Patent application number | Description | Published |
20080239614 | ELECTROSTATIC CHUCK WITH SEPARATED ELECTRODES - Electrostatic clamping devices and methods for reducing contamination to a workpiece coupled to an electrostatic clamping device are disclosed. According to an embodiment an electrostatic clamping device for coupling a workpiece comprises: an embossment portion on a surface of a body to contact the workpiece; and at least two electrodes within the body; wherein the two electrodes are separated by a separation portion below the embossment portion. | 10-02-2008 |
20090122458 | EMBOSSED ELECTROSTATIC CHUCK - An electrostatic chuck includes a layer having a plurality of protrusions to support a workpiece, wherein at least a portion of the layer has a first plurality of the plurality of protrusions. The first plurality of protrusions is spaced to geometrically form a pattern of hexagons. The first plurality of protrusions may be spaced an equal distance from adjacent protrusions and the equal distance may be about 4.0 millimeters from a center of one protrusion to a center of another protrusion. The present disclosure reduces peak mechanical stress levels conventionally present along an edge of each protrusion. Reducing such mechanical stress levels helps reduce backside damage to a supported workpiece, which in turn can reduce the generation of unwanted particles caused by such damage. | 05-14-2009 |
20100083980 | Platen Cleaning Method - A method for cleaning a workpiece support that includes using a workpiece that has been coated on its bottom surface with a suitable material is disclosed. This specially coated workpiece is placed on the support, and some time later, it is removed, taking with it particles from the support. In certain embodiments, the workpiece undergoes an ion implantation process to increase its temperature, and to increase the tackiness of the coating on the bottom surface. The material used to coat the bottom can be of variable types, including photoresists, oxides and deposited glasses. | 04-08-2010 |
20120200980 | TRIBOELECTRIC CHARGE CONTROLLED ELECTROSTATIC CLAMP - An electrostatic clamp which more effectively removes built up charge from a substrate prior to removal is disclosed. Currently, the lift pins and the ground pins are the only mechanism used to remove charge from the substrate after implantation. The present discloses describes an electrostatic chuck in which the top dielectric surface has an embedded conductive region, such as a ring shaped conductive region in the sealing ring. Thus, regardless of the orientation of the substrate during release, at least a portion of the substrate will contain the conductive region on the dielectric layer of the workpiece support. This conductive region may be connected to ground through the use of conductive vias in the dielectric layer. In some embodiments, these conductive vias are the fluid conduits used to supply gas to the back side of the substrate. | 08-09-2012 |
20130037052 | PLATEN CLEANING METHOD - A method for cleaning a workpiece support that includes using a workpiece that has been coated on its bottom surface with a suitable material is disclosed. This specially coated workpiece is placed on the support, and some time later, it is removed, taking with it particles from the support. In certain embodiments, the workpiece undergoes an ion implantation process to increase its temperature, and to increase the tackiness of the coating on the bottom surface. The material used to coat the bottom can be of variable types, including photoresists, oxides and deposited glasses. | 02-14-2013 |
20130070384 | High Surface Resistivity Electrostatic Chuck - In accordance with an embodiment of the invention, there is provided an electrostatic chