Patent application number | Description | Published |
20110031608 | POWER DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME - Disclosed is a power device package, which has high heat dissipation performance and includes an anodized metal substrate including a metal plate having a cavity formed on one surface thereof and an anodized layer formed on both the surface of the metal plate and the inner wall of the cavity and a circuit layer formed on the metal plate, a power device mounted in the cavity of the metal plate so as to be connected to the circuit layer, and a resin sealing material charged in the cavity of the metal plate. A method of fabricating the power device package is also provided. | 02-10-2011 |
20110075374 | RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided. | 03-31-2011 |
20110083885 | METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME - Disclosed herein is a metal wiring structure, including: an electroless nickel plating layer formed on an insulation layer; and a surface treatment layer formed on the electroless nickel plating layer, and a method of fabricating the same. The metal wiring structure has excellent adhesivity without regard to the kind of substrate and can be easily fabricated. | 04-14-2011 |
20110088928 | HEAT DISSIPATING SUBSTRATE - Disclosed is a heat dissipating substrate, which includes a metal plate, an insulating film formed on the surface of the metal plate, a circuit pattern formed on the insulating film, and a first via formed to pass through at least a part of the metal plate so that the metal plate and the circuit pattern are electrically connected to each other, and also which exhibits superior heat dissipation effects and enables the configuration of a circuit board to be simple due to no need to additionally provide a ground layer and a power layer. | 04-21-2011 |
20110255307 | APPARATUS AND METHOD FOR CONTROLING POWER QUALITY OF POWER GENERATION SYSTEM - There are provided an apparatus and a method for controlling the power quality of a power generation system. According to the present invention, there is provided an apparatus for controlling the power quality of a power generation system including a DC/AC inverter converting DC voltage into AC voltage and supplying inverter current to a grid, including: a grid voltage phase follower generating a grid signal; a fundamental extractor extracting a magnitude of a fundamental wave of a load current introduced into a non-linear load connected between the DC/AC inverter and the grid; a first calculator subtracting a preset current compensation value from the magnitude of the fundamental wave from the fundamental extractor; and a second calculator generating an inverter current instruction value for the DC/AC inverter by using the output value of the first calculator and the grid signal and the load current from the grid voltage phase follower. | 10-20-2011 |
20110316035 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed is a heat-dissipating substrate, which includes a base substrate including a metal layer, an insulating layer formed on one surface of the metal layer, and a circuit layer formed on the insulating layer, a heat sink layer formed on the other surface of the metal layer, a connector for connecting the base substrate and the heat sink layer to each other, an opening formed in a direction of thickness of the base substrate and into which the connector is inserted, and an anodized layer formed on either or both of the other surface and a lateral surface of the metal layer, and in which the metal layer and the heat sink layer are insulated from each other by means of the anodized layer, thus preventing transfer of static electricity or voltage shock to the metal layer. A method of manufacturing the heat-dissipating substrate is also provided. | 12-29-2011 |
20120162931 | 3D POWER MODULE PACKAGE - Disclosed herein is a 3D power module package, including: a power converting unit packaged to include a heat radiating substrate, a power device connected to the heat radiating substrate, and a lead frame; a controlling unit packaged to include a controlling unit substrate and IC and controlling devices mounted on an upper portion of the controlling unit substrate; and an electrical connecting unit electrically connecting the packaged power converting unit and the packaged controlling unit. | 06-28-2012 |
20130037967 | SEMICONDUCTOR PACKAGE SUBSTRATE - Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive. | 02-14-2013 |
20130045550 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a package substrate for optical elements, including: a conductive substrate including an insulation layer formed thereon; a circuit layer which is formed on the conductive substrate | 02-21-2013 |
20130118787 | EPOXY RESIN COMPOSITION FOR FORMING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD MANUFACTURED THEREFROM, AND METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD - Disclosed herein is an epoxy resin composition including a core-shell structure of microemulsion silica surrounded by surfactant. By using the epoxy resin, surface roughness of a printed circuit board can be formed in an ecofriendly and economic manner. Further, high-reliability microcircuits can be realized by enhancing interface adhesive strength between a resin substrate and a metal layer in a buildup type printed circuit board. | 05-16-2013 |
20130133926 | BUILD-UP PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a build-up printed circuit board (PCB), the method including: providing a first resin substrate; forming a roughness by coating an epoxy emulsion solution on a surface of the first resin substrate; and providing a core layer by forming a core circuit layer on the first resin substrate on which the roughness is formed. According to the present invention, roughness of a substrate can be formed in an environment-friendly and economical way by introducing a process of coating epoxy emulsion on a resin substrate. Further, a highly reliable fine circuit can be implemented by enhancing an adhesive bond between a build-up board material and a metal circuit layer. | 05-30-2013 |
20130154069 | SEMICONDUCTOR PACKAGE - Disclosed herein is a semiconductor package, including: a first heat dissipation substrate; a first lead frame that is formed on the first heat dissipation substrate by patterning; a first semiconductor device formed on the first lead frame; a second semiconductor device that is stacked on the first semiconductor device; a second lead frame that is patterned and bonded to the second semiconductor device; and a second heat dissipation substrate formed on the first lead frame. | 06-20-2013 |
20130154070 | SEMICONDUCTOR PACKAGE - Disclosed herein is a semiconductor package. The semiconductor package includes: semiconductor elements, a first heat dissipation substrate formed under the semiconductor elements, a first lead frame electrically connecting the lower portions of the semiconductor elements to an upper portion of the first heat dissipation substrate, a second heat dissipation substrate formed over the semiconductor elements, and a second lead frame having a protrusion formed to be protruded from a lower surface thereof and electrically connecting the upper portions of the semiconductor elements to a lower portion of the second heat dissipation substrate. | 06-20-2013 |
20130209760 | ALKYL SULFONATED TETRAZOLE COMPOUND, PREPARING METHOD THEREOF, AND EPOXY RESIN CONTAINING THE SAME, AND SUBSTRATE PRODUCED THEREFROM - The present invention provides an alkyl sulfonated tetrazole compound, a method of preparing the same, an epoxy resin containing the same and a substrate produced therefrom. The epoxy resin is usefully used as a raw material of printed circuit boards, and has high adhesion to metal. | 08-15-2013 |
20130269991 | TOUCH PANEL - Disclosed herein is a touch panel. A touch panel | 10-17-2013 |
