Patent application number | Description | Published |
20100079965 | PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS HAVING PRINTED CIRCUIT BOARD - According to an aspect of the present invention, there is provided a printed circuit board including: a semiconductor package including a parallelepiped body, and solder balls provided on a face of the parallelepiped body; a printed wiring board including a mounting face, the mounting face configured to mount the plurality of solder balls; a first bonding member including a first glass transition temperature, the first bonding member disposed around the parallelepiped body and configured to bond the semiconductor package and the printed wiring board; an electronic component mounted on the mounting face on an opposite side to the semiconductor package with respect to the first bonding member; and a second bonding member including a second glass transition temperature that is higher than the first glass transition temperature, the second bonding member disposed onto the mounting face to cover the electronic component. | 04-01-2010 |
20100237493 | PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS HAVING A PRINTED CIRCUIT BOARD - A printed circuit board including: a semiconductor package including a main body including a substantially rectangular parallelepiped shape, and a plurality of solder balls on one face of the main body; a board including a first face, a second face, and a hole portion, the first face including a mounting area where the plurality of solder balls are configured to be attached, the second face being opposite to the first face, the hole portion being formed around the mounting area and connected to a conductive pattern, the conductive pattern being configured to be connectable to an electronic component mounted on the board; and a bonding portion configured to bond the semiconductor package to the board, the bonding portion including a portion disposed in the hole portion. | 09-23-2010 |
20110026230 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a printed wiring board accommodated in the housing, and a circuit component electrically connected to the printed wiring board, the circuit component including an outer peripheral surface. The printed wiring board includes an outer peripheral edge, at least a pair of edge portions extending in mutually crossing directions, the pair of edge portions being opposed to the outer peripheral surface of the circuit component and being located inside the outer peripheral edge, and a projection portion located between the pair of edge portions and projecting toward the circuit component. | 02-03-2011 |
20110147075 | Electronic Apparatus - According to one embodiment, an electronic apparatus includes a housing having electric insulation properties, and a circuit element installed in the housing and including a plurality of connection terminals, wherein the housing includes an inner surface including a mounting region on which the circuit element is mounted, a plurality of adhesive filled portions in the mounting region, which are separated by a division wall in order to correspond to the connection terminals of the circuit element, and through which the connection terminals are inserted, and a plurality of traces provided on the inner surface of the housing, one ends of the traces running through the adhesive filled portions, wherein the adhesive filled portions of the housing are filled with conductive adhesive which fix the circuit element to the mounting region, and wherein the connection terminals are electrically connected to the traces by the conductive adhesive. | 06-23-2011 |
20110149531 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing having electric insulation properties, a substrate installed in the housing, a trace provided on an inner surface of the housing, and a connector including a connector body formed of an elastic body and compressed between the inner surface of the housing and the substrate, and a conductor buried in the connector body so as to penetrate the connector body, the connector electrically connecting the trace and a terminal of the substrate by the conductor. The housing includes a holder integrally formed therewith, the holder defining an attachment position of the connector. The holder protrudes from the inner surface of the housing in such a manner as to support the substrate and controls a degree of compression of the connector body. | 06-23-2011 |
20120026702 | Electronic Apparatus - According to one embodiment, there is provided an electronic apparatus, including: an electrically-insulative housing having a first part and a second part attachable to and detachable from the first part; a circuit board housed in the housing; a signal wire formed on an inner face of the second part; and a connector formed to electrically connect the signal wire and a terminal part of the circuit board. | 02-02-2012 |
20120026712 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a signal wiring and an electronic component. The signal wiring is provided on a first surface which is an inner surface of the housing. The electronic component is accommodated in the housing and includes a conductive member for electrical continuity with the signal wiring. The conductive member is formed on a surface of the electronic component facing the first surface of the housing. The electronic component is fixed to the first surface of the housing by a conductive adhesive agent having conductivity so that the conductive member has electrically continuity with the signal wiring. The electronic component is fixed to the first surface of the housing by a reinforcing adhesive agent having adhesive strength higher than the conductive adhesive agent. | 02-02-2012 |
20120057279 | Electronic Apparatus - According to one embodiment, an electronic apparatus includes a housing, a wiring pattern, a recess, a pad portion, and an electronic component. The wiring pattern is formed on an inner surface of the housing from an electrically conductive adhesive. The recess is in the inner surface of the housing. The pad portion is formed in the recess from the conductive adhesive and connected to an end portion of the wiring pattern. The electronic component includes a terminal which contacts the pad portion. | 03-08-2012 |
20120060134 | Wiring Design Support Apparatus and Wiring Design Support Method - According to one embodiment, a wiring design support apparatus comprises a display, a drawing module, and a data creation module. The display is configured to display a three-dimensional object. The drawing module is configured to draw a line connecting two points on a surface of the three-dimensional object displayed by the display. The data creation module is configured to create first three-dimensional data indicating a wiring based on the line drawn by the drawing module. | 03-08-2012 |
20120318572 | ENDOSCOPE DEVICE AND CIRCUIT BOARD - An endoscope device includes: a circuit board including a mounting surface; an electronic component including a bottom surface facing the mounting surface and a lateral portion; a first electrode mounted across a corner portion of the bottom surface and the lateral portion; a second electrode adjacent to the first electrode and mounted across the bottom surface and the lateral portion; a third electrode mounted on the mounting surface to face the first electrode, including an edge portion following the lateral portion and located outside of a first area of the mounting surface covered by the electronic component, and having a wider area than that of the first electrode and soldered to the first electrode; and a fourth electrode mounted on the mounting surface to face the second electrode, including an edge portion following the lateral portion and located outside of the first area, and soldered to the second electrode. | 12-20-2012 |
20120323076 | ENDOSCOPE APPARATUS AND ELECTRONIC APPARATUS - According to one exemplary embodiment, an endoscope apparatus includes: an insertion unit that is an object to be disinfected by boiling; an operation unit connected to the inertion part; a main unit connected to the operation unit; a first circuit board embedded in the main unit; a first electronic component electrically connected to the first circuit board via a first solder; a second circuit board embedded in at least any one of the insertion unit and the operation unit; a second electronic component electrically connected to the second circuit board via a second solder having higher stress resistance than that of the first solder; and a bonding member bonded to the second electronic component and the second circuit board, the bonding member having a glass transition point higher than that of the second circuit board. | 12-20-2012 |