Patent application number | Description | Published |
20080244329 | APPARATUS DIAGNOSING METHOD, APPARATUS DIAGNOSIS MODULE, AND APPARATUS MOUNTED WITH APPARATUS DIAGNOSIS MODULE - An apparatus diagnosing method is a method in which, in an apparatus including a control apparatus and a control board for controlling the control apparatus, on the controlling board, an error occurrence at the control apparatus and the control board is detected, an error signal is outputted, sensor data outputted from a sensor acquiring data about operation environments of the control apparatus and the control board is collected, and an environmental factor causing a failure or an error of the control apparatus and the control board is specified based upon the error signal and the sensor data, and the sensor data is collected in association with the error signal when the sensor data is collected. | 10-02-2008 |
20080262760 | SEMICONDUCTOR INSPECTING APPARATUS - A semiconductor inspecting apparatus includes: a buffer memory whose width is matched to the greater of parallel bus width and the width of the number of serial lanes; a preceding stage bus switching unit that fills the buffer memory with input data without making a free space; equivalent transmission capacity conversion including a following stage bus switching unit that fills read data to the width of an arbitrary number of serial lanes without making a free space; a preceding stage bus switching unit that fills a buffer memory with input data without making a free space; and equivalent transmission capacity inverse conversion including a following stage bus switching unit that fills a parallel bus of arbitrary width with data read from a buffer memory without making a free space. | 10-23-2008 |
20090072138 | Test Apparatus - A scan control unit for generating two-dimensional coordinates for performing a scan with an electron beam of an electron scanning microscope is provided with first and second transforming units for transforming coordinates in the horizontal (X) direction and the vertical (V) direction. An area to be tested in a sample is scanned with an electron beam in an arbitrary direction. As the first and second transforming units, small-capacity transformation tables (LUTs) capable of operating at high speed in each of the horizontal (X) direction and the vertical (Y) direction are used. By also using a large-capacity transformation table (LUT) that stores coordinate transformation data corresponding to plural scan types, a test apparatus compatible with the plural scan types, having multiple functions, and capable of performing high-speed scan control is realized. | 03-19-2009 |
20110180708 | Test Apparatus - A scan control unit for generating two-dimensional coordinates for performing a scan with an electron beam of an electron scanning microscope is provided with first and second transforming units for transforming coordinates in the horizontal (X) direction and the vertical (V) direction. An area to be tested in a sample is scanned with an electron beam in an arbitrary direction. As the first and second transforming units, small-capacity transformation tables (LUTs) capable of operating at high speed in each of the horizontal (X) direction and the vertical (Y) direction are used. By also using a large-capacity transformation table (LUT) that stores coordinate transformation data corresponding to plural scan types, a test apparatus compatible with the plural scan types, having multiple functions, and capable of performing high-speed scan control is realized. | 07-28-2011 |
20110279143 | SEMICONDUCTOR WAFER TESTING APPARATUS - Disclosed is a semiconductor wafer testing apparatus that resolves the following problems which arise when semiconductor wafers become larger: (1) complexity of stage acceleration/deceleration control; (2) throughput reduction; and (3) increased vibration of the stage support platform during the stage inversion operation (deterioration in resolution). In the semiconductor wafer testing apparatus for resolving these problems, a wafer is rotated, an electro beam is irradiated onto the rotating wafer from a scanning electron microscope, and secondary electrons emitted from the wafer are detected. The detected secondary electrons are A/D converted by an image processing unit, realigned by an image data realignment unit, and then image-processed for display. As a result, image information of all dies of a wafer can be acquired without a large amount of movement of the stage in the X and the Y directions. | 11-17-2011 |
20120159269 | Measurement Device and Measurement Method - Disclosed is means for quantifying resistance to soft errors in a logic circuit. A logic block group | 06-21-2012 |
20120304005 | ELECTRONIC APPARATUS - A failure caused by a soft-error including MNU, of an electronic apparatus is prevented, while suppressing increase of a mounting area, power consumption, and processing time. The electronic apparatus stores data indicating the state of a flip-flop included in a sequential logic circuit within an arithmetic unit, each time when execution is performed on a check point provided for every predetermined number of instructions. When a symptom of a soft-error is detected, the apparatus sets the state of the flip-flop included in the sequential logic circuit within the arithmetic unit, based on the data stored after execution of the instruction at the immediately preceding check point, and restarts execution from the next instruction, being subsequent to the instruction associated with the immediately preceding check point. | 11-29-2012 |
20130132056 | SIMULATION APPARATUS AND SIMULATION METHOD - A simulation apparatus includes a discrete events simulation section to perform a discrete type simulation of components of a configured model as defined based on attribute information that is information on parts of the components of the defined configured model and connection information showing a connectional relationship among the components of the defined configured model; and a soft error rate computation processing section to compute a soft error rate of the defined configured model based on the simulation result of the discrete events simulation section and data on soft error rates in the attribute information. | 05-23-2013 |
20130136334 | Semiconductor Inspecting Apparatus - A semiconductor inspecting apparatus which is provided with an inspecting unit, a detecting unit, and a processing unit, which processes an image on the basis of reflection light detected by the detecting unit, and which inspects the surface of the subject to be inspected. The processing unit is provided with an image distribution control unit, which distributes the image, and an image processing unit, which processes the image distributed by the image distribution control unit. The image distribution control unit has and image buffer counter, which counts the input image quantity of the image; a distribution control table, which stores information relating to the image; and a distribution timing control circuit, which determines distribution start timing of the image on the basis of the input image quantity and the information relating to the image obtained from the distribution control table. | 05-30-2013 |