20130293485 | TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a touch panel, the method including: (A) supplying a raw glass plate; (B) forming an electrode layer on each of a plurality of a glass substrate unit areas on the raw glass plate; (C) forming a protection layer to cover the electrode layer on the glass substrate unit areas; (D) cutting the raw glass plate into the glass substrate units; and (E) tempering the cut glass substrate units. | 11-07-2013 |
20140016290 | TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a touch panel including: a first transparent substrate partitioned into an active area and a bezel area provided in edges of the active area; a mark formed so as to protrude on the bezel area; and a second transparent substrate coupled to the first transparent substrate so that at least one corner thereof corresponds to the mark. | 01-16-2014 |
20140113392 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate including an insulation layer formed thereon, and forming a circuit layer and electrode pads on the conductive substrate using a plating process. The method further includes selectively plating the circuit layer, in which the optical element is to be mounted, with a conductor to such a thickness that the optical element is buried, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon. | 04-24-2014 |
20140113393 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate, forming a cavity space in the conductive substrate, and forming an insulation layer on the conductive substrate. The method further includes the steps of forming a circuit layer and electrode pads on the conductive substrate using a plating process, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon. | 04-24-2014 |
Patent application number | Description | Published |
20080283989 | Wafer level package and wafer level packaging method - Provided are a wafer level package and a wafer level packaging method, which are capable of performing an attaching process at a low temperature and preventing contamination of internal devices. In the wafer level package, a device substrate includes a device region, where a device is formed, and internal pads on the top surface. The internal pads are electrically connected to the device. A cap substrate includes a getter corresponding to the device on the bottom surface. A plurality of sealing/attaching members are provided between the device substrate and the cap substrate to attach the device substrate and the cap substrate and seal the device region and the getter. The sealing/attaching members are formed of polymer. A plurality of vias penetrate the cap substrate and are connected to the internal pads. The getter provided in the sealed space defined by the sealing/attaching members can prevent the devices of the device region from being contaminated by moisture or foreign particles generated during the fabrication process, and the sealing/attaching process can be performed at a lower temperature compared with a typical sealing/attaching process using a metal. | 11-20-2008 |
20080286904 | Method for manufacturing semiconductor package - Provided is a method for manufacturing a semiconductor package. In the method, a wafer for a cap substrate is provided. The wafer for the cap substrate includes a plurality of vias and via electrodes on a lower surface. A wafer for a device substrate is provided. The wafer for the device substrate includes a circuit unit and a connection electrode on an upper surface. The wafer for the cap substrate and the wafer for the device substrate are primarily bonded by a medium of a primary adhesive. A trench is formed to expose the upper surface of the wafer for the device substrate to an outside along an outer edge of the primary adhesive. A secondary bonding operation is performed by a medium of a secondary adhesive to electrically connect the via electrode and the connection electrode. The wafer for the device substrate is diced along a virtual cut line. | 11-20-2008 |
20080290479 | Wafer level device package with sealing line having electroconductive pattern and method of packaging the same - Provided are wafer level package with a sealing line that seals a device and includes electroconductive patterns as an electrical connection structure for the device, and a method of packaging the same. In the wafer level package, a device substrate includes a device region, where a device is mounted, on the top surface. A sealing line includes a plurality of non-electroconductive patterns and a plurality of electroconductive patterns, and seals the device region. A cap substrate includes a plurality of vias respectively connected to the electroconductive patterns and is attached to the device substrate by the sealing line. Therefore, a simplified wafer level package structure that accomplishes electric connection through electroconductive patterns of a sealing line can be formed without providing an electrode pad for electric connection with a device. | 11-27-2008 |
20090013519 | METHOD FOR MANUFACTURING CRYSTAL DEVICE - A method for manufacturing a crystal device is provided. The method includes providing a package wafer including a plurality of internal and external connection terminals each having top and bottom ends respectively exposed to top and bottom surfaces of the package wafer; forming a height control member on the top end of the internal and external connection terminal and bonding one end of a crystal blank including an excitation electrode on the height control member; placing a bottom surface of a cap wafer having a cavity, which is open downward, on the top surface of the package wafer to which the crystal blank is mounted, and anodically bonding the package wafer with the cap wafer; and cutting the package wafer and the cap wafer in a direction across a bonding line formed by the bonding of the package wafer and the cap wafer to provide a plurality of crystal resonator that are individually separated. | 01-15-2009 |
20110042130 | Multilayered wiring substrate and manufacturing method thereof - A multilayered wiring substrate and a manufacturing method thereof are disclosed. The multilayered wiring substrate includes: a stacked body including an insulating member and first and second metal cores stacked with the insulating member interposed therebetween, and having a through hole penetrating the first and second metal cores; first and second insulation layers formed on an external surface, excluding an inner wall of the through hole, of the first and second metal cores, respectively; first and second inner layer circuit patterns and first and second outer layer circuit patterns formed on the first and second insulation layers, respectively; first and second via electrodes electrically connecting the first and second inner layer circuit patterns and the first and second outer layer circuit patterns; a third insulation layer formed on the inner wall of the through hole; and a through electrode made of a conductive material filled in the through hole and electrically connecting the first and second outer layer circuit patterns. | 02-24-2011 |
20110309684 | APPARATUS AND METHOD FOR THE ANTI-ISLANDING OF POWER CONDITIONING SYSTEM - There is provided an apparatus for the anti-islanding of a power conditioning system. The apparatus for the anti-islanding of a power conditioning system according to the present invention is applied to a power conditioning system including a DC/DC converter and a DC/AC inverter in order to transfer power from a solar cell array to a grid. The apparatus for the anti-islanding of a power conditioning system may include an injection signal generator generating an injection signal, an adder generating a final fundamental wave command value, a main controller performing the power control according to the final fundamental wave command value and stopping the operation of the power conditioning system when the level of the detected injection signal has reached the predetermined reference level or more, and an injection signal detector detecting the injection signal included in voltage and providing them to the main controller. | 12-22-2011 |
