Patent application number | Description | Published |
20090047534 | COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE - To provide a components joining method and a components joining structure which can realize joining of components while securing conduction at a low electrical resistance with high reliability. | 02-19-2009 |
20090075025 | ELECTRONIC COMPONENT SOLDERING STRUCTURE AND ELECTRONIC COMPONENT SOLDERING METHOD - In an electronic component soldering method of connecting a terminal provided on a flexible substrate to an electrode of a rigid substrate, after solder-mixed resin in which solder particles are mixed in thermosetting resin has been applied onto the rigid substrate so as to cover the electrode, the flexible substrate is put on the rigid substrate and heat-pressed, whereby there are formed a resin part that bonds the both substrates by thermosetting of the thermosetting resin, and a solder part which is surrounded by the resin part and has narrowed parts in which the peripheral surface is narrowed inward in the vicinity of the terminal surface and in the vicinity of the electrode surface. Hereby, the solder parts are soldered to the electrodes and the terminal at acute contact angles so that the production of shape-discontinuities which lowers fatigue strength can be eliminated. | 03-19-2009 |
20090126188 | ELECTRONIC COMPONENT THERMO-COMPRESSION TOOL, AND ELECTRONIC COMPONENT MOUNTING APPARATUS AND MOUNTING METHOD - A thermo-compression tool removably fitted on a thermo-compression head in an electronic component mounting apparatus includes a base member which is removably fitted on a head-bottom face of the thermo-compression head and in which heating by heat transfer for thermo-compression is performed through the head-bottom face of the head, and a suck-up member having a suck-up surface which is formed so as to be smaller than a lower surface of the base member in correspondence to a size of the electronic component and by which the electronic component is sucked up and held, the suck-up member being fixed on the lower surface of the base member at a position displaced from a center thereof. As a result, in thermo-compressing and mounting of electronic components onto a plurality of unit boards segmented in a multi-piece board with a thermo-compression tool, occurrence of any thermal adverse influences of radiant heat of the thermo-compression tool on the thermosetting bonding material placed on before-mounting unit boards can be avoided. | 05-21-2009 |
20090161328 | ELECTRONIC COMPONENTS MOUNTING ADHESIVE, MANUFACTURING METHOD OF AN ELECTRONIC COMPONENTS MOUNTING ADHESIVE, ELECTRONIC COMPONENTS MOUNTED STRUCTURE, AND MANUFACTURING METHOD OF AN ELECTRONIC COMPONENTS MOUNTED STRUCTURE - An object is to provide an electronic components mounting adhesive capable of lowering the probability of occurrence of short-circuiting and increasing the reliability of the joining of electrodes in an electronic components mounted structure obtained by bonding electronic components to each other, as well as a manufacturing method of such an electronic components mounting adhesive, a resulting electronic component mounted structure, and a manufacturing method of such an electronic component mounted structure. | 06-25-2009 |
20090205203 | METHOD OF MOUNTING ELECTRONIC COMPONENTS - An electronic component mounting method for mounting a electronic component on a board, in which an Au bump provided at an electronic component is joined to a joining terminal formed on a board by using solder made of Sn or solder containing Sn and the electronic component is adhered to the board by means of thermosetting resin thereby to mount the electronic component on the board. The applied thermosetting resin is flown toward the outside by the lower surface of the electronic component, then a part of the solder particles contained within the thermosetting resin are made in contact with the side surfaces of the Au bumps which are heated to the temperature higher than the melting point of the solder and also another part of the solder particles are molten in a state of being sandwiched between the Au bumps and the electrodes. Thus, the diffusion of Sn into the Au bumps from the outside is promoted and so the density of Sn within the Au bumps can be increased. Further, the diffusion of Sn into the Au bump from a solder joining portion can be suppressed and so the generation of Kirkendall voids can be suppressed. | 08-20-2009 |
20090233117 | METHOD FOR SOLDERING ELECTRONIC COMPONENT AND SOLDERING STRUCTURE OF ELECTRONIC COMPONENT - In soldering an electronic component, for the purpose of leading molten solder during re-flow, metallic powder | 09-17-2009 |
20090260229 | METHOD FOR MANUFACTURING ELECTRONIC PARTS MODULE - The method for manufacturing an electronic parts module includes an adhesive layer forming process forming an adhesive layer including solder particles on the circuit forming surface in range covering at least the first land part and the second land part; a passive element mounting process positioning a terminal of the passive element on the first land part and sticking the passive element to the base wiring layer through the adhesive layer; an active element mounting process, after the passive element mounting process, positioning a terminal of the active element on the second land part and sticking the active element to the base wiring layer through the adhesive layer; a pressing process solidifying the adhesive layer and melting the solder particles by laminating and thermally pressing a thermosetting sheet onto the circuit forming surface so as to form the resin sealing layer. | 10-22-2009 |
