Patent application number | Description | Published |
20100060527 | ELECTROMAGNETIC BAND GAP TUNING USING UNDULATING BRANCHES - Embodiments of the invention include electromagnetic band gap (EBG) structures having undulating branches to tune the resulting stopband. A periodically patterned structure of conductive patches are interconnected by the undulating branches. Physical parameters of the undulating branches, such as the number of undulations or “turns” per branch, may be selected to tune the stopband in an effort to achieve a target stopband. Accordingly, embodiments of the invention also include methods of designing and manufacturing an EBG structure using undulating branches. | 03-11-2010 |
20100073893 | MINIMIZING PLATING STUB REFLECTIONS IN A CHIP PACKAGE USING CAPACITANCE - Embodiments of the present invention are directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an open-ended plating stub and ground. One embodiment provides a multi-layer substrate for interfacing a chip with a printed circuit board. A first outer layer provides a chip mounting location. A signal interconnect is spaced from the chip mounting location, and a signal trace extends from near the chip mounting location to the signal interconnect. A chip mounted at the chip mounting location may be connected to the signal trace by wirebonding. A plating stub extends from the signal interconnect, such as to a periphery of the substrate. A capacitor is used to capacitively couple the plating stub to a ground layer. | 03-25-2010 |
20100084176 | PRESERVING STOPBAND CHARACTERISTICS OF ELECTROMAGNETIC BANDGAP STRUCTURES IN CIRCUIT BOARDS - The stopband characteristics of an electromagnetic bandgap structure in a printed circuit board may be preserved by selectively forming slots in an additional conductive layer of the printed circuit board. For example, an electromagnetic bandgap structure may include a layer with a continuous conductive region and another layer with a periodically patterned region having a plurality of spaced-apart patches interconnected by branches. Additional conductive layers may be included within the printed circuit board without neutralizing the bandgap by forming slots in the conductive layers in general alignment with spaces between the patches. | 04-08-2010 |
20110073359 | Through-Hole-Vias In Multi-Layer Printed Circuit Boards - Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper. | 03-31-2011 |
20110103030 | Packages and Methods for Mitigating Plating Stub Effects - Packages and methods for mitigating plating stub effects. The semiconductor package includes an interposer substrate having a first side, a second side, a peripheral edge connecting the first side with the second side, a signal line on the first side, and an electrode pad on the first side. A semiconductor element is mounted on the first side of the interposer substrate. The semiconductor element is connected with the electrode pad by the signal line. A terminating resistor is mounted on the interposer substrate. A plating stub, which is located on the interposer substrate, has a first end portion that terminates near the peripheral edge of the interposer substrate and a second end portion that is electrically connected to the electrode. The first end portion is electrically connected through the terminating resistor to an electrical ground. | 05-05-2011 |
20110108948 | INTEGRATED DECOUPLING CAPACITOR EMPLOYING CONDUCTIVE THROUGH-SUBSTRATE VIAS - A capacitor in a semiconductor substrate employs a conductive through-substrate via (TSV) as an inner electrode and a columnar doped semiconductor region as an outer electrode. The capacitor provides a large decoupling capacitance in a small area, and does not impact circuit density or a Si3D structural design. Additional conductive TSV's can be provided in the semiconductor substrate to provide electrical connection for power supplies and signal transmission therethrough. The capacitor has a lower inductance than a conventional array of capacitors having comparable capacitance, thereby enabling reduction of high frequency noise in the power supply system of stacked semiconductor chips. | 05-12-2011 |
20110222224 | CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE - A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers. | 09-15-2011 |
20130003335 | CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE - A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers. | 01-03-2013 |
20130008696 | CORLES MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE - A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers. | 01-10-2013 |
20130344675 | INTEGRATED DECOUPLING CAPACITOR EMPLOYING CONDUCTIVE THROUGH-SUBSTRATE VIAS - A capacitor in a semiconductor substrate employs a conductive through-substrate via (TSV) as an inner electrode and a columnar doped semiconductor region as an outer electrode. The capacitor provides a large decoupling capacitance in a small area, and does not impact circuit density or a Si3D structural design. Additional conductive TSV's can be provided in the semiconductor substrate to provide electrical connection for power supplies and signal transmission therethrough. The capacitor has a lower inductance than a conventional array of capacitors having comparable capacitance, thereby enabling reduction of high frequency noise in the power supply system of stacked semiconductor chips. | 12-26-2013 |
Patent application number | Description | Published |