20120026758 | APPARATUS AND METHOD FOR CONTROLLING SWITCH OF FLYBACK CONVERTER FOR SOLAR GENERATING SYSTEM - There is provided an apparatus and method for controlling a switch of a flyback converter for a solar generating system. The apparatus for controlling a switch of a flyback converter for a solar generating system includes: an MPPT controller generating a current command value for a maximum power point tracker of a solar cell module, based on input voltage, input current, and output voltage of the flyback converter; a current controller generating a current control signal for tracking the current command value; an output current command value generator generating the phase and magnitude command value of the output current, based on the phase of the output voltage and the current control signal; and a switch controller controlling the main switch of the flyback converter, based on the phase and magnitude command value of the output current, thereby simplifying a circuit while solving disadvantages of a discontinuous conduction mode and a boundary conduction mode. | 02-02-2012 |
20120170320 | METHOD AND APPARATUS FOR GENERATING CURRENT COMMAND VALUE FOR TRACKING MAXIMUM POWER POINT IN SOLAR ENERGY GENERATING SYSTEM - There are provided a method and an apparatus for generating a current command value for tracking the maximum power point of a solar energy generating system. The apparatus includes: a voltage detector detecting a voltage input into the flyback power converter; a first calculator calculating an output power from the detected input voltage; a second calculator calculating a power variation based on the calculated output power and a voltage variation of the input voltage; and a current command value generator generating a current command value for tracking the maximum power point of the solar cell module from the calculated voltage variation and the calculated power variation. Accordingly, a current command value after calculating an output power may be generated with only a voltage detector, without a current detector, thereby reducing the costs of a solar energy generating system by decreasing the costs for a high-priced current detector, and simplifying circuit. | 07-05-2012 |
20130094267 | EVEN-LEVEL INVERTER - There is provided an even-level inverter, including: a voltage-dividing circuit dividing input DC power into an even number of voltage levels; a plurality of switching devices connected to individual nodes of the voltage-dividing circuit having the even number of voltage levels; and a bidirectional switching device connected to the individual nodes of the voltage-dividing circuit through at least one of the plurality of switching devices and including at least two transistors. According to the present invention, the bidirectional switching device is implemented without a diode to thereby reduce conduction loss caused due to an anti-parallel diode included in the related art bidirectional switching device, and a neutral point of the voltage-dividing circuit is electrically separated from the switching devices to thereby control reactive power. | 04-18-2013 |
20130157011 | RESIN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a resin substrate, including: an insulating material; and a resin layer formed on the insulating material and having surface roughness. | 06-20-2013 |
20140003093 | MULTI-LEVEL CONVERTER, AND INVERTER HAVING THE SAME AND SOLAR POWER SUPPLY APPARATUS HAVING THE SAME | 01-02-2014 |
20140003108 | MULTI-LEVEL CONVERTER, AND INVERTER HAVING THE SAME AND SOLAR POWER SUPPLY APPARATUS HAVING THE SAME | 01-02-2014 |
20140104227 | TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a touch panel and a method for manufacturing the same, the touch panel including: a transparent substrate; a photosensitive ink layer patterned on the transparent substrate and having electric conductivity; and electrode patterns formed at corresponding positions on the patterned photosensitive ink layer, and the method including: preparing a transparent substrate; coating a photosensitive ink having electric conductivity on the transparent substrate to form a photosensitive ink layer; patterning the photosensitive ink layer; and forming electrode patterns on the patterned photosensitive ink layer. | 04-17-2014 |
20140114067 | BENZIMIDAZOLE DERIVATIVES AS MITOCHONDRIAL FUNCTION MODULATORS - Provided are a benzimidazole derivative modulating mitochondrial functions and having pharmaceutical activity as a neuro-protective agent, and a pharmaceutical composition including the compound as an active ingredient. | 04-24-2014 |
20140118832 | TOUCHSCREEN PANEL - There is provided a touchscreen panel, including: a transparent substrate including a first area having a first surface roughness and a second area having a second surface roughness; and an ink layer formed on the second area, wherein the degree of second surface roughness is higher than the degree of first surface roughness. | 05-01-2014 |
20140145973 | TOUCH SCREEN MODULE AND METHOD OF MANUFACTURING THE SAME - There is provided a touch screen module including a glass substrate, a first photosensitive resin layer formed on the glass substrate and a bezel including a second photosensitive resin layer formed on the first photosensitive resin layer, and transparent electrodes simultaneously formed on both the glass substrate and the bezel. A residue phenomenon in which pigment particles included in the bezel remain on a surface of the glass substrate after exposure and development may be prevented. | 05-29-2014 |
20140176289 | ELECTROMAGNETIC INTERFERENCE FILTER AND METHOD OF MANUFACTURING THE SAME - There are provided an electromagnetic interference filter and a method of manufacturing the same. The electromagnetic interference filter includes a base core including a first base core and a second base core facing the first base core, a leg core including first and second leg cores disposed between the first base core and the second base core, the first and second leg cores facing each other, a winding coil part including first and second winding coils wound around the first and second leg cores, respectively, and connected to a power supply, the first and second winding coils respectively providing magnetizing inductance and leakage inductance, and a central core disposed between the first and second cores to provide an inductance leakage path between the first and second base cores. | 06-26-2014 |
20140176823 | TOUCH PANEL - Disclosed herein is a touch panel, including: a transparent substrate divided into an active area and a non-active area, which is an outer region of the active area; electrodes formed on one surface of the transparent substrate; and a bezel formed in the non-active area of one surface of the transparent substrate, wherein the bezel is formed of a bezel composition containing silane and a pigment. | 06-26-2014 |
20140198547 | MULTILEVEL INVERTER - There is provided a multilevel inverter capable of easily perform balancing of voltages by way of controlling switching of voltage dividing based on an offset between voltages divided by capacitors of a voltage dividing circuit. The multilevel inverter includes: a voltage dividing unit including a plurality of capacitors for dividing an input direct current (DC) voltage; an inverter unit switching the divided DC voltages to output a predetermined alternating current (AC) voltage; and a control unit providing a control signal for controlling switching of the inverter unit based on an offset between the voltages divided by the plurality of capacitors. | 07-17-2014 |
20150062983 | CHOKE COIL AND POWER SUPPLY DEVICE INCLUDING THE SAME - There is provided a choke coil, including: a core part having first and second legs; a winding part having a first coil wound around the first leg and a second coil wound around the second leg; and a sectioning wall partitioning the winding part into several winding regions. | 03-05-2015 |
20150115834 | SMART HOME NETWORK APPARATUS AND CONTROL METHOD THEREOF - A network apparatus is provided. The network apparatus includes a communication unit configured to perform communication with at least one device. The apparatus also includes a storage unit configured to store information for an illumination device located within a preset distance range from the at least one device. The apparatus further includes a controller configured to control a light-emitting state of the illumination device located within the preset distance range from the at least one device based on the information stored in the storage unit when a preset event occurs in the at least one device. | 04-30-2015 |
