Patent application number | Description | Published |
20100135157 | METHOD AND APPARATUS FOR CONTROLLING TRAFFIC ACCORDING TO USER - There is provided a method and apparatus for controlling traffic according to user that includes a statistics processing unit measuring traffic volume used according to user, calculating a traffic variation ΔV by using the measured traffic volume, and updating a traffic user list by comparing the calculated traffic variation ΔV; a traffic detecting unit determining whether abnormal traffic is generated in a network and transferring a control command according to priority in the traffic user list; and a packet controlling unit controlling a user's traffic according to the control command received from the traffic detecting unit. | 06-03-2010 |
20100135182 | HIGH-SPEED IP FLOW MEDIATION APPARATUS USING NETWORK PROCESSOR - There is provided a high-speed IP flow mediation apparatus using a network processor. The apparatus includes a server collecting flow information regarding IP traffic on a high-speed line and a network processor board analyzing the collected information according to Internet applications using a network processor, and transferring the analyzed flow information to a plurality of flow analysis systems. | 06-03-2010 |
20100158007 | METHOD AND APPARATUS FOR AGGREGATING SINGLE PACKETS IN A SINGLE SESSION - A method and apparatus for aggregating single packets in a single session are disclosed. If the amount of single packets in a single session exceeds a threshold value, it is detected that attack traffic is being inputted and the single packets in the single session are aggregated into a single flow, thus preventing degradation of a network performance due to the single packets in the single session. | 06-24-2010 |
20110149793 | TRAFFIC CAPTURE APPARATUS AND TRAFFIC ANALYSIS APPARATUS, SYSTEM AND METHOD - Provided are a traffic capture apparatus and a traffic analysis apparatus, system and method. The traffic analysis system generates a two-way flow based on one or more packets captured through a network and associates the two-way flow with a corresponding application program by using information about transmission directions and payload sizes of payload packets, each of which has a payload in the two-way flow. | 06-23-2011 |
Patent application number | Description | Published |
20090059498 | Electronic appliance and method for manufacturing the same - An electronic appliance to achieve an increased rigidity thereof with a simplified manner without any change in design and configuration and a method for manufacturing the same. The electronic appliance includes a case defining the outer appearance of the electronic appliance, and a printed circuit board disposed in the case and having electronic elements mounted thereon. A resin is filled between the case and the printed circuit board. | 03-05-2009 |
20100243309 | Connecting structure for circuit board and connecting method using the same - Disclosed is a connection structure for a circuit board using a solder bump to arrange circuit boards. The circuit board connection structure includes a solder bump prepared on one of two circuit boards and a perforated part formed at the other of the circuit boards to receive the solder bump. Facing both circuit boards towards each other and inserting the solder bump into the perforated part, the circuit boards are desirably arranged. | 09-30-2010 |
20100248505 | Printed circuit board assembly and connecting method thereof - Disclosed herein is a printed circuit board and a connecting method thereof. The connecting method of the circuit board assembly may include molding the printed circuit board assembly by applying a resin to the printed circuit board assembly, exposing ends of the electrode terminals of a connector mounted on a printed circuit board by partially removing the molded printed circuit board assembly, and connecting a connection member to the exposed ends of the electrode terminals of the connector. Therefore, even if the whole of the printed circuit board assembly is molded, the connection member may be freely connected to the connector of the printed circuit board assembly. | 09-30-2010 |
20120018186 | CASE STRUCTURE HAVING FILM TYPE ELECTRONIC CIRCUIT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case. | 01-26-2012 |
20120043116 | Interconnection Structure Of Interposer With Low CTE And Packaging Component Having The Same - Disclosed herein are printed circuit board assemblies made of a brittle material such as silicon, glass or ceramic and provided with a connector to electrically connect the same to an external connection member, and a method for molding the printed circuit board assembly wherein the printed circuit board assembly is molded by applying a polymer resin thereto to impart hardness to the printed circuit board assembly, and an electrode terminal to connect the same to the external connection member is exposed to the outside. Disclosed herein is also an interconnection structure of an interposer, the interconnection structure electrically connected to a main printed circuit board (PCB) through a solder joint is interposed between the interposer and the solder joint to prevent or reduce concentration of stress on the solder joint caused by differences in coefficients thermal expansion between the interposer and the main PCB. | 02-23-2012 |
20120045910 | MOLDING METHOD OF PRINTED CIRCUIT BOARD ASSEMBLY - Disclosed is a printed circuit board assembly PBA on which a connector for electrical connection to an external connection element is mounted. Such an assembly may be formed with a molding method of a PBA which includes applying a polymer resin to the PBA to mold the PBA in order to offer stiffness thereto. The foregoing method of molding the PBA according to the present disclosure is a molding method of a PBA including a PCB and a connector mounted on the PCB to electrically connect the same to an external connection element. The method includes combining the connector with a connector cover, applying a resin to the PBA combined with the connector cover to execute molding of the PBA, and separating the connector cover from the molded PBA to expose the electrode terminal for an external connection element. | 02-23-2012 |
20120075823 | DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - A display panel and a method of manufacturing the same are provided. The display panel includes a plurality of chip panels, each chip panel having an upper surface, a lower surface disposed parallel to the upper surface, a side surface between the upper surface and the lower surface and a connection portion between the side surface and at least one of the upper surface and the lower surface, the connection portion having a rounded configuration, and an adhesive layer interposed between the chip panels in order to vertically stack the chip panels to connect the chip panels. Therefore, in the display panel, the strength of the edge portion can be improved. Also, by forming a connection portion, a stress can be suppressed from being concentrated at the edge portion by an external mechanical stress. | 03-29-2012 |
20120212917 | Three-Dimensional Stack Structure Of Wafer Chip Using Interposer - The three-dimensional stack structure includes a printed circuit board, a first wafer chip mounted on the printed circuit board, a second wafer chip stacked above the first wafer chip, and first interposers interposed between the second wafer chip and the printed circuit board. The first interposers are configured to electrically connect the second wafer chip to the printed circuit board. | 08-23-2012 |
20130077265 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer. | 03-28-2013 |
20130285185 | IMAGE SENSOR PACKAGE - An image sensor package and image sensor chip capable of being slenderized while enhancing the reliability with respect to physical impact are provided. The image sensor package includes an image sensor chip provided with a pixel domain at a central portion of an upper surface thereof, a substrate disposed at an upper side of the image sensor chip so as to be flip-chip bonded with respect to the image sensor chip, provided with a hole formed at a position corresponding to the pixel domain, and formed of organic material, a printed circuit board at which the substrate provided with the image sensor chip bonded thereto is mounted, and a solder ball configured to electrically connect the substrate to the printed circuit board. | 10-31-2013 |