Patent application number | Description | Published |
20080210007 | Angular velocity sensor - An angular velocity sensor includes: a first tuning-fork vibrator having a first base and first aims extending from the first base in a first direction; a second tuning-fork vibrator having a second bass and second arms extending from the second base in a second direction; and a double gimbal portion mat has a drive gimbal portion vibrating about an axis extending in a fourth direction, and a sense gimbal portion vibrating about an axis extending in a fifth direction and senses an angular velocity about an axis extending in a third direction. | 09-04-2008 |
20080237757 | MICRO MOVABLE DEVICE, WAFER, AND METHOD OF MANUFACTURING WAFER - A micro movable device is made by processing a material substrate of a multilayer structure including a first layer, a second layer having a finely rough region on its surface on the side of the first layer, and an intermediate layer provided between the first and the second layer. The micro movable device includes a first structure formed in the first layer and a second structure formed in the second layer. The second structure includes a portion opposing the first structure via a gap and having a finely rough region on the side of the first structure, and being relatively displaceable with respect to the first structure. | 10-02-2008 |
20080316187 | Touch panel device and method for manufacturing touch panel devices - Each of transducers of a touch panel device includes a piezoelectric thin film, a plate electrode disposed at one surface of the piezoelectric thin film and a comb-like electrode disposed at the other surface of the piezoelectric thin film. The comb-like electrode has a plurality of comb-like electrode fingers and a linear bus electrode to which one end of each of the plural comb-like electrode fingers is connected. A plurality of wiring electrodes is provided at the outer side of any of the transducers in parallel with the bus electrode of the transducer and is connected to the bus electrode and the plate electrode of any of the transducers. Each of the wiring electrodes includes an electrode base portion formed by printing silver paste containing fine particles on the substrate and an electrode main body formed by printing silver paste containing large particles and fine particles in a mixed manner on the electrode base portion. | 12-25-2008 |
20090139328 | Packaged micro movable device and method for making the same - A method is provided for making packaged micro-devices each including a micro movable element, a first packaging member formed with a recess, and a second packaging member formed with another recess. The micro movable element has a movable part. In accordance with the method, a device wafer is prepared for forming a plurality of micromovable elements. A first packaging wafer, formed with a plurality of recesses corresponding in position to the movable parts of the respective movable elements, is bonded to one surface of the device wafer. A second packaging wafer, formed with a plurality of recesses, is bonded to the other surface of the device wafer. The resulting laminate assembly is cut into separate products. | 06-04-2009 |
20100024547 | ANGULAR SPEED SENSOR AND ELECTRONIC APPARATUS - An angular speed sensor includes two oscillating portions arranged to oscillate in X-axis direction and Y-axis direction, where the oscillating portions are spaced from each other in X-axis direction. The sensor also includes two coupling beams capable of producing a standing wave oscillation, elongated in X-axis direction and spaced from each other in Y-axis direction, with the oscillating portions located therebetween. The coupling beams are connected to a supporting substrate via fixing posts. The coupling beams are bridged by first and second link portions, the first link portion being also connected to one of the oscillating portions and the second link portion to the other. The fixing posts are connected to the coupling beams at fixed points of the standing wave oscillation. The link portions include widened portions connected to the coupling beams at the fixed points of the standing wave oscillation. | 02-04-2010 |
20100067208 | Packaged device and method of fabricating packaged-device - A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer. | 03-18-2010 |
20100085332 | TOUCH PANEL DEVICE AND CONTACT POSITION DETECTION METHOD - A burst wave is applied to an excitation element of a touch panel main body from an oscillation section so as to excite surface acoustic waves, and the excited surface acoustic waves are received by a receiving element of the touch panel main body. The received signals are A/D converted by a receiving section, and a control section calculates the contact position and the contact width of the object in contact with the touch panel main body, based on time-series changes in the received strength. Based on the received strength of surface acoustic waves, the control section controls the wave number of the burst wave to be applied to the excitation element. | 04-08-2010 |
20100218977 | PACKAGED DEVICE AND PRODUCING METHOD THEREOF - A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface. A metal concentration of at least part of a peripheral surface in the insulating layer is higher than a metal concentration of an end surface on the device substrate side in the insulating layer. An outline of the first surface is retreated inward from an outline of the second surface. | 09-02-2010 |
20110096462 | VARIABLE CAPACITIVE ELEMENT, VARIABLE CAPACITIVE DEVICE, AND METHOD FOR DRIVING THE VARIABLE CAPACITIVE ELEMENT - A variable capacitive element includes a first fixed electrode and a second fixed electrode that are insulated from each other, a movable electrode arranged to face the first fixed electrode and the second fixed electrode, a dielectric layer provided between the movable electrode and the first fixed electrode as well as the second fixed electrode, a first wiring part for applying a first driving voltage to the first fixed electrode with reference to a potential of the movable electrode, and a second wiring part for applying a second driving voltage to the second fixed electrode with reference to the potential of the movable electrode, the second driving voltage having a polarity different from a polarity of the first driving voltage. | 04-28-2011 |
20110216469 | METHOD FOR FABRICATING MEMS DEVICE AND MEMS DEVICE - There is provided a method for fabricating a device, preferably for a micro electro electro mechanical system. The method includes forming a first electrode on a substrate, where the first electrode has a first sloped end at least at one end thereof; forming a sacrificial layer on the first electrode, where the sacrificial layer has a first sloped edge, the first sloped edge and the first sloped end are overlapped each other so that a thickness of the first sloped edge decreases as a thickness of the first sloped end increases; forming a first spacer on the first electrode, where the first spacer has contact with the first sloped edge; forming a beam electrode on the sacrificial layer and the first spacer; and removing the sacrificial layer after the forming the beam electrode. | 09-08-2011 |
20110221300 | ELECTROSTATIC ACTUATOR AND DRIVING METHOD THEREOF - A driving method for driving an electrostatic actuator including a fixed electrode and a movable electrode opposing each other with a dielectric layer interposed therebetween, includes applying a first voltage, between the fixed electrode and the movable electrode, to bring the movable electrode into contact with the dielectric layer, and applying a second voltage, between the fixed electrode and the movable electrode, after application of the first voltage is stopped and before the movable electrode moves away from the dielectric layer. Here, the second voltage has a polarity opposite to a polarity of the first voltage and an absolute value smaller than an absolute value of the first voltage. | 09-15-2011 |
20130010447 | PACKAGED DEVICE AND METHOD OF FABRICATING PACKAGED-DEVICE - A method includes forming grooves in first regions included in a first wafer to form wiring regions defined by the grooves; forming insulating portions in the grooves; joining a surface of the first wafer on which the wiring regions are formed to a first surface of a device wafer including device forming regions after forming the insulating portions; forming through holes in the wiring regions of the first wafer after joining the first wafer to the device wafer, the holes extending through the first wafer; filling the holes with a conductive material; joining a second wafer to a second surface of the device wafer opposite the first surface, the second wafer including second regions; exposing the wiring regions by thinning the first wafer after joining the first wafer to the device wafer; and cutting the device wafer, the first wafer, and the second wafer after thinning the first wafer. | 01-10-2013 |