20150177171 | GAS SENSOR PACKAGE - There is provided a gas sensor package including: a lead frame; a readout integrated circuit device mounted on the lead frame; a gas sensor attached to one surface of the readout integrated circuit device; a micro electro mechanical system (MEMS) cap including an internal space receiving the gas sensor and attached to one surface of the readout integrated circuit device; and a mold part covering the lead frame, the readout integrated circuit device, and the MEMS cap, wherein an upper surface of the MEMS cap and an upper surface of the mold part are formed on the same plane. | 06-25-2015 |
Patent application number | Description | Published |
20090277674 | Printed circuit board and manufacturing method thereof - A printed circuit board and a manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board can include: forming surface roughness on an insulation layer, coating a chemical compound onto the insulation layer that lowers the surface energy of the insulation layer, and forming a circuit pattern by inkjet printing on the insulation layer coated with the chemical compound. Certain embodiments of the invention can be utilized to improve adhesive strength between the insulation layer and the inkjet-printed circuit patterns, suppress spreading in the inkjet-printed circuit patterns to improve resolution, and reduce manufacturing costs by forming the circuits using inkjet printing. | 11-12-2009 |
20100051329 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed are a printed circuit board and a method of manufacturing the same. The method in accordance with an embodiment of the present invention includes: forming an electroless plated layer on an insulation layer; and forming a circuit pattern by applying conductive ink on the electroless plated layer through an inkjet method. | 03-04-2010 |
20110030999 | METAL CIRCUIT WIRING HAVING ORGANIC RESIN FOR ADHESIVE LAYERS AND METHOD OF MANUFACTURING THE SAME - The invention is to provide a metal circuit wiring having an organic adhesive layer, the metal circuit wirings comprising: an organic adhesive layer formed with a resin selected from the group consisting of acrylic resin, chloroprene rubber and silicone rubber resin; and metal wiring patterns formed with an ink composition including metal nanoparticles, in which the metal wiring exhibits excellent adhesive between metal nano materials and the substrate and electrical property. | 02-10-2011 |
20110040014 | INKJET INK COMPOSITION - The invention is to provide a metal ink composition for ink-jet and more particularly, a metal ink composition which causes no formation of cracks on a PCB substrate, allows a low curing temperature, and provides improved adhesive strength even after coating. | 02-17-2011 |
20120146318 | ANCHOR PRETENSIONER STRUCTURE FOR CARS - An anchor pretensioner structure for cars, may include an inflator mounted on a car-body plate to pull a seat belt upon a collision, a pretensioner wire made of a flexible material and connected to the inflator, a protector mounted to the pretensioner wire coupled to the seat belt, and an angle-adjuster to selectively rotate the pretensioner wire, depending upon whether or not a passenger may be sitting on a seat, so that the pretensioner wire may be allowed to rotate by a predetermined angle. | 06-14-2012 |
20130038048 | ANCHOR PRETENSIONER STRUCTURE FOR CARS - An anchor pretensioner structure for cars, may include an inflator mounted on a car-body plate to pull a seat belt upon a collision, a pretensioner wire made of a flexible material and connected to the inflator, a protector mounted to the pretensioner wire coupled to the seat belt, and an angle-adjuster to selectively rotate the pretensioner wire, depending upon whether or not a passenger may be sitting on a seat, so that the pretensioner wire may be allowed to rotate by a predetermined angle. | 02-14-2013 |
20140183728 | WAFER SUPPORTING STRUCTURE, INTERMEDIATE STRUCTURE OF A SEMICONDUCTOR PACKAGE INCLUDING THE WAFER SUPPORTING STRUCTURE - A wafer supporting structure includes a supporting substrate for supporting a wafer, a release layer for detaching the wafer from the supporting substrate, and an adhesive layer for attaching the wafer to the supporting substrate. | 07-03-2014 |
20150024574 | TEMPORARY BONDING ADHESIVE COMPOSITIONS AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME - A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane. | 01-22-2015 |
Patent application number | Description | Published |
20090156221 | Handover method and apparatus in mobile network - A method and an apparatus for performing handover in a mobile communication network are provided. The method of performing handover in a mobile communication network includes: obtaining a service providing time period and a utility function on a candidate network basis; obtaining a selection function of each of the candidate networks using the utility function and the service providing time period; and selecting a network for handover among the plurality of mobile networks using the selection function. Therefore, in consideration of user satisfaction and a network service quality, utility functions are defined and by selecting a network for handover using the utility functions, a network suitable for a user environment can be effectively selected and thus it is possible to perform handover that has a performance and a cost suitable for user request and that can maximize a quality of a mobile service. | 06-18-2009 |
20100041404 | HANDOVER METHOD AND APPARATUS BASED ON HISTORY INFORMATION IN WIRELESS NETWORKS - A handover method in a plurality of wireless networks includes selecting one or more candidate networks from the plurality of wireless networks available to a mobile terminal of a user; calculating the latest connection time with a serving network currently serving the mobile terminal; deriving a history utility function based on the latest connection time; deriving system utility functions of the candidate networks in consideration of user and system environments; deriving selection functions for the candidate networks using the history utility function and the system utility functions; and selecting one of the candidate networks as a target network for handover using the selection functions. A target network for handover is selected using not only a system utility function reflecting user and system parameters but also a history utility function reflecting history information, thereby reducing the number of handovers and enhancing service quality. | 02-18-2010 |
20100201028 | Fabrication method of products with closed channels by injection molding - Disclosed is a fabrication method of products with closed channels by injection molding, which includes: a channel substrate mounting step of mounting a channel substrate comprising a plurality of opened micro-channels thereon to a mold; and a substrate cover molding step of molding a substrate cover by the injection molding on an upper surface of the channel substrate mounted to the mold, the substrate cover being coupled to the channel substrate while being molded. With this, the products with the closed channels can be fabricated without any additional coupling process between the channel substrate having the opened channels and the substrate cover, thereby simplifying a fabrication process and enhancing work efficiency. | 08-12-2010 |
20110017935 | THERMOELECTRIC CONVERSION MATERIAL AND ITS MANUFACTURING METHOD, AND THERMOELECTRIC CONVERSION DEVICE USING THE SAME - Disclosed is a new thermoelectric conversion material represented by the chemical formula 1: Bi | 01-27-2011 |
20120211045 | THERMOELECTRIC CONVERSION MATERIAL AND ITS MANUFACTURING METHOD, AND THERMOELECTRIC CONVERSION DEVICE USING THE SAME - Disclosed is a new thermoelectric conversion material represented by the chemical formula 1: Bi | 08-23-2012 |
