Patent application number | Description | Published |
20090166061 | PCB strip, PCB strip assembly device using the PCB strip, a method of using the PCB strip assembly device, and a method of fabricating a PCB strip - A PCB strip, a PCB strip assembly device, and methods of fabricating a PCB strip and using a PCB strip assembly device are provided. According to example embodiments, a PCB strip may include a PCB main body including a working area based on a process execution unit, wherein the working area may be divided into a first working area and a second working area and a plurality of units on the working area arrayed with a given interval in at least a width direction of the PCB main body, wherein the plurality of units may be arrayed on the first working area and the second working area and units on the first working area may be symmetric to units on the second working area with respect to a point of symmetry at a center of width of the working area. | 07-02-2009 |
20100136747 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - Provided is a method for manufacturing a semiconductor package. The method includes providing a first substrate having a first top surface on which a chip pad is formed and a first bottom surface opposite to the first top surface. The method additionally includes removing a portion of the first top surface to form a sawing groove, and forming a conductive pattern on the first substrate. Also, the method includes removing a portion of the first bottom surface to divide the first substrate into a plurality of semiconductor chips having a redistribution pattern formed of a portion of the conductive pattern, and mounting a selected one of the plurality of semiconductor chips on a second substrate having a second top surface on which a lead is formed. The method further includes forming an interconnector electrically connecting the lead to the redistribution pattern. | 06-03-2010 |
20110068481 | PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME - Provided are a semiconductor package and a method for fabricating the same. The semiconductor package includes a lower package comprising a lower substrate, a lower semiconductor chip mounted on the lower substrate and comprising a redistribution, and a molding layer molding the lower semiconductor chip, an upper package comprising an upper substrate and an upper semiconductor chip mounted on the upper substrate, with the upper package being stacked on the lower package. The semiconductor package further includes an electrical interconnector extending from the upper substrate into the molding layer and connected to the redistribution to electrically connect the upper and lower packages to each other, and a dummy interconnector extending from the upper substrate into the molding layer to physically couple the upper and lower packages to each other. | 03-24-2011 |
20110207266 | PRINTED CIRCUIT BOARD (PCB) INCLUDING A WIRE PATTERN, SEMICONDUCTOR PACKAGE INCLUDING THE PCB, ELECTRICAL AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE PCB, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE - A printed circuit board (PCB) includes a wire pattern that has a low processing cost and a high yield by simplifying the structure of the PCB and can increase the joining characteristics and reliability of minute bumps when a flip-chip bonding process is performed. The PCB includes a body resin layer having lower and upper surfaces, a wire pattern on or in one of the upper and lower surfaces of the body resin layer, at least one through-hole contact extending from the wire pattern through the body resin layer, and a solder resist on the upper and lower surfaces of the body resin layer, openings of the solder resist corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a semiconductor chip. If the solder ball land is on the one-layer wire pattern, the bump land is on the through-hole contact, and if the bump land is on the wire pattern, the solder ball land is on the through-hole contact. | 08-25-2011 |
20120038035 | SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A semiconductor package may include a package substrate having a first surface and a boundary that may be defined by edges of the package substrate. The package further includes a first semiconductor chip having a front surface and a back surface. The back surface of a first portion of the first semiconductor chip may be disposed on the first surface of the package substrate with the back surface of a second portion of the first semiconductor chip extending beyond of the defined boundary of the package substrate. The semiconductor package may also include a second semiconductor chip disposed on the back surface of the second portion of the first semiconductor chip that extends beyond the defined boundary of the package substrate. | 02-16-2012 |
20120307445 | PRINTED CIRCUIT BOARD (PCB) INCLUDING A WIRE PATTERN, SEMICONDUCTOR PACKAGE INCLUDING THE PCB, ELECTRICAL AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE PCB, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE - A printed circuit board (PCB) includes a wire pattern that has a low processing cost and a high yield by simplifying the structure of the PCB and can increase the joining characteristics and reliability of minute bumps when a flip-chip bonding process is performed. The PCB includes a body resin layer having lower and upper surfaces, a wire pattern on or in one of the upper and lower surfaces of the body resin layer, at least one through-hole contact extending from the wire pattern through the body resin layer, and a solder resist on the upper and lower surfaces of the body resin layer, openings of the solder resist corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a semiconductor chip. | 12-06-2012 |
20130032948 | SEMICONDUCTOR DEVICE INCLUDING SUBSTRATE HAVING GROOVES - A semiconductor device including a substrate having grooves is provided. The semiconductor device includes a substrate including a first surface, a second surface opposite to the first surface, an opening penetrating from the first surface to the second surface, and a first groove formed at a side of the opening, a semiconductor chip formed on the opening at the first surface of the substrate and flip-chip bonded to the first surface by a plurality of first external connection terminals, and a molding unit filling a region between the substrate and the semiconductor chip, filling the opening and filling at least a portion of the first groove, and covering the semiconductor chip. | 02-07-2013 |
20130270717 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package includes a circuit board comprising a first surface and a second surface opposite the first surface. A first semiconductor chip is stacked on the first surface and a second semiconductor chip stacked on the first semiconductor chip. A region of the second chip protrudes beyond a side of the first semiconductor chip. A support underpins the protruding region of the second chip. The support may be, for example, dry film solder resist dam. | 10-17-2013 |