20090260230 | METHOD FOR MANUFACTURING ELECTRONIC PARTS MODULE - The manufacturing method for an electronic parts module includes forming an adhesive layer including solder particles on the circuit forming surface in range covering at least the first and the second land parts, positioning a terminal of the active element on the second land part, sticking the active element to the base wiring layer through the adhesive layer by heating and pressing the active element onto the base wiring layer with a thermally pressing tool, and releasing the heating and pressing with the thermally pressing tool while the adhesive layer is semi-solidified, thereafter positioning a terminal of the passive element on the first land part and sticking the passive element to the base wiring layer through the adhesive layer, and solidifying the adhesive layer and melting the solder particles by laminating and thermally pressing a thermosetting sheet onto the circuit forming surface to form the resin sealing layer. | 10-22-2009 |
20090288767 | ELECTRONIC COMPONENT MOUNTING METHOD - By an electronic component mounting method for electrically connecting bumps to board electrodes, in a contact process for placing a thermosetting resin in a liquid glob state on the board surface and bringing the lower surface of the electronic component in contact with the thermosetting resin, the bumps are pressurized against the electrodes in positional alignment in a liquid glob distribution state where one portion of the liquid glob is arranged inside an electronic component mounting region and a remaining portion greater in liquid measure than the portion is arranged outside the electronic component mounting region. The thermosetting resin enters into a gap between the electronic component and the board by capillarity in a thermocompression bonding process. This prevents voids occurring in the sealing resin, reinforces bonded portions of bumps and electrodes with thermally cured thermosetting resin, thereby preventing bonded portion breakage due to thermal stress generated during a cooling process. | 11-26-2009 |
20090291314 | ELECTRONIC COMPONENTS MOUNTING ADHESIVE AND ELECTRONIC COMPONENTS MOUNTING STRUCTURE - The invention intends to provide an electronic component mounting adhesive that can inhibit cracks and peelings in an electronic component mounting structure obtained by joining electronic components each other from occurring and an electronic component mounting structure obtained by joining electronic components with such an electronic component mounting adhesive. In an electronic component mounting structure, a first circuit board and a second circuit board are bonded with an electronic component mounting adhesive. Here, the electronic component mounting adhesive is obtained by dispersing metal particles having the melting temperature Mp lower than the glass transition temperature Tg of a cured material of a thermosetting resin in the thermosetting resin. | 11-26-2009 |
20100000773 | ELECTRONIC COMPONENT MOUNTING STRUCTURE - The invention intends to provide an electronic component mounting structure where the repairability and the impact resistance are combined. In an electronic component mounting structure, a plurality of solder balls disposed in plane between an electronic component and a substrate is melted to bond the electronic component and the substrate and a resin of which tensile elongation after the curing is in the range of 5 to 40% is filled in portions that are gaps between the electronic component and the substrate and correspond to at least four comers of the electronic component to reinforce. Since the reinforcement area is small, the repairability such as the easy removability of the resin and the reusability of the substrate are excellent, the resin itself is allowed to expand to the impact at the drop to play a role of reinforcing the bonding without breaking, and the impact resistance is excellent as well. | 01-07-2010 |
20100018048 | CONNECTING METHOD OF ELECTRONIC COMPONENT - It is to provide an electronic component connecting method capable of performing dehumidification within a short time without giving a thermal influence to an electronic component which has already been mounted on a wiring board. | 01-28-2010 |
20100089628 | COMPONENT BUILT-IN CIRCUIT SUBSTRATE AND METHOD OF PRODUCING THE SAME - A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of connecting terminals; a solder part joining between electrodes and connecting terminals; and a sealing resin part filling a gap between the bottom surface of the electronic component and the front surface of the core layer and covering the resist and the solder part, to prevent a defect of a component built-in printed circuit substrate. | 04-15-2010 |
20100200282 | METHOD OF BONDING CORE WIRES TO ELECTRODES AND ELECTRONIC UNIT FORMED BY BONDING ELECTRODES AND CORE WIRES - A method of bonding electrodes and core wires capable of shortening the operation time and improving the bonding strength and an electronic unit formed by bonding the electrodes and the core wires are intended to be provided. | 08-12-2010 |
20100327044 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE - After disposing bonding material including thermosetting resin containing solder particles in a region that covers at least land part on an upper surface of base wiring layer and holding electronic component by base wiring layer by positioning terminal part with respect to land part and adhesively bonding at least terminal part to bonding material that covers at least land part, bonding material is semi-cured by heating. Therefore, warp deformation of the base wiring layer can be suppressed and bonding reliability can be secured. | 12-30-2010 |
20110284265 | COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE - To provide a components joining method and a components joining structure which can realize joining of components while securing conduction at a low electrical resistance with high reliability. | 11-24-2011 |