to correspond to the electrode terminals of the semiconductor element, and connected to via pads formed in the vicinity of the edge of the semiconductor element loading face; area pads constructed of the loading pads corresponding to the electrode terminals formed in the central region of the semiconductor element and its vicinity are electrically connected to external connecting terminal pads formed in the central region on the other side of the wiring board and its vicinity, through the nearest area pad vias encircled by the external connecting terminal pads and passing through the wiring board and the wiring patterns; and a plurality of the loading pads constituting the area pads commonly use one of the area pad vias. | 05-27-2010 |
20100252938 | SEMICONDUCTOR PACKAGE - A semiconductor package includes: a semiconductor element mounted on a one-sided plane of a wiring board; an underfill agent dropped so as to be filled between the semiconductor element and the wiring board; and a pad group constituted by a plurality of pads which are formed in the vicinity of a circumference of the wiring board and along the circumference, the pad group being formed on a bottom plane of a groove portion formed in a solder resist which covers the one-sided plane of the wiring board, wherein a corner edge of the groove portion located in the vicinity of a dropping starting portion to which dropping of the underfill agent is started is formed at an obtuse angle or in an arc shape in order to avoid the dropped underfill agent from entering into an inner portion of the groove portion. | 10-07-2010 |
20100295174 | WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE - A wiring substrate includes: a semiconductor chip on which a plurality of bumps are mounted, and a plurality of connection pads which are joined to the bumps mounted on the semiconductor chip in a flip chip method, wherein the connection pads of a peripheral portion of the wiring substrate are formed in a non-solder mask defined structure, and the connection pads of a center portion of the wiring substrate are formed in a solder mask defined structure. | 11-25-2010 |
20110316150 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A semiconductor package includes a first board, a semiconductor chip having a first face and a second face at an opposite side to the first face, the semiconductor chip being mounted on the first board with the first face facing the first board, an insulating film provided on the second face of the semiconductor chip, and a second board stacked on the first board. A bump provided on a face of the second board facing the first board is connected to a pad provided on a face of the first board facing the second board and a gap is formed between the first board and the second board. The semiconductor chip and the insulating film are provided in the gap. | 12-29-2011 |
20110316151 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A semiconductor package includes a board, an under fill resin layer provided on the board, and a semiconductor chip having a first face and a second face at an opposite side to the first face, the semiconductor chip being flip-chip mounted on the board via the under fill resin layer with the first face facing the board. The semiconductor chip is covered with the under fill resin layer over the first face and from the first face to an edge part of the second face. | 12-29-2011 |
20120126423 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - According to an aspect of the present invention, there is provided a semiconductor device manufacturing method, including: preparing a support plate having a mounting portion on which a mounting terminal is mountable; preparing a circuit board having a mounting surface on which a semiconductor chip is mounted and a connection pad is formed; bringing the support plate to face the mounting surface of the circuit board, and connecting the support plate to the connection pad through the mounting terminal; forming a resin layer between the support plate and the mounting surface of the circuit board to cover the mounting terminal; and removing the support plate, thereby faulting a via in the resin layer along a shape of the mounting portion so as to expose the mounting terminal therethrough. | 05-24-2012 |
20150200175 | SEMICONDUCTOR DEVICE - A semiconductor device includes a wiring layer formed on a first surface of a first insulation layer and including an external connection pad and an internal connection pad located at an inner side of the external connection pad. A semiconductor element facing the first surface of the first insulation layer includes an electrode pad located corresponding to the internal connection pad, a bump formed on the electrode pad and connected to the internal connection pad, and a circuit element region defined in a first surface of the semiconductor element at an inner side of the electrode pad. A second insulation layer fills a gap between the first surfaces of the semiconductor element and the first insulation layer. A third insulation layer covers a second surface of the semiconductor element and the second insulation layer and includes an opening that exposes the external connection pad connected to an external connection terminal. | 07-16-2015 |