20140091463 | SEMICONDUCTOR PACKAGE APPARATUS - According to example embodiments of inventive concepts, a semiconductor package apparatus includes a first semiconductor package including a first substrate, a first solder resist layer on the first substrate, and a first sealing member that covers and protects the first solder resist layer, and a plurality of solder balls on the first substrate. The plurality of solder balls includes a first solder ball having a first height and a second solder ball having a second height that is different from the first height. The first sealing member includes holes that expose the solder balls. | 04-03-2014 |
Patent application number | Description | Published |
20090097546 | SYSTEM AND METHOD FOR ENHANCED VIDEO COMMUNICATION USING REAL-TIME SCENE-CHANGE DETECTION FOR CONTROL OF MOVING-PICTURE ENCODING DATA RATE - Disclosed is a method for detecting a scene change in real time in order to control a moving-picture encoding data rate, the method including: dividing a current frame into a plurality of regions, and calculating a dissimilarity metric (DM) of each divided region; determining if the dissimilarity metric of each divided region is beyond a preset reference value; calculating the number of regions, the dissimilarity metric of which is beyond the preset value, in the current frame; and determining that a scene change occurs in the current frame, when the number of regions, the dissimilarity metric of which is beyond the reference preset value, is equal to or greater than a preset threshold value. | 04-16-2009 |
20100027566 | METHOD FOR COMPRESSING A REAL-TIME TRANSPORT PROTOCOL HEADER EXTENSION FIELD - A method for compressing an extension field to be selectively included in a Real-time Transport Protocol (RTP) header is provided. It is determined whether an RTP header extension field is included in the RTP header. Information indicating a determination result is recorded. Profile information of the RTP header extension field is recorded. Total length information of the RTP header extension field is recorded. Information indicating whether changed data exists is recorded using a header extension information map. | 02-04-2010 |
20100135490 | METHOD AND APPARATUS FOR PERFORMING VIDEO COMMUNICATION - A method for performing video communication is provided. The method includes: creating and saving a bio key using a user's biological information before first and second terminals perform the video communication; establishing a session, wherein the first terminal requests voice communication with the second terminal; exchanging bio keys saved in the respective terminals and saving the same; starting a Secure Real-Time Transport Protocol (SRTP) session, wherein the first and second terminals create a session sharing key using the exchanged bio keys; creating a restored bio key by obtaining the biological information from data received by first and second terminals and performing a user certification by comparing the bio key with the restored bio key. | 06-03-2010 |
20100142927 | AUDIO AND VIDEO SYNCHRONIZATION APPARATUS AND METHOD IN WIRELESS COMMUNICATION NETWORK - An audio and video synchronization apparatus and method in a wireless communication network are provided. The audio and video synchronization apparatus includes a receiver that receives audio frames and video frames, a playback buffer that sequentially buffers the audio frames, a detector that determines whether the audio frames are synchronized with the video frames and adjusts a playback time of the video frames based on a playback time of the audio frames if it is determined the audio frames are not synchronized with the video frames. | 06-10-2010 |
20100259596 | APPARATUS AND METHOD FOR TRANSMITTING STEREOSCOPIC IMAGE DATA - A method and apparatus transmitting stereoscopic image data according to a variable channel environment are provided. The method includes granting a priority to each of a plurality of frames constituting one image group; determining a number of transmittable frames based on a variable channel environment; and selecting transmittable frames from among the plurality of frames based on the determined number of transmittable frames and the granted priories | 10-14-2010 |
20100262712 | CHANNEL ADAPTIVE VIDEO TRANSMISSION METHOD, APPARATUS USING THE SAME, AND SYSTEM PROVIDING THE SAME - A video transmission method is provided, which includes receiving state information from at least one mobile terminal that intends to perform a video stream service through a wireless network, determining a size of an image by selecting a specified spatial layer bit stream on the basis of the state information of the mobile terminal from a plurality of spatial layer bit streams generated at different bit rates during encoding of the bit stream, selecting a specified time and an SNR layer bit stream by increasing or decreasing time of the image and a layer position of the SNR layer bit stream on the basis of network parameters included in the state information of the mobile terminal, and transmitting the bit stream generated by extracting the specified layer bit stream of the selected layer to the mobile terminal. | 10-14-2010 |
20100290483 | APPARATUS AND METHOD FOR TRANSMITTING STEREOSCOPIC IMAGE DATA - A method for transmitting stereoscopic images using a variety of transport protocols is provided. To this end, a stereoscopic image packet is defined that comprises a stereoscopic packet header and a stereoscopic video packet header. The defined stereoscopic packet header and stereoscopic video packet header are used to transmit metadata needed for transmission of stereoscopic images. By doing so, it is possible to ensure compatibility with a variety of transport protocols. | 11-18-2010 |
20110211700 | DEVICE AND METHOD FOR SECURITY KEY EXCHANGE AND SYSTEM PERTAINING TO SAME - The present invention relates to a device and method that enable a security key to be shared using security key exchange between two terminals, and a system that supports the same. To achieve the above, an in-house generated public key is divided into two, said two public keys that have been divided are delivered to counterpart devices via different pathways, and the two public keys delivered from counterpart devices are used to predict the public key of the counterpart device. In addition, said predicted public key is verified, and said verified public key is used to form a master key. Subsequently, said generated master key is verified, and said master key that has been verified is used to exchange data with the counterpart device. | 09-01-2011 |