Patent application number | Description | Published |
20110148544 | DIRECTIONAL COUPLER - A directional coupler includes a dielectric substrate having at least an input terminal and an output terminal on a surface thereof, a main line disposed in the dielectric substrate and extending between the input terminal and the output terminal, a first coupling line for monitoring a level of an input signal which is input through the input terminal, the first coupling line being disposed in the dielectric substrate and having an end electrically connected to a first terminating resistor, and a second coupling line for monitoring a level of a reflected signal which is input through the output terminal, the second coupling line being disposed in the dielectric substrate and having an end electrically connected to a second terminating resistor. | 06-23-2011 |
20110169590 | COMBINER FOR DOHERTY AMPLIFIER - A combiner for a Doherty amplifier includes, on and in a dielectric substrate, a carrier input terminal, a peak input terminal, an output terminal, a combining point for combining an output signal from the carrier amplifier and an output signal from the peak amplifier, a first λ/4 line connected between the carrier input terminal and the combining point, a second λ/4 line connected between the combining point and the output terminal, and a first directional coupler. The first directional coupler includes a third λ/4 line electromagnetically coupled to one, to be monitored, of the first λ/4 line and the second λ/4 line. | 07-14-2011 |
20120019334 | IMPEDANCE MATCHING DEVICE - The present invention intends to provide a small-sized impedance matching device with a small variation in quality and large-current tolerance. The above described intention of the present invention is achieved by an impedance matching device, which comprises a wiring portion comprising a conductor pattern for wiring, embedded inside or formed on the surface of first dielectric material, and either one or both of an inductor portion comprising a conductor pattern for inductor, embedded inside or formed on the surface of the first dielectric material, or a capacitor portion comprising at least one pair of conductor patterns for capacitor and second dielectric material with a dielectric constant larger than that of the first dielectric material, existing between the pair of conductor patterns for capacitor wherein the thicknesses of the conductor pattern for wiring and the conductor pattern for inductor are 20 μm or more. | 01-26-2012 |
20130026636 | LAMINATED AND SINTERED CERAMIC CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE INCLUDING THE CIRCUIT BOARD - A circuit board that can decrease thermal stress acting between a semiconductor element and a board in association with temperature alteration and has high mechanical strength (rigidity) as a whole board (including a multilayer wiring layer) is provided. Ceramic base material having a coefficient of thermal expansion close to that of a semiconductor element and inner layer wiring are integrally sintered, and the circuit board is configured so that fine-lined conductor structure corresponding to a multilayer wiring layer in the inner layer wiring has predetermined width, intralayer interval and interlayer interval. Thereby, thermal stress acting between a semiconductor element and the board when the board is exposed to temperature alteration in a condition where it is joined with the semiconductor element is suppressed, rigidity of the board is maintained, and its reliability against temperature cycle is increased. | 01-31-2013 |
20130094165 | HIGH-CAPACITY MODULE INCLUDING THE PERIPHERAL CIRCUIT USING THE CIRCUIT BOARD AND THE CIRCUIT BOARD CONCERNED FOR PERIPHERAL CIRCUITS OF A HIGH-CAPACITY MODULE | 04-18-2013 |
20130146339 | CIRCUIT BOARD FOR HIGH-CAPACITY MODULES, AND A PRODUCTION METHOD OF THE CIRCUIT BOARD - A circuit board including a substrate having first and second dielectric layers of first and second dielectrics, the second dielectric containing 8 mass % or more of a glass net former component. At least one portion of an inner layer electrode has approximately two principal surfaces parallel to principal surfaces of the circuit board and a thickness of not less than 50 micrometers in a normal direction of the principal surfaces. The inner layer electrode and second dielectric layer contact with each other, and a ratio t/T of sum total thickness t of the second dielectric layer in contact with the inner layer electrode in a normal direction of the principal surface to sum total thickness T of the first dielectric layer in a normal direction of the principal surface is 0.1 or more. | 06-13-2013 |
20130148314 | CIRCUIT BOARD FOR PERIPHERAL CIRCUITS OF HIGH-CAPACITY MODULES, AND A HIGH-CAPACITY MODULE INCLUDING A PERIPHERAL CIRCUIT USING THE CIRCUIT BOARD - A drive circuit is laminated via a high exothermic element disposed on a power circuit, and it is configured so that the average thermal expansion coefficient of the side of the power circuit of the drive circuit board may be larger than the average thermal expansion coefficient of the side opposite to the power circuit. Thereby, the drive circuit board will be curved in the same direction as the power circuit board when the power circuit board is curved due to heat generation from the high exothermic element accompanying the operation of the module. Thereby, in a high-capacity module, while attaining reduction in size and weight, reduction in serge, and reduction in a loss, poor junction between the high exothermic element of the power circuit and the drive circuit board can be suppressed and heat generating from the high exothermic element can be more effectively released. | 06-13-2013 |
20130196842 | GLASS-CERAMIC COMPOSITE MATERIAL - The present invention is directed to stably achieve a good thermal conductivity in a glass-ceramic composite material in which aluminum nitride particles are used as filler particles. | 08-01-2013 |
20140055973 | CIRCUIT BOARD FOR PERIPHERAL CIRCUITS OF HIGH-CAPACITY MODULES, AND A HIGH-CAPACITY MODULE INCLUDING A PERIPHERAL CIRCUIT USING THE CIRCUIT BOARD | 02-27-2014 |