Patent application number | Description | Published |
20110068445 | CHIP PACKAGE AND PROCESS THEREOF - A chip package and a process thereof are provided. The chip package includes a lead frame, a heat sink, a chip and a molding compound. The lead frame includes a chip pad and a plurality of leads, wherein the chip pad has a first surface and a second surface opposite thereto. The heat sink has a third surface and a fourth surface opposite thereto, wherein the lead frame is disposed on the third surface of the heat sink through the second surface of the chip pad, and the fourth surface of the heat sink is exposed. The chip is disposed on the first surface of the chip pad and electrically connected to each of the chip pad and the leads. The molding compound encapsulates the chip, the chip pad, the heat sink and a portion of each of the leads. | 03-24-2011 |
20120248606 | INTEGRATED CIRCUIT DEVICE - An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit, a second circuit, at least one interconnect line and an electrostatic discharge protection circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically connected to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically connected to the second circuit. The first internal bonding pad is electrically connected to the second internal bonding pad via the bonding wire. The first internal bonding pad is electrically connected to the electrostatic discharge protection circuit via the interconnect line. The electrostatic discharge protection circuit is electrically connected to the external bonding pad which is used for electrically connecting an external package lead. | 10-04-2012 |
20120306064 | CHIP PACKAGE - A chip package including a lead frame, a heat sink, a chip and a molding compound is provided. The lead frame includes a chip pad and a plurality of leads, wherein the chip pad has a first surface and a second surface opposite thereto. The heat sink has a third surface and a fourth surface opposite thereto, wherein the lead frame is disposed on the third surface of the heat sink through the second surface of the chip pad, and the fourth surface of the heat sink is exposed. The chip is disposed on the first surface of the chip pad and electrically connected to each of the chip pad and the leads. The molding compound encapsulates the chip, the chip pad, the heat sink and a portion of each of the leads. | 12-06-2012 |
20130093081 | IC CHIP PACKAGE AND CHIP-ON-GLASS STRUCTURE USING THE SAME - An IC chip package and a chip-on-glass structure using the same are provided. The IC chip package includes an IC chip having a circuit surface, and plural copper (Cu) bumps formed on the circuit surface. Moreover, a non-conductive film (NCF) could be formed on the circuit surface to cover the Cu bumps. The chip-on-glass structure includes a glass substrate, plural electrodes such as aluminum (Al) electrodes formed on the glass substrate, and a conductive film formed on the electrodes. The conductive film contains a number of conductive particles. When the IC chip package is coupled to the glass substrate, the Cu bumps can be coupled to the corresponding electrodes via conductive particles. | 04-18-2013 |
20130292819 | CHIP-ON-FILM DEVICE - A chip-on-film device including a flexible circuit film having a wire, a passivation layer having a hole, an adhesive layer, a pad, an interconnection, and a bump is provided. A part of the adhesive layer is disposed in the hole. The pad is disposed under the passivation layer, and a part of the pad is disposed under the hole. A part of the interconnection is disposed under the passivation layer, and disposed at a side of the pad, wherein the interconnection does not touch the pad. A part of the bump is disposed on the adhesive layer. The bump is electrically connected to the pad via the adhesive layer. The bump is welded on the wire. A part of a first part of the bump overlaps the pad, and a second part of the bump extends to an outside of the pad and at least partially overlaps the interconnection. | 11-07-2013 |
20140048935 | INTEGRATED CIRCUIT DEVICE - An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit and a second circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically coupled to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically coupled to the second circuit. The second internal bonding pad is electrically coupled to the first internal bonding pad via the bonding wire. The external bonding pad is electrically coupled to the first internal bonding pad. | 02-20-2014 |
20150069602 | CHIP-ON-FILM DEVICE - A chip-on-film device including a flexible circuit film having a wire, a passivation layer having a hole, an adhesive layer, a first pad, a second pad, an interconnection, and a bump is provided. A part of the adhesive layer is disposed in the hole. The first pad and the second pad are disposed under the passivation layer. | 03-12-2015 |