Taejoo
Taejoo Chang, Daejeon KR
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20160072833 | APPARATUS AND METHOD FOR SEARCHING FOR SIMILAR MALICIOUS CODE BASED ON MALICIOUS CODE FEATURE INFORMATION - An apparatus and method for searching for similar malicious code based on malicious code feature information. The apparatus includes a malicious code registration unit for registering input new malicious code as a new malicious code sample, and extracting and registering detailed information of the new malicious code sample, a malicious code analysis unit for analyzing the detailed information of the new malicious code sample, a malicious code DNA extraction unit for extracting malicious code DNA information including malicious code feature information, a malicious code DNA comparison unit for comparing the extracted malicious code DNA information with malicious code DNA information of prestored malicious code samples, and calculating similarities therebetween, and a similar malicious code search unit for calculating, based on the calculated similarities, all similarities between the new malicious code sample and prestored malicious code samples, and extracting a specific number of malicious code samples. | 03-10-2016 |
Taejoo Hwang, Yongin-Si KR
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20140291830 | SEMICONDUCTOR PACKAGES HAVING PACKAGE-ON-PACKAGE STRUCTURES - A semiconductor package includes a lower package with a lower semiconductor chip on a lower package substrate, and an upper package with an upper semiconductor chip on an upper package substrate. The upper semiconductor chip has a plurality of chip pads and the upper package substrate has a plurality of substrate pads. The upper package is stacked on the lower package. The chip pads have a first pitch and the substrate pads have a second pitch greater than the first pitch. The upper package substrate has a plurality of connection lines that electrically connect the substrate pads to the chip pads. | 10-02-2014 |
20150155268 | SEMICONDUCTOR PACKAGE DEVICE - A semiconductor package device, comprising: a package substrate having a first width; first and second semiconductor packages sequentially mounted on the package substrate; and a connection structure connecting the first and second semiconductor packages electrically to each other. The first semiconductor package comprises: a first substrate facing the package substrate and having a second width smaller than the first width; a first semiconductor chip between the first substrate and the package substrate; a conductive structure electrically connecting the first semiconductor chip to the package substrate; and a bonding wire electrically connecting the first substrate to the first semiconductor chip. | 06-04-2015 |
Taejoo Hwang, Hwasung-City KR
Patent application number | Description | Published |
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20140327156 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor package and a method for manufacturing the same. The semiconductor package may include a substrate, a lower semiconductor chip disposed on an inner surface of the substrate, and an upper semiconductor chip disposed on the lower semiconductor chip. A plurality of connection terminals may be disposed between the substrate and the lower semiconductor chip to electrically connect the lower semiconductor chip to the substrate. The upper semiconductor chip may have a lower surface which faces the substrate and an upper surface which opposes the lower surface. Bonding wires may pass through the windows to connect the lower surface of the upper semiconductor chip to an outer surface of the substrate. | 11-06-2014 |
Taejoo Kim, Seoul KR
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20110037712 | ELECTRONIC DEVICE AND CONTROL METHOD THEREOF - A mobile terminal is presented. The mobile terminal includes a display module, a short-range communication module configured to perform short-range communication, and a controller configured to search for at least one device available for short-range communication via the short-range communication module, acquire location information of the at least one searched other electronic device, and display the at least one searched electronic device reflecting the acquired location information on the display module. | 02-17-2011 |