Patent application number | Description | Published |
20110084299 | LED LIGHT SOURCE AND MANUFACTURING METHOD FOR THE SAME - An LED light source can include protection members to protect bonding wires. The LED can include a substrate including electrode patterns, a sub mount substrate located on the substrate, at least one flip LED chip mounted on the sub mount substrate and a phosphor rein covering the LED chip. The bonding wires can connect each of the electrode patterns to conductor patterns connecting to electrodes of the LED chip. The protection members can be located so as to surround both sides of the bonding wires. In addition, because each height of the protection members is higher than each maximum height of the bonding wires and is lower than a height of the phosphor resin, the protection members can protect the bonding wires from external pressure while the light flux is not reduced. Thus, the disclosed subject matter can provide a reliable LED light source having a favorable light distribution. | 04-14-2011 |
20110116271 | LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME - In the production of a light emitting device, in which a plurality of light emitting element parts carrying LED elements are formed on a substrate, and the substrate is diced, generation of shaving dusts is suppressed at the time of the dicing, and breakage of the substrate during the production process can be prevented. In the process of forming a slit crossing a region for forming a light emitting element part in a metal substrate, a recess which serves as a resin reservoir can be formed so as to cross the slit. The slit can be filled with an insulating material, the recess can be filled with a resin, and they both can be cured. A light emitting element part can be formed in the region for forming the light emitting element part, the metal substrate can be cut into units comprising one or a plurality of the light emitting element parts, and can be mounted on a printed circuit board on which a pattern is formed. | 05-19-2011 |
20110133236 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A light emitting device that can radiate heat generated by a semiconductor light emitting element and/or a resin layer at not only a position directly under the light emitting element, but also a position remote from such a position with respect to the main plane direction is provided. In the light emitting device, a light emitting element is carried on a substrate, and a resin covers the light emitting element. An anisotropic heat conduction material showing a heat conductivity for the substrate main plane direction larger than that for the substrate thickness direction is carried on the substrate. A side of the anisotropic heat conduction material contacts with the resin. Thereby, the anisotropic heat conduction material can receive heat of the resin, conduct it along the main plane direction, and radiate it to the substrate at a position remote from the light emitting element and/or the resin. As the anisotropic heat conduction material, for example, one or more laminated layers of graphite in the form of sheet are used. | 06-09-2011 |
20120188772 | LIGHT-EMITTING DEVICE, METHOD FOR PRODUCING THE SAME, AND ILLUMINATING DEVICE - A light-emitting device having an LED element and a resin layer including a convex portion covering the LED element can suppress color unevenness to achieve light emission with uniform color distribution. The light-emitting device can include a substrate, an LED element mounted on the substrate, a resin layer which contains a wavelength conversion material and is formed on the substrate to cover the LED element, the resin layer including a convex portion directly covering the LED element and a flat thin film portion extending around the convex portion, and a reflective portion which is formed over the thin film portion around the convex portion. A diffusion portion can be formed to cover the convex portion of the resin layer. | 07-26-2012 |
20140153276 | LIGHT EMITTING DEVICE AND VEHICLE LAMP - A light emitting device can include a base portion including a surface, a back surface, and a first through hole penetrating the surface and the back surface. A light-transmitting member can be fixed to the surface so as to cover the first through hole. A semiconductor light emitting element can emit light to pass through the first through hole and for irradiating the light-transmitting member. An optical system can be provided for condensing the light from the semiconductor light emitting element and locally irradiating the light-transmitting member with the light. A foil body can be provided and can include a second through hole for light emitted from the light-transmitting member to pass through and has elasticity. The light-transmitting member can be sandwiched between the foil body around the second through hole and the base portion with part of the light-transmitting member exposed from the second through hole. | 06-05-2014 |
20140197445 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device including a favorable radiating structure can include a semiconductor light source sealed between a metallic cap having a light-emitting window and a metallic base attached on a heat sink plate. The semiconductor light-emitting device can also include a holder attaching the metallic base along the metallic cap between the holder and the heat sink plate to efficiently radiate heat generated from the light source, and a thermal interface material layer disposed between at least a top surface of the heat sink plate and an outer bottom surface of the holder so as to be able to enlarge each tolerance of parts composing the light-emitting device. Thus, the disclosed subject matter can provide semiconductor light-emitting devices including the favorable radiating structure, which can be employed for various lighting apparatuses including a headlight in a relatively small size by selecting the semiconductor light source incorporated in the devices. | 07-17-2014 |
20140268787 | LIGHT-EMITTING DEVICE - A light-emitting device can have high heat dissipation performance from a light-transmitting member and be capable of easily making alignment of the light-transmitting member and an incidence hole for light into the light-transmitting member. The light-emitting device can include: a base; a light-emitting element held by the base; a lens held by the base and disposed above the light-emitting element, configured to condense light emitted from the light-emitting element; a first tubular member disposed on the base; a second tubular member fitted into the first tubular member; a holder allowed to be inserted into the second tubular member and thereby fitted into the second tubular member and having a through hole through which light condensed by the lens passes; and a light-transmitting member formed on the holder so as to block the through hole. | 09-18-2014 |
20140376246 | VEHICLE HEADLIGHT AND OPTICAL FIBER BUNDLE USED IN VEHICLE HEADLIGHT - An optical fiber bundle is used in a vehicle headlight, the optical fiber bundle being configured by binding a plurality of optical fibers. Each optical fiber can include a core having an incident end face on which a laser beam is made incident and an emission end face from which the laser beam is emitted. A clad can surround the core. Emission end faces of the respective plurality of optical fibers can be arranged adjacent to one another on a substantially same plane to create an emission end face group, an external shape of which is a substantial rectangle. | 12-25-2014 |