Patent application number | Description | Published |
20080260322 | Optical splitter/coupler and optical communication system - An optical splitter/coupler has: a multimode waveguide having an electrooptic effect, and propagating light in a multimode; one incident waveguide propagating light in a single mode, and inputting the light to the multimode waveguide; one pair of emitting waveguides guiding-out, in a single mode, lights which have propagated-in through the multimode waveguide; at least one pair of individual electrodes provided so as to be positioned in vicinities of respective side edges on one surface of the multimode waveguide; and a ground electrode provided on another surface, wherein the multimode waveguide has a length such that 3(n+1) bright spots arise at a central portion and at both side edge portions due to incident light, the individual electrodes are provided at positions corresponding to an upstream-most one pair of the bright spots, and the emitting waveguides are connected to positions corresponding to a downstream-most one pair of the bright spots. | 10-23-2008 |
20090046977 | WAVEGUIDE DEVICE AND OPTICAL NETWORK SYSTEM - A waveguide device comprises a first multimode waveguide; a second multimode waveguide; a pair of intermediate single mode waveguides; an input-side single mode waveguides connected to the first multimode waveguide; a pair of output-side single mode waveguides connected to the second multimode waveguide; a pair of switching electrodes disposed to be superposed on the pair of intermediate single mode waveguides; and a ground electrode. The intermediate single mode waveguides are configured by a material whose refractive index is changed by voltages applied to the switching electrodes, the first multimode waveguide splits an optical signal into two signals whose intensities are equal, and the second multimode waveguide is formed, when voltages are not applied to the switching electrodes, to guide the optical signals out from the output-side single mode waveguides that are provided positions diagonal to the intermediate single mode waveguides through which the optical signals are propagated. | 02-19-2009 |
20090148111 | OPTICAL WAVEGUIDE ELEMENT - An optical waveguide element includes: an optical waveguide including an organic non-linear optical material; a first electrode arranged on one surface side of the optical waveguide; a second electrode arranged on another surface side of the optical waveguide; a protective member disposed on the second electrode, the protective member including (i) a third electrode which is provided on a first surface of the protective member, the first surface facing the second electrode, the third electrode being electrically connected to the second electrode, (ii) a fourth electrode which is provided on a second surface of the protective member, the second surface opposing the first surface, and (iii) a conductive portion which penetrates through the protective member from the first surface to the second surface, and electrically connects the third electrode and the fourth electrode. | 06-11-2009 |
20100226605 | WAVEGUIDE ELEMENT AND METHOD OF PRODUCTION THEREOF - There is provided a method of producing a waveguide element comprising steps of forming a lower cladding layer having a refractive index n | 09-09-2010 |
20100265503 | OPTICAL DEVICE AND MULTIPLE BEAM SCANNER - There is provided an optical device including: a passive core layer in which is formed an optical circuit having a refractive index n | 10-21-2010 |
20110076800 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - The reliability of a semiconductor device is improved. A sealing resin (sealed body) is formed between a sub-substrate (first base member) and a base substrate (second base member) that are provided individually and distinctly to be integrated therewith, and then, the sub-substrate is electrically coupled to the second base member. As a means for electrically coupling the sub-substrate to the base substrate, lands (first lands) formed on the sub-substrate and lands (second lands) formed on the base substrate are disposed such that the respective positions thereof are aligned. After through holes are formed from the lands of the sub-substrate toward the lands of the base substrate, a solder member (conductive member) is formed in each of the through holes. | 03-31-2011 |
20110089563 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step. | 04-21-2011 |
20110140105 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A surface mount type semiconductor device is disclosed. The semiconductor device has testing lands on a lower surface of a wiring substrate with a semiconductor chip mounted thereon. Lower surface-side lands with solder balls coupled thereto respectively and testing lands with solder balls not coupled thereto are formed on a lower surface of a wiring substrate. To suppress the occurrence of contact imperfection between the testing lands and land contacting contact pins provided in a probe socket, the diameter of each testing land is set larger than the diameter of each lower surface-side land. Even when the wiring substrate is reduced in size, electrical characteristic tests using the testing lands can be done with high accuracy. | 06-16-2011 |
20120212566 | LIGHT EMITTING COMPONENT, PRINT HEAD, AND IMAGE FORMING APPARATUS - A light emitting component includes plural of light emitting elements arranged in rows on a substrate, plural lenses provided to face light emitting faces to which light beams of the plural light emitting elements are emitted, and condensing the light beams emitted from the light emitting elements, and one or plural pedestals holding the lenses such that the light emitting faces of the respective light emitting elements of the plural light emitting elements and the lenses that face the light emitting elements face the light emitting faces via gaps. | 08-23-2012 |
