Patent application number | Description | Published |
20090277674 | Printed circuit board and manufacturing method thereof - A printed circuit board and a manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board can include: forming surface roughness on an insulation layer, coating a chemical compound onto the insulation layer that lowers the surface energy of the insulation layer, and forming a circuit pattern by inkjet printing on the insulation layer coated with the chemical compound. Certain embodiments of the invention can be utilized to improve adhesive strength between the insulation layer and the inkjet-printed circuit patterns, suppress spreading in the inkjet-printed circuit patterns to improve resolution, and reduce manufacturing costs by forming the circuits using inkjet printing. | 11-12-2009 |
20100051329 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed are a printed circuit board and a method of manufacturing the same. The method in accordance with an embodiment of the present invention includes: forming an electroless plated layer on an insulation layer; and forming a circuit pattern by applying conductive ink on the electroless plated layer through an inkjet method. | 03-04-2010 |
20110030999 | METAL CIRCUIT WIRING HAVING ORGANIC RESIN FOR ADHESIVE LAYERS AND METHOD OF MANUFACTURING THE SAME - The invention is to provide a metal circuit wiring having an organic adhesive layer, the metal circuit wirings comprising: an organic adhesive layer formed with a resin selected from the group consisting of acrylic resin, chloroprene rubber and silicone rubber resin; and metal wiring patterns formed with an ink composition including metal nanoparticles, in which the metal wiring exhibits excellent adhesive between metal nano materials and the substrate and electrical property. | 02-10-2011 |
20110040014 | INKJET INK COMPOSITION - The invention is to provide a metal ink composition for ink-jet and more particularly, a metal ink composition which causes no formation of cracks on a PCB substrate, allows a low curing temperature, and provides improved adhesive strength even after coating. | 02-17-2011 |
20120146318 | ANCHOR PRETENSIONER STRUCTURE FOR CARS - An anchor pretensioner structure for cars, may include an inflator mounted on a car-body plate to pull a seat belt upon a collision, a pretensioner wire made of a flexible material and connected to the inflator, a protector mounted to the pretensioner wire coupled to the seat belt, and an angle-adjuster to selectively rotate the pretensioner wire, depending upon whether or not a passenger may be sitting on a seat, so that the pretensioner wire may be allowed to rotate by a predetermined angle. | 06-14-2012 |
20130038048 | ANCHOR PRETENSIONER STRUCTURE FOR CARS - An anchor pretensioner structure for cars, may include an inflator mounted on a car-body plate to pull a seat belt upon a collision, a pretensioner wire made of a flexible material and connected to the inflator, a protector mounted to the pretensioner wire coupled to the seat belt, and an angle-adjuster to selectively rotate the pretensioner wire, depending upon whether or not a passenger may be sitting on a seat, so that the pretensioner wire may be allowed to rotate by a predetermined angle. | 02-14-2013 |
20140183728 | WAFER SUPPORTING STRUCTURE, INTERMEDIATE STRUCTURE OF A SEMICONDUCTOR PACKAGE INCLUDING THE WAFER SUPPORTING STRUCTURE - A wafer supporting structure includes a supporting substrate for supporting a wafer, a release layer for detaching the wafer from the supporting substrate, and an adhesive layer for attaching the wafer to the supporting substrate. | 07-03-2014 |
20150024574 | TEMPORARY BONDING ADHESIVE COMPOSITIONS AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME - A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane. | 01-22-2015 |