20100190558 | FIXED TYPE CONSTANT VELOCITY JOINT - A constant velocity joint for a drive system comprises: an outer race having an inner spherical surface, and a plurality of guide grooves formed in an axial direction in the inner spherical surface of the outer race; an inner race having an outer spherical surface, and a plurality of guide grooves formed in an axial direction in the outer spherical surface of the inner race, said guide grooves of the outer race and said guide grooves of the inner race together forming a plurality of ball guide tracks; a plurality of balls disposed in the ball guide tracks; and a cage installed between the inner spherical surface of the outer race and the outer spherical surface of the inner race, said cage having a plurality of windows for retaining the balls therein; wherein each of the guide grooves of the outer race is shaped to have a longitudinal cross section formed with two circular regions with different centers, a first circular region disposed at a first lateral side of the outer race and a second circular region disposed at a second lateral side of the outer race, and a linear region tangentially extending between these two circular regions; and wherein each of the guide grooves of the inner race is shaped to have a longitudinal cross section formed with two circular regions with different centers, a first circular region disposed at a first lateral side of the inner race and a second circular region disposed at a second lateral side of the inner race, and a linear region tangentially extending between these two circular regions. | 07-29-2010 |
20100216558 | FIXED TYPE CONSTANT VELOCITY JOINT - A fixed type constant velocity joint comprises: an outer race having an inner spherical surface, and a plurality of guide grooves formed in an axial direction in the inner spherical surface of the outer race, each guide groove having a circular shape in a longitudinal cross section thereof; an inner race having an outer spherical surface, and a plurality of guide grooves formed in an axial direction in the outer spherical surface of the inner race, each guide groove having a circular shape in a longitudinal cross section thereof, said guide grooves of the outer race and said guide grooves of the inner race together forming a plurality of ball guide tracks arranged around the circumference of the joint; a plurality of balls disposed in the ball guide tracks; and a cage installed between the inner spherical surface of the outer race and the outer spherical surface of the inner race, said cage having a plurality of windows for retaining the balls therein. The ball guide tracks include first tracks and second tracks with different groove configurations and having dual, multiple, or differentiated center offsets with smaller offsets applied to the tracks having relatively large ball movements and larger offsets applied to the tracks having relatively small ball movements as the joint is articulated for assembling. | 08-26-2010 |
20110070954 | Cross Groove Type Constant Velocity Joint - A constant velocity joint for a drive system comprises an outer joint member and an inner joint member each having a plurality of ball grooves in pairs for accommodating balls therein, the ball grooves consisting of a first group of grooves, each groove of which having a linear groove shape with no skew angle or a skewed groove shape with a relatively smaller skew angle, and a second group of grooves, each groove of which having a skewed groove shape with a relatively larger or regular skew angle. In addition to having the differentiated skew angles in the first and second groups of grooves, a taper angle is provided to the pair of grooves of at least one or both of the first and second groups of grooves in order to reduce the potential risk of ball locking in the grooves. In an alternative embodiment, all the grooves of the outer and inner joint members have a skewed groove shape with a skew angle which is less than the regular skew angle of the conventional cross groove joint, and a taper angle is provided to the pairs of grooves of the outer and inner joint members. | 03-24-2011 |
20110070955 | Cross Groove Type Constant Velocity Joint with Composite Groove Patterns - A constant velocity joint for a drive system comprises: an outer joint member having a plurality of inwardly facing outer ball grooves, the outer ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern; an inner joint member disposed inside the outer joint member and having a plurality of outwardly facing inner ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern, each inner ball groove of the inner joint member being coupled with a corresponding outer ball groove of the outer joint member generally in crossed pair; and a cage having circumferentially displaced cage windows to accommodate a plurality of balls therein. The groove patterns of the ball grooves can be a combination of skewed grooves and non-linear grooves, a combination of non-linear grooves such as a curved groove or a compositely shaped groove, or a combination of linear grooves and non-linear grooves. | 03-24-2011 |
20110092299 | Cross Groove Type Constant Velocity Joint - A constant velocity joint for a drive system comprises: an outer joint member having a plurality of inwardly facing outer ball grooves, the outer ball grooves consisting of a first group of grooves, each groove of which having a skewed groove shape with a first skew angle other than zero and alternately arranged in opposite directions relative to an axis of rotation of outer joint member, and a second group of grooves, each groove of which having a skewed groove shape with a second skew angle other than zero and alternately arranged in opposite directions relative to an axis of rotation of outer joint member, the second skew angle less than the first skew angle; and an inner joint member disposed inside the outer joint member and having a plurality of outwardly facing inner ball grooves consisting of a first group of grooves, each groove of which having a skewed groove shape with a first skew angle other than zero and alternately arranged in opposite directions relative to an axis of rotation of inner joint member, and a second group of grooves, each groove of which having a skewed groove shape with a second skew angle other than zero and alternately arranged in opposite directions relative to an axis of rotation of inner joint member, the second skew angle less than the first skew angle, each inner ball groove of the inner joint member being coupled with a corresponding outer ball groove of the outer joint member generally in crossed pair. In addition to the differentiated skew angles, the contact angles of the balls in the first and second group of grooves and other configurations may also be differentiated. | 04-21-2011 |
