Syotarou
Syotarou Fukuda, Obu-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090076699 | VEHICLE AUTOMATIC OPERATION CONTROL DEVICE - It is an object of the present invention to provide a vehicle automatic operation control device that can perform automatic operation of a vehicle while the actual acceleration favorably tracks the target acceleration. The device comprises a target required torque calculating part ( | 03-19-2009 |
Syotarou Fukuda, Obu-City JP
| Patent application number | Description | Published |
|---|---|---|
| 20090005945 | VEHICLE SPEED CONTROL SYSTEM - A vehicle speed control system starts an automatic decelerating operation with a maximum permissible decelerating physical amount “G | 01-01-2009 |
| 20090024354 | Road gradient estimating system - An estimated gradient value of a road is calculated based on a vehicle acceleration “A” and a time varying portion “A′” of a wheel speed. In a case that an acceleration corresponding value “Ggrad0” for the estimated gradient value is not regarded as indicating an exact figure, due to influences of disturbances, the acceleration corresponding value “Ggrad0” is corrected by a limiting value for rate-of-change with regard to the road gradient depending on respective vehicle speed, and by a limiting value for the road gradient. As a result, the acceleration corresponding value “Ggrad” for the estimated gradient value can be more exactly obtained. | 01-22-2009 |
| 20090048755 | Vehicle speed control device and method - A vehicle speed control device calculates a desired axle torque for maintaining a speed of a vehicle to a set speed, and conducts cruise control. Specifically, the vehicle speed control device calculates a drive force including a feedforward component corresponding to the set speed and a travel resistance against the travel of the vehicle, and a feedback component corresponding to a deviation of the set speed from the actual speed of the vehicle as a desired axle torque. The vehicle speed control device interrupts the cruise control when a requested drive axle torque requested by an accelerator operation during the cruise control exceeds the desired axle torque, and restarts the cruise control when the requested drive axle torque becomes lower than the desired axle torque. | 02-19-2009 |
Syotarou Tanaka, Obu-City JP
| Patent application number | Description | Published |
|---|---|---|
| 20090009306 | OBSTACLE DETECTION APPARATUS - An obstacle detection apparatus for a vehicle is provided. The apparatus includes an ultrasonic sensor and a controller. The ultrasonic sensor detects a presence of an obstacle around the vehicle and a distance to the obstacle by transmitting an ultrasonic wave and receiving the ultrasonic wave reflected by the obstacle. The controller controls the ultrasonic sensor. The ultrasonic sensor includes an ultrasonic wave element. The ultrasonic wave element has multiple resonance modes. The ultrasonic sensor changes a directivity of the ultrasonic sensor by selecting one of the multiple resonance modes of the ultrasonic wave element in accordance with a command signal output from the controller. | 01-08-2009 |
Syotarou Yamasaki, Kariya-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20150029759 | ELECTRIC POWER SOURCE DEVICE - An electric power source device has a transformer, a primary-side semiconductor module, a secondary-side semiconductor module, a secondary-side electrical component, a base plate and a circuit substrate on which substrate-side electrical components are mounted. The primary-side semiconductor module has a larger exterior size than the secondary-side electrical component. The primary-side semiconductor module and the secondary-side electrical component form a stacked section. In the stacked section, the secondary-side electrical component is stacked, in a vertical direction, i.e. a direction of a normal line of a mounting surface of the base plate, on the primary-side semiconductor module. The primary-side semiconductor module is directly mounted on the mounting surface. At least a part of the substrate-side electrical components is arranged inside of the primary-side semiconductor module in a horizontal direction, and inside of a second surface of the stacked section toward the mounting surface along the normal line. | 01-29-2015 |