20130001481 | Compound Semiconductors and Their Application - Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: In | 01-03-2013 |
20130009106 | COMPOUND SEMICONDUCTORS AND THEIR APPLICATION - Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: In | 01-10-2013 |
20130009107 | NEW COMPOUND SEMICONDUCTORS AND THEIR APPLICATION - Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: In | 01-10-2013 |
20130009108 | NEW COMPOUND SEMICONDUCTORS AND THEIR APPLICATION - Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: In | 01-10-2013 |
20130009112 | COMPOUND SEMICONDUCTORS AND THEIR APPLICATION - Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: In | 01-10-2013 |
20130009113 | COMPOUND SEMICONDUCTORS AND THEIR APPLICATION - Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: In | 01-10-2013 |
20130009114 | COMPOUND SEMICONDUCTORS AND THEIR APPLICATION - Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: In | 01-10-2013 |
20130009115 | COMPOUND SEMICONDUCTORS AND THEIR APPLICATION - Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: In | 01-10-2013 |
20130009116 | COMPOUND SEMICONDUCTORS AND THEIR APPLICATION - Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: In | 01-10-2013 |
20130009117 | NEW COMPOUND SEMICONDUCTORS AND THEIR APPLICATION - Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: In | 01-10-2013 |
20130015412 | COMPOUND SEMICONDUCTORS AND THEIR APPLICATION - Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: In | 01-17-2013 |
20130015413 | COMPOUND SEMICONDUCTORS AND THEIR APPLICATION - Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: In | 01-17-2013 |
20130069019 | COMPOUND SEMICONDUCTORS AND THEIR APPLICATION - Disclosed are new compound semiconductors which may be used for solar cells or as thermoelectric materials, and their application. The compound semiconductor may be represented by a chemical formula: In | 03-21-2013 |
20130238752 | APPARATUS AND METHOD FOR MANAGING CONTENT FOR CLOUD COMPUTING - A cloud service system includes at least one user device, a plurality of clouds for providing different cloud services, and a gateway connected between the user device and the clouds. The gateway selects at least one of the clouds according to predefined Service Level Agreement (SLA) information, and stores content provided from the user device to the selected cloud. | 09-12-2013 |
20130246616 | APPARATUS AND METHOD FOR DETERMINING SOURCE DEVICE IN CONTENTS SHARING SYSTEM - A method for determining a source and a transmission path to provide content includes receiving a message comprising at least one of channel information of a link between a request device which requests content download and a central management device, available resource amount information of a candidate device, channel information of a link between the candidate device and the central management device, and channel information of a link between the request device and one candidate device. The method also includes determining a source device and the transmission path for providing the content to the request device using an available resource amount of the candidate device, a data rate of the link between the request device and the central management device, a data rate of the link between the request device and the candidate device, and a data rate of the link between the candidate device and the central management device. | 09-19-2013 |
20130247223 | APPARATUS AND METHOD FOR ENSURING PRIVACY IN CONTENTS SHARING SYSTEM - A privacy protection policy is present in a content sharing system. A method for managing contents in a content sharing system includes receiving a content download request from a first account through a first device; and determining whether to carry out the download by considering at least one of a sharing range of a download-requested content, a content access right of the first account, a content access right of an owner account of the first device, a sharing range of a download folder, and sharing acceptance or rejection of an owner of the content. | 09-19-2013 |
20140000671 | THERMOELECTRIC CONVERSION MATERIAL AND ITS MANUFACTURING METHOD, AND THERMOELECTRIC CONVERSION DEVICE USING THE SAME | 01-02-2014 |
20140106221 | SILICON OXIDE FOR ANODE ACTIVE MATERIAL OF SECONDARY BATTERY - Provided is silicon oxide for an anode active material of a secondary battery. More particularly, the present invention provides silicon oxide included in an anode active material of a secondary battery, wherein a ratio of a maximum height (h | 04-17-2014 |
20140313972 | APPARATUS FOR PARTITIONING COMPRESSED SATELLITE IMAGE AND THE METHOD THEREOF - Disclosed an apparatus and method of partitioning compressed satellite image, and more specifically, the present invention relates to a technique for forming index information on the compressed satellite image using the starting point and the length of a compressed section so as to randomly access each compressed section in the wavelet-based compressed satellite image recommended through CCSDS. The present invention minimizes costs for long-term storage of the satellite image data by immediately indexing, partitioning, and storing the compressed satellite data in a storage without recovering the compressed satellite data, rapidly provides high-quality satellite images for users by minimizing information loss while recovering the compressed image, and thereby being effective for being able to reduce computing resources needed to recover the compressed image data. | 10-23-2014 |
20140322611 | ANODE ACTIVE MATERIAL HAVING HIGH CAPACITY FOR LITHIUM SECONDARY BATTERY, PREPARATION THEREOF AND LITHIUM SECONDARY BATTERY COMPRISING THE SAME - The anode active material of the present invention comprises an amorphous SiO | 10-30-2014 |
Patent application number | Description | Published |
20100268604 | METHOD AND SYSTEM FOR PROVIDING INFORMATION BASED ON LOGO INCLUDED IN DIGITAL CONTENTS - There are provided a method and a system for detecting a logogram from a digital content, recognizing the detected logogram, and providing a user with a variety of information associated with the logogram. In detail, the method and the system acquire a plurality of logograms associated with digital content producers, store the acquired logograms in a logogram database, compare the detected logogram with the logograms stored in the logogram database, determine whether the detected logogram matches any one of the logograms stored in the logogram database, and provide information to the user viewing the digital content or information on the content distribution to the corresponding digital content producer based on the logogram if the detected logogram matches at least one specific logogram stored in the logogram database. | 10-21-2010 |
20110108995 | SPIRAL STAIRCASE SHAPED STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A spiral staircase shaped stacked semiconductor package is presented. The package includes a semiconductor chip module, a substrate and connection members. The semiconductor chip module includes at least two semiconductor chips which have chip selection pads and through-electrodes. The semiconductor chips are stacked such that the chip selection pads are exposed and the through-electrodes of the stacked semiconductor chips are electrically connected to one another. The substrate has the semiconductor chip module mounted thereto and has connection pads. The connection members electrically connect the chip selection pads to respective connection pads. | 05-12-2011 |
20110247692 | Thin Film Type Solar Cell and Method for Manufacturing the Same - A thin film type solar cell and a method for manufacturing the same is disclosed, which is capable of improving cell efficiency through the use of a light-scattering film interposed between a substrate and a front electrode layer so as to increase a path length of solar ray in a semiconductor layer by refracting solar ray at various angles, the thin film type solar cell comprising the substrate; the light-scattering film including a bead and a binder, wherein the binder is provided to bind the bead; the front electrode layer on the light-scattering film; the semiconductor layer on the front electrode layer; and a rear electrode layer on the semiconductor layer. | 10-13-2011 |
