Patent application number | Description | Published |
20080222497 | Decoding method and decoding circuit - An approach to dividing syndrome calculations into two steps and serially processing them requires a long time for the syndrome calculations with respect to an entire decoding process. Therefore, there is disclosed an error correction decoding circuit for a playing signal having a code sequence having a decoding unit generating first decoded signal and second decoded signal based on the code sequence and an error correction unit performing error correction for the second signal in response to the first signal. | 09-11-2008 |
20090065239 | Printed circuit board and method of manufacturing the same - A printed circuit board on which protective plating has been carried out as surface treatment is provided. The printed circuit board includes a part of a wiring pattern formed with an upper surface and side surfaces of a conductive part including the wiring pattern being exposed on a substrate. Surfaces of exposed parts of the conductive part are covered with the protective plating. | 03-12-2009 |
20090084590 | CIRCUIT BOARD - A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer. | 04-02-2009 |
20090094824 | METHOD OF PRODUCING SUBSTRATE - The method of producing a substrate comprises the steps of: forming a through-hole in a base member; filling the through-hole with an insulating material; performing electroless plating to coat the surface of the base member, in which the through-hole has been filled with the insulating material, with an electroless-plated layer; applying photo resist on the electroless-plated layer formed on the surface of the base member; optically exposing and developing the photo resist so as to form a resist pattern coating an end face of the through-hole filled with the insulating material; etching an electrically conductive layer formed on the surface of the base member with using the resist pattern as a mask; and removing the resist pattern coating the end face of the through-hole from the base member with using the electroless-plated layer as a release layer. | 04-16-2009 |
20090094825 | METHOD OF PRODUCING SUBSTRATE - The method of producing a substrate comprises the steps of: forming a through-hole in a base member; plating the base member so as to coat an inner face of the through-hole with a plated layer; applying photo resist on the base member; optically exposing and developing the photo resist so as to form a resist pattern, which coats at least a planar area of the through-hole; and etching an electrically conductive layer formed on the surface of the base member. The resist pattern is formed so as to separate an area of exposing the conductive layer a prescribed distance away from an edge of the through-hole, and the prescribed length is longer than a distance of etching a side face of the conductive layer in the etching step. | 04-16-2009 |
20090095509 | CORE SUBSTRATE AND METHOD OF PRODUCING THE SAME - In the core substrate, short circuit between an electrically conductive core section and a plated through-hole section can be securely prevented and cables can be formed in a high dense state. The core substrate comprises: the electrically conductive core section having a pilot hole, through which the plated through-hole section is formed; cable layers being respectively laminated on the both side faces of the core section; a plated layer coating an inner face of the pilot hole; and an insulating material filling a space between the plated layer and an outer circumferential face of the plated through-hole section. | 04-16-2009 |
20090095511 | CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME - The circuit board is capable of tightly bonding a cable layer on a base member even if thermal expansion coefficients of the base member and the cable layer are significantly different. The circuit board comprises: the base member; and the cable layer being laminated on the base member with anchor patterns, which are electrically conductive layers formed on a surface of the base member. | 04-16-2009 |
20090095524 | CORE SUBSTRATE AND METHOD OF PRODUCING THE SAME - The core substrate is capable of securely preventing short circuit between an electrically conductive core section and a plated through-hole section. The core substrate comprises: an electrically conductive core section having a pilot hole, through which a plated through-hole section is formed; electrically conductive layers coating the inner face of the pilot hole and a surface of the core section; a gas purging hole being formed in the conductive layer coating the surface of the core section; an insulating material filling a space between the inner face of the pilot hole and an outer circumferential face of the plated through-hole section; and cable layers being laminated on both side faces of the core section. | 04-16-2009 |
20090098391 | CORE MEMBER AND METHOD OF PRODUCING THE SAME - The core member constitutes a core substrate of a circuit board. The core member comprises: a carbon fiber-reinforced core section, in which prepregs including carbon fibers are thermocompression-bonded; and copper foils being respectively thermocompression-bonded on the both side faces of the carbon fiber-reinforced core section with prepregs including glass fibers. The pregregs including glass fibers are composed of resin, whose melting temperature range is higher than that of resin composing the pregregs including carbon fibers. | 04-16-2009 |
20090294056 | METHOD OF MAKING PRINTED WIRING BOARD AND METHOD OF MAKING PRINTED CIRCUIT BOARD UNIT - The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other. | 12-03-2009 |
20090294161 | CORE SUBSTRATE AND PRINTED WIRING BOARD - The core layer of a core substrate is made of carbon fibers impregnated with resin. When the temperature of the core layer increases, the core layer suffers from an increase in the thickness because of thermal expansion of the resin. The core layer is sandwiched between the insulating layers containing glass fibers. The insulating layers serve to suppress an increase in the thickness of the core layer resulting from the thermal expansion of the core layer. Thermal stress is suppressed in the core substrate. | 12-03-2009 |
20150029679 | CIRCUIT BOARD, PRODUCTION METHOD OF CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT - A method for producing circuit board, including: adhering plastic deformable insulating material onto surface of laminate, which contains second-metal-layer of second metal, and first-metal-layer in pattern on second-metal-layer, and the surface of the laminate is surface of second-metal-layer where first-metal-layer is formed, and surface of first-metal-layer, followed by curing the material, and removing second-metal-layer to form plate structure to which first-metal-layer in pattern is formed; opening hole in cured material from surface of the plate structure opposite to surface thereof where first-metal-layer is formed, until the hole reaches first-metal-layer; filling the hole with electroconductive paste, to form the plate structure filled therewith; and laminating one plate structure filled therewith with the other plate structure filled therewith in manner that first-metal-layer of one plate structure filled therewith faces opening of the hole of other plate structure filled therewith, wherein first-metal-layer contains metal different from second metal. | 01-29-2015 |