20120238370 | CROSS GROOVE TYPE CONSTANT VELOCITY JOINT WITH COMPOSITE GROOVE PATTERNS - A constant velocity joint for a drive system comprises: an outer joint member having a plurality of inwardly facing outer ball grooves, the outer ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern; an inner joint member disposed inside the outer joint member and having a plurality of outwardly facing inner ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern, each inner ball groove of the inner joint member being coupled with a corresponding outer ball groove of the outer joint member generally in crossed pair. | 09-20-2012 |
20130079163 | CROSS GROOVE TYPE CONSTANT VELOCITY JOINT WITH COMPOSITE GROOVE PATTERNS - A constant velocity joint for a drive system comprises: an outer joint member having a plurality of inwardly facing outer ball grooves, the outer ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern; an inner joint member disposed inside the outer joint member and having a plurality of outwardly facing inner ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern, each inner ball groove of the inner joint member being coupled with a corresponding outer ball groove of the outer joint member generally in crossed pair; and a cage having circumferentially displaced cage windows to accommodate a plurality of balls therein. The groove patterns of the ball grooves can be a combination of skewed grooves and non linear grooves, a combination of non linear of linear grooves and non linear grooves. | 03-28-2013 |
20130085003 | CROSS GROOVE TYPE CONSTANT VELOCITY JOINT WITH COMPOSITE GROOVE PATTERNS - A constant velocity joint for a drive system comprises: an outer joint member having a plurality of inwardly facing outer ball grooves, the outer ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern; an inner joint member disposed inside the outer joint member and having a plurality of outwardly facing inner ball grooves consisting of a first group of grooves and a second group of grooves with composite or non-linear groove pattern, each inner ball groove of the inner joint member being coupled with a corresponding outer ball groove of the outer joint member generally in crossed pair. | 04-04-2013 |
20130252747 | CROSS GROOVE TYPE CONSTANT VELOCITY JOINT - A constant velocity joint for a drive system includes: an outer joint member and an inner joint member, each having a plurality of ball grooves, the ball grooves consisting of a first group of grooves of a skewed groove shape with a first skew angle other than zero and alternately arranged in opposite directions relative to an axis of rotation of the outer and inner joint members, and a second group of grooves of a skewed groove shape with a second skew angle other than zero and alternately arranged in opposite directions relative to an axis of rotation of the outer and inner joint members, the second skew angle less than the first skew angle. In addition to the differentiated skew angles, the contact angles of the balls in the first and second group of grooves may also be differentiated. | 09-26-2013 |
Patent application number | Description | Published |
20100099219 | MITIGATION OF PLATING STUB RESONANCE BY CONTROLLING SURFACE ROUGHNESS - Plating stub resonance in a circuit board may be mitigated by increasing surface roughness of the plating stub conductor. Roughening the plating stub increases its resistance due to the skin effect at higher frequencies, which decreases the quality factor of the transmission line and consequently increases the damping factor, to reduce any resonance that would occur in the plating stub as formed prior to roughening. The surface roughness can be increased in a variety of ways, including chemical processes, by selectively applying a laser beam, or by applying an etch-resistance material in selected locations. | 04-22-2010 |
20110273855 | POWER AND GROUND VIAS FOR POWER DISTRIBUTION SYSTEMS - A system for providing power and ground vias for power distributions systems includes first and second conductive layers on a microelectronic package. The conductive layers may include one or more conductive components such as, but not limited to, power planes, ground planes, pads, traces, and the like for electrically connecting to electronic components. A via may electrically connect the first and second conductive layers. The via may have a cross-section of at least three partially-overlapping shapes. Each of the shapes partially overlaps at least two of the other shapes. The shapes may be, for example, circular, triangular, rectangular, square, polygonal, rhomboidal shape, or any other shape. | 11-10-2011 |
20120020042 | NOISE SUPPRESSOR FOR SEMICONDUCTOR PACKAGES - One or more decoupling capacitors are coupled to a low inductance mount that is connected to the bottom layer of a printed circuit board (PCB) on which a semiconductor module is mounted. The low inductance mount includes a magnetic planar structure with vias that are coupled to the one or more decoupling capacitors and to like vias positioned on the PCB. | 01-26-2012 |
20120032330 | MITIGATION OF PLATING STUB RESONANCE BY CONTROLLING SURFACE ROUGHNESS - Plating stub resonance in a circuit board may be mitigated by increasing surface roughness of the plating stub conductor. Roughening the plating stub increases its resistance due to the skin effect at higher frequencies, which decreases the quality factor of the transmission line and consequently increases the damping factor, to reduce any resonance that would occur in the plating stub as formed prior to roughening. The surface roughness can be increased in a variety of ways, including chemical processes, by selectively applying a laser beam, or by applying an etch-resistance material in selected locations. | 02-09-2012 |