20110251903 | METHOD, APPARATUS, AND COMPUTER READABLE RECORDING MEDIUM FOR ACQUIRING INFORMATION ON PRODUCTS ATTACHED TO PERSON IN IMAGE DATA - There are provided a method and an apparatus for acquiring information on products which are located on the body of a person appearing in image data. More particularly, a method and an apparatus for analyzing a posture of a person from image data, i.e., a face posture and a body posture of the person, displaying, according to information on the posture of the person, at least one of candidate regions in which products are attached to the body of the person in the image data on a screen of a terminal of a user, and, if the user selects any one of the candidate regions, providing the terminal with information on products same as or similar to an image of a specific product included in the selected candidate region. | 10-13-2011 |
20120001544 | LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed are a light emitting module and a method of manufacturing the light emitting module. The light emitting module includes: a heat radiating substrate which includes a metal substrate with through holes, an internal insulating layer formed along inner walls of the through holes, and an external insulating layer covering all outer surfaces of the metal substrate; a light emitting component unit disposed on a top surface of the heat radiating substrate; a driving circuit unit which is electrically connected to the light emitting component unit, and is mounted on the heat radiating substrate to apply a driving signal to the light emitting component unit; a passive component which is mounted on the heat radiating substrate and is electrically connected to the driving circuit unit; and circuit wiring layers which are disposed on a top and a bottom of the heat radiating substrate, respectively, and are interconnected therebetween through vias formed on the through holes with the internal insulating layer of the heat radiating substrate, and play a role of electrical interconnection of the driving circuit unit and the light emitting component unit, or the driving circuit unit and the passive component. | 01-05-2012 |
20120043875 | RADIANT HEAT SUBSTRATE AND METHOD FOR MANUFACTURING THE RADIANT HEAT SUBSTRATE, AND LUMINOUS ELEMENT PACKAGE WITH THE RADIANT HEAT SUBSTRATE - The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element. | 02-23-2012 |
20120062980 | COLOR ELECTRONIC PAPER DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a color electronic paper display device and a method for manufacturing the same. The color electronic paper display device according to the present invention includes: a barrier rib structure including a plurality of cavities partitioned so that rotating balls are separately inserted thereinto; an electrode structure including an upper electrode and a lower electrode each formed over and under the barrier rib structure and applying voltage to the rotating balls; and a black coating layer formed on the surfaces of the barrier ribs of the barrier rib structure. | 03-15-2012 |
20120075415 | METHOD AND SYSTEM FOR REMOVING REDUNDANCY FROM AMONG PANORAMIC IMAGES, AND COMPUTER-READABLE RECORDING MEDIUM - The present invention includes a method for removing redundancy of panoramic images. The method includes the steps of: (a) specifying respective locations of multiple panoramic images by referring to respective shooting places of the multiple panoramic images; (b) recognizing a specific object included in each of at least two panoramic images as the identical object by referring to the respective locations of the multiple panoramic images and respective directions of the specific object therein; and (c) determining top n images of the specific object considered to have top n degrees of precision in an image matching process among all the object images which are recognized as the identical object as a reference image(s) for the specific object. | 03-29-2012 |
20120076426 | METHOD AND SYSTEM FOR MATCHING PANORAMIC IMAGES USING A GRAPH STRUCTURE, AND COMPUTER-READABLE RECORDING MEDIUM - The present invention relates to a method for performing an image matching process for panoramic images. The method includes the steps of: (a) creating a connection(s) among images of a specific object respectively included in at least two panoramic images, if some objects included in the at least two panoramic images are recognized as the specific object by referring to information on shooting places of multiple panoramic images and information on directions of respective objects on the multiple panoramic images; and (b) matching an image of a certain object inputted as a query with at least one of images included in a specific connection and providing a search result for the query by referring to a result of the image matching process and the specific connection. | 03-29-2012 |
20120087592 | METHOD, SYSTEM, AND COMPUTER-READABLE RECORDING MEDIUM FOR ADAPTIVELY PERFORMING IMAGE-MATCHING ACCORDING TO SITUATIONS - The present invention relates to a method for adaptively performing an image matching process according to a situation. The method includes the steps of: (a) recognizing the situation of a subject included in an inputted image; and (b) selecting an image group including at least one image to be compared with the inputted image of the subject for the image matching process among multiple images stored on a database, as a qualified reference image group, according to the recognized situation; wherein the images included in the qualified reference image group are dynamically changed according to the recognized situation. | 04-12-2012 |
20120093395 | METHOD AND SYSTEM FOR HIERARCHICALLY MATCHING IMAGES OF BUILDINGS, AND COMPUTER-READABLE RECORDING MEDIUM - The present invention relates to a method for hierarchically matching a building image. The method includes the steps of: matching a wall of a specific building in the building image inputted as a query with a wall(s) of a building(s) in at least one panoramic image by using a technology of matching a building's shape or repeated pattern; selecting a candidate panoramic image(s) which includes a building(s) recognized to have the same or similar wall to the specific building in the panoramic image(s) as a result of matching its wall with others; matching at least one local region, if containing a recognizable string or figure, in the specific building with local region(s) in the building(s) of the candidate panoramic image(s) by using a technology of recognizing a string or a figure; and determining top n panoramic image(s) as the result of matching the local region. | 04-19-2012 |
20120093414 | METHOD, TERMINAL DEVICE, AND COMPUTER-READABLE RECORDING MEDIUM FOR SETTING AN INITIAL VALUE FOR A GRAPH CUT - The present invention relates to a method for setting initial values of graph cuts) to distinguish between a character region and a background region in an image. The method includes the steps of: (a) detecting a face region from an inputted image; (b) determining reference character region patterns including respective face regions, among pre-stored multiple character region patterns, of which degrees of similarity to the detected face region exceed the predetermined value; and (c) granting an initial value for the background to a first region which is not covered by any of the reference character region patterns and an initial value for the character to a second region which is covered by all of the reference character region patterns if the reference character region patterns are aligned overlappedly on the inputted image based on the detected face region. | 04-19-2012 |