20130059417 | METHOD FOR MANUFACTURING A PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR DEVICE - Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step. | 03-07-2013 |
20140077391 | SEMICONDUCTOR DEVICE - A semiconductor device in which a plurality of semiconductor chips having different planar sizes are stacked with a degree of freedom in design of each of the semiconductor chips is provided. A logic chip, a redistribution chip, and a memory chip having a larger planar size than the logic chip are mounted over a wiring board. The logic chip and the memory chip are electrically connected via the redistribution chip. The redistribution chip includes a plurality of front surface electrodes formed to a front surface facing the wiring board, and a plurality of back surface electrodes formed to a back surface opposite to the surface. The redistribution chip has a plurality of through silicon vias, and a plurality of lead wirings formed to the front surface or the back surface and electrically connecting the plurality of through silicon vias and the front surface electrodes or the back surface electrodes. | 03-20-2014 |
Patent application number | Description | Published |
20080251897 | SEMICONDUCTOR DEVICE - The reliability of the semiconductor device which has the structure which stores a plurality of semiconductor chips with which plane sizes differ in the same sealing body in the state where they are accumulated via the insulating film which has adhesive property is improved. | 10-16-2008 |
20080254574 | SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME - By preparing a package substrate which has a plurality of lands of NSMD structure, and the output wiring and dummy wiring which were connected to each of the lands, and have been arranged mutually in the location of 180° symmetry, and printing solder by a printing method to the lands after the package assembly, the variation in the height of the solder coat between lands can be reduced, and improvement in the mountability of LGA (semiconductor device) is achieved. | 10-16-2008 |
20080303674 | Holder with Wireless Ic Tag and Tire with Wireless Ic Tag - Communication between a scanner and a wireless IC tag is performed with certainty. An installation hole is formed in the side surface of a tire and a holder with wireless IC tag | 12-11-2008 |
20100311205 | SEMICONDUCTOR DEVICE - The reliability of the semiconductor device which has the structure which stores a plurality of semiconductor chips with which plane sizes differ in the same sealing body in the state where they are accumulated via the insulating film which has adhesive property is improved. | 12-09-2010 |
20110159641 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The reliability of the semiconductor device which has the structure which stores a plurality of semiconductor chips with which plane sizes differ in the same sealing body in the state where they are accumulated via the insulating film which has adhesive property is improved. | 06-30-2011 |
20120022271 | NOVEL METHOD FOR PRODUCING OPTICALLY ACTIVE PYRROLIDINE COMPOUND | 01-26-2012 |
20130102628 | CRYSTAL OF FUSED PYRIDINE COMPOUND SALT - [Problem] A salt or crystal of a compound which is highly stable in a solid state and useful as a bulk material for the preparation of a pharmaceutical product is provided. | 04-25-2013 |
Patent application number | Description | Published |
20090016105 | NONVOLATILE MEMORY UTILIZING MIS MEMORY TRANSISTORS CAPABLE OF MULTIPLE STORE OPERATIONS - A nonvolatile semiconductor memory device includes a latch configured to store data, a plurality of word lines, a driver configured to activate one of the plurality of word lines, and a plurality of nonvolatile memory cells coupled to the respective word lines, each of the nonvolatile memory cells coupled to the latch so as to exchange stored data with the latch upon activation of a corresponding one of the word lines, each of the nonvolatile memory cells including two MIS transistors and configured to store data as an irreversible change of transistor characteristics occurring in one of the two MIS transistors, wherein the driver includes at least one nonvolatile memory cell storing count data responsive to a number of times storing of data has been performed with respect to the plurality of nonvolatile memory cells, and is configured to activate one of the word lines indicated by the count data. | 01-15-2009 |
20090213664 | NONVOLATILE MEMORY UTILIZING MIS MEMORY TRANSISTORS WITH FUNCTION TO CORRECT DATA REVERSAL - A nonvolatile semiconductor memory device includes a latch circuit having two nodes, a nonvolatile memory cell including two MIS transistors, a bit swapping unit configured to provide straight connections between the two nodes and the two MIS transistors during a first operation mode and to provide cross connections between the two nodes and the two MIS transistors during a second operation mode, and a control circuit configured to cause, in one of the first and second operation modes, the nonvolatile memory cell to store the data latched in the latch circuit as an irreversible change of transistor characteristics occurring in a selected one of the two MIS transistors, and further configured to cause, in another one of the first and second operation modes, the latch circuit to detect the data stored in the nonvolatile memory cell. | 08-27-2009 |