20120193135 | Through-Hole-Vias In Multi-Layer Printed Circuit Boards - Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper. | 08-02-2012 |
20120200346 | Through-Hole-Vias In Multi-Layer Printed Circuit Boards - Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper. | 08-09-2012 |
20120250527 | Determining Connectivity Of A High Speed Link That Includes An AC-Coupling Capacitor - Methods, apparatuses, and computer products are provided for determining connectivity of a high speed link that includes an ac-coupling capacitor. Embodiments include transmitting, by a connectivity tester, a test signal on a lane within the high speed link; detecting on the lane, by the connectivity tester, a standing wave generated in response to the transmission of the test signal; determining, by the connectivity tester, whether the standing wave is resonating; if the standing wave is resonating, indicating, by the connectivity tester, that the lane of the high speed link has a closed connection; and if the standing wave is not resonating, indicating, by the connectivity tester, that the lane of the high speed link has an open connection. | 10-04-2012 |
20130021739 | Multi-layer Printed Circuit Board With Power Plane Islands To Isolate Noise Coupling - Multi-layer printed circuit boards (PCB) with power plane islands to isolate noise coupling are provided. In addition, methods and computer program products for manufacturing multi-layer PCBs with power plane islands to isolate noise coupling are provided. Embodiments include a PCB comprising a first power plane coupled to a power supply, the first power plane within a layer of the PCB; a second power plane and a third power plane, the second power plane and the third power plane within another layer of the PCB, the second power plane and the third power plane separated from each other within the other layer of the PCB; and a via bridge structure connecting the first power plane to both the second power plane and the third power plane. | 01-24-2013 |
20130239408 | POWER AND GROUND VIAS FOR POWER DISTRIBUTION SYSTEMS - A system for providing power and ground vias for power distributions systems includes first and second conductive layers on a microelectronic package. The conductive layers may include one or more conductive components such as, but not limited to, power planes, ground planes, pads, traces, and the like for electrically connecting to electronic components. A via may electrically connect the first and second conductive layers. The via may have a cross-section of at least three partially-overlapping shapes. Each of the shapes partially overlaps at least two of the other shapes. The shapes may be, for example, circular, triangular, rectangular, square, polygonal, rhomboidal shape, or any other shape. | 09-19-2013 |
20140123489 | THROUGH-HOLE-VIAS IN MULTI-LAYER PRINTED CIRCUIT BOARDS - Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of manufacturing a PCB. Embodiments include depositing upon layers of laminate printed circuit traces and joining the layers of laminate. Embodiments also include drilling at least one via hole through the layers of laminate and placing in the via hole a via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a second metal having a conductivity lower than the conductivity of copper. | 05-08-2014 |
20140284217 | MINIMIZING PLATING STUB REFLECTIONS IN A CHIP PACKAGE USING CAPACITANCE - The present invention is directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an open-ended plating stub and ground. One embodiment provides a method including capacitively coupling a plating stub to ground so that the resonant frequency caused by the plating stub in a semiconductor package is shifted away from an operational frequency. | 09-25-2014 |
Patent application number | Description | Published |
20150050060 | IMAGE FORMING APPARATUS - An image forming apparatus is provided including an image forming unit configured to form an image on a print medium, and a printed medium post-processing unit configured to receive and post-process printed media on which an image forming process is completed from the image forming unit. The printed medium post-processing unit selectively comprises one of a first stacker module in which a first amount of post-processed printed media is able to be loaded, and a second stacker module in which a second amount of post-processed printed media is able to be loaded. Therefore, it may be possible to flexibly respond to a loading amount of the printed media necessary for the printed medium post-processing unit. | 02-19-2015 |
20150085738 | RELAY APPARATUS AND METHOD OF SELECTING RELAY NODE BASED ON LEARNING IN WIRELESS NETWORK - A relay apparatus and a method of selecting a relay node based on learning in a wireless network are provided. A method of selecting a relay node is performed, for example, by the relay apparatus, and includes receiving packet information from a predecessor node and a successor node, and determining whether the relay apparatus is usable as a node optimized to relay a data packet, based on relay quality information (RQI) that is computed based on the received packet information. Techniques for computing RQI information are also provided. | 03-26-2015 |
20150100668 | METHOD AND APPARATUS FOR CONTENT VERIFICATION - An intermediate node and method thereof in a network determines whether to perform verification of content at an early stage based on information about the content. The method includes receiving, from a content requesting node in the network, a request for the content, determining whether to verify the content based on information, transmitting the content to the content requesting node without verifying the content in response to the determining, and verifying the content and transmitting the content to the content requesting node in response to the determining. | 04-09-2015 |