20120162258 | METHOD, SYSTEM, AND COMPUTER-READABLE RECORDING MEDIUM FOR PROVIDING INFORMATION ON AN OBJECT USING VIEWING FRUSTUMS - The present invention relates to a method for providing information on an object by using viewing frustums. The method includes the steps of: (a) specifying at least two viewing frustums whose vertexes are visual points of respective user terminals; and (b) calculating a degree of interest in the object by referring to the object commonly included in both a first viewing frustum whose vertex is a visual point of a first user terminal and a second one whose vertex is a visual point of a second user terminal. | 06-28-2012 |
20120173561 | METHOD, SYSTEM AND COMPUTER-READABLE RECORDING MEDIUM FOR RECOMMENDING OTHER USERS OR OBJECTS BY CONSIDERING AT LEAST ONE USER'S PREFERENCE - The present invention relates to a method for recommending other users who have similar preference with a user. The method includes the steps of: acquiring information on objects selected by a user and other users; acquiring information on topics; determining to which topic the user and the other users respectively correspond; evaluating a degree of user similarity by each other user, the degree of user similarity being relevant to sum of probabilities of the specific object appearing in the state of a topic while k-th other user and the user have the topic as a probability of the k-th other user and the user having selected the specific object, by referring to correspondence relationships; and recommending specific other users who have a high degree of user similarity, wherein the degree of user similarity is evaluated by multiplying the sum by a probability of the specific object appearing independently. | 07-05-2012 |
20120203759 | METHOD, SYSTEM AND COMPUTER-READABLE RECORDING MEDIUM FOR WRITING NEW IMAGE AND ITS INFORMATION ONTO IMAGE DATABASE - The present invention relates to a method for writing a newly recognized image. The method includes the steps of: (a) comparing pre-stored image in the image database with a queried image; (b) storing the queried image onto a database for unrecognized images if there is no image similar to the queried image; (c) grouping the images in the database for unrecognized images based on degrees of similarity thereamong; and (d) comparing, if a specific image and its tag information are inputted, the specific image with some images included in a specific set of images among the organized sets of the images, determining whether there is any image in the specific set of images which has a degree of similarity exceeding the pre-set value and allowing images determined to have degrees of similarity exceeding the pre-set value with the tag information to be automatically written onto the image database. | 08-09-2012 |
20130003425 | DC/DC CONVERTER, AND ELECTRIC GENERATING SYSTEM USING SOLAR CELL HAVING THE SAME - Disclosed herein is an electric generating system using a solar cell which converts a voltage generated in the solar cell into an Alternating Current (AC) voltage, and applies the converted voltage to a power system. The electric generating system includes; a Direct Current (DC)/DC converter that converts the voltage generated in the solar cell into a DC voltage, and has a synchronous rectifier including a synchronous switch; and a controller that detects one of a phase and a voltage of the power system, and selectively connects the synchronous switch of the synchronous rectifier in accordance with one of the phase and voltage of the power system. Here, the electric generating system reduces a conduction loss, and increases overall efficiency of the electric generation system. | 01-03-2013 |
20130026616 | POWER DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF - The present invention relates to a power device package module and a manufacturing method thereof. In one aspect of the present invention, a power device package module includes: a control unit a first lead frame, a control chip and a first coupling portion that are mounted on a first substrate, wherein the first lead frame and the first coupling portion are electrically connected to the control chip, and individually molded; and a power unit including a second lead frame, a power chip and a second coupling portion that are mounted on a second substrate, wherein the second lead frame and the second coupling portion are electrically connected to the power chip, and individually molded, wherein the individually molded control unit and power unit are coupled by the first coupling portion and the second coupling portion. | 01-31-2013 |
20130040425 | SPIRAL STAIRCASE SHAPED STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A spiral staircase shaped stacked semiconductor package is presented. The package includes a semiconductor chip module, a substrate and connection members. The semiconductor chip module includes at least two semiconductor chips which have chip selection pads and through-electrodes. The semiconductor chips are stacked such that the chip selection pads are exposed and the through-electrodes of the stacked semiconductor chips are electrically connected to one another. The substrate has the semiconductor chip module mounted thereto and has connection pads. The connection members electrically connect the chip selection pads to respective connection pads. | 02-14-2013 |
20130182518 | MEMORY CELL OF SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR DRIVING THE SAME - A semiconductor memory device includes a first fuse having one end coupled with a first bit line and configured to be programmed with a data, a second fuse having one end coupled with a second bit line and configured to be programmed with the data; a program controller coupled with the other ends of the first fuse and the second fuse and configured to perform a program operation on at least one of the first fuse and the second fuse in response to a program voltage, and a read controller coupled with the other ends of the first fuse and the second fuse and configured to perform a read operation on the first fuse and the second fuse in response to a read voltage. | 07-18-2013 |
20130250698 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A semiconductor memory device includes strings configured to include a drain select transistor, memory cells, and a source select transistor coupled in series between a bit line and a common source line and peripheral circuits configured to precharge a bit line so that the precharge level of the bit line varies depending on whether an adjacent unselected memory cell is in the program or erase states, by supplying a first voltage to the adjacent unselected memory cell arranged toward the drain select transistor, a second voltage to the remaining memory cells, and a third voltage higher than a bit line precharge voltage to the common source line and perform a read operation of supplying a read voltage lower than the second voltage to the selected memory cell, the second voltage to the remaining memory cells including the adjacent unselected memory cell, and a ground voltage to the common source line. | 09-26-2013 |
20130266141 | MOBILE DEVICE, METHOD OF PROCESSING AN INPUT IN A MOBILE DEVICE AND ELECTRONIC PAYMENT METHOD USING A MOBILE DEVICE - Handheld wireless communications devices include a data input device, which is configured to receive first input data provided by a user, a main processor and a security processor. The security processor includes an input interface and input processing block configured to extract second data from a first portion of the first input data using, for example, a data mapping operation. The security processor also includes an encryption circuit, which is configured generate secure data from the extracted second data by encrypting the extracted second data using an encryption key, and a data/control interface, which is configured to transfer the secure data to the main processor. | 10-10-2013 |
20130328177 | STACK SEMICONDUCTOR PACKAGE AND MANUFACTURING THE SAME - To manufacture a stack semiconductor package, a board mold covers a first semiconductor. The board mold includes a first face and a second face opposite to the first face. An active surface of the first semiconductor faces the second face. A first opening is formed in the board mold from the second surface. The first opening is disposed on the first semiconductor. A second opening penetrates the board mold from the first surface. A conductive metal layer fills the first and the second openings using an electroless plating method. A plurality of semiconductor devices is stacked on the first face of the board mold. | 12-12-2013 |
20140002499 | Method, System, and Computer-Readable Recording Medium for Providing Information on an Object Using Viewing Frustums | 01-02-2014 |
20140062204 | POWER VOLTAGE SELECTION DEVICE - A power voltage selection device includes a first power voltage and a second power voltage; a power selection unit having a first PMOS transistor and a second PMOS transistor, wherein the first power voltage is supplied to a source of the first PMOS transistor, a gate of the first PMOS transistor receives a first enable signal, the second power voltage is supplied to a source of the second PMOS transistor, a gate of the second PMOS transistor receives a second enable signal, and a body of the first PMOS transistor is coupled to a body of the second PMOS transistor; an output unit having a common node to which a drain of the first PMOS transistor and a drain of the second PMOS transistor are commonly coupled; and a body voltage control unit controlling to supply one of the first power voltage and the second power voltage to the bodies of the first PMOS transistor and the second PMOS transistor, wherein the one has a higher voltage level than the other. | 03-06-2014 |
20140190513 | APPARATUS AND METHOD FOR TREATING SUBSTRATE - Provided is a substrate treatment apparatus. The substrate treatment apparatus includes a load port on which a carrier accommodating a plurality of substrates to which a back-ground wafer is attached to a mounting tape fixed to a frame ring is placed, a plasma treatment unit supplying plasma to treat a top surface of the wafer, and a substrate transfer unit transferring the substrate between the carrier and the plasma treatment unit. | 07-10-2014 |
20140363923 | STACK SEMICONDUCTOR PACKAGE AND MANUFACTURING THE SAME - To manufacture a stack semiconductor package, a board mold covers a first semiconductor. The board mold includes a first face and a second face opposite to the first face. An active surface of the first semiconductor faces the second face. A first opening is formed in the board mold from the second surface. The first opening is disposed on the first semiconductor. A second opening penetrates the board mold from the first surface. A conductive metal layer fills the first and the second openings using an electroless plating method. A plurality of semiconductor devices is stacked on the first face of the board mold. | 12-11-2014 |
20140371026 | 10-SHIFT POWER TRAIN OF AUTOMATIC TRANSMISSION FOR VEHICLE - The present invention provides a 10-shift power train of an automatic transmission for a vehicle, comprising: a first planetary gear set including a first sun gear selectively connected to a transmission casing, a first ring gear selectively connected to the transmission casing, and a first planetary carrier for integrally connecting a plurality of single pinions engaged between the first sun gear and the first ring gear; a second planetary gear set including a second sun gear directly connected to the first sun gear, a second planetary carrier directly connected to an input shaft and selectively connected to a third sun gear, and a second ring gear selectively connected to a fourth ring gear; a third planetary gear set including a third sun gear selectively connected to the second planetary carrier, a third planetary carrier selectively connected to the second ring gear, and a third ring gear selectively connected to the second ring gear; and a fourth planetary gear set including a fourth sun gear directly connected to the third planetary carrier, the fourth ring gear being directly connected to an output shaft, and a fourth planetary carrier directly connected to the first planetary carrier and to the third ring gear. | 12-18-2014 |
20140380109 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A semiconductor memory device and a method of operating the same are provided. The method of operating the semiconductor memory device includes detecting a first group of changed bits between first and second page data, by comparing the first and second page data, which are read out using first and second test voltages from the memory cells, respectively, detecting a second group of changed bits between the second page data and a third page data, by comparing the second page data with the third page data read out from the memory cells using a third test voltage, comparing the numbers of the first and second groups of changed bits, and determining one of the first to third test voltages as a read voltage according to the comparing of the numbers of the first and second groups of changed bits. | 12-25-2014 |
20150055399 | RESERVOIR CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME - A reservoir capacitor includes a first capacitor group having two or more capacitors, which are serially coupled to each other between a first power voltage supply terminal and a second power voltage supply terminal, a second capacitor group having two or more capacitors, which are serially coupled to each other between a third power voltage supply terminal and a fourth power voltage supply terminal and a connection line suitable for electrically coupling a first coupling node between the capacitors of the first capacitor group to a second coupling node between the capacitors of the second capacitor group. | 02-26-2015 |
20150070996 | DATA STORAGE SYSTEM AND METHOD OF OPERATING THE SAME - A data storage system and a method of operating the same are provided. The method includes performing a program operation on a first page of the pages of a memory block, deciding, when power is switched on after a sudden power-off is generated while the program operation is performed, whether to skip the program operation on a first erase page of the pages based on a second page on which the program operation is performed subsequent to the first page, and performing the program operation on the second page. | 03-12-2015 |
20150076924 | SEMICONDUCTOR DEVICE - This technology provides a semiconductor device capable of controlling an equivalent series resistance (ESR) generated from decoupling capacitors. To this end, the semiconductor device may include a plurality of decoupling capacitors electrically coupled between a first wire and a second wire in parallel, and a plurality of switches coupled between common source/drain terminals of two adjacent decoupling capacitors of the plurality of decoupling capacitors and the second wire. | 03-19-2015 |
20150113237 | DATA STORING SYSTEM AND OPERATING METHOD THEREOF - A method of operating a data storing system includes performing a first copy operation of copying data stored in memory cells of first to n | 04-23-2015 |
20150121168 | MEMORY SYSTEM INCLUDING RANDOMIZER AND DE-RANDOMIZER - A memory system according to an embodiment of the present invention may include a semiconductor memory device including a plurality of memory areas, and a controller suitable for writing data to the semiconductor memory device and reading data from the semiconductor memory device. The controller provides a combined seed, which is used to copy data in a first memory area to a second memory area, to the semiconductor memory device, the combined seed being obtained by performing an operation on a de-randomizing seed corresponding to the first memory area and a randomizing seed corresponding to the second memory area. | 04-30-2015 |
20150127887 | DATA STORAGE SYSTEM AND OPERATING METHOD THEREOF - An operating method of a data storage system may include detecting a sudden power-off during a program operation on pages in a memory block, identifying a dummy program target page in the memory block when power is on after the sudden power-off, and performing the program operation on the dummy program target page using dummy data, and performing the program operation on pages in the memory block subsequent to the dummy program target page using normal data. | 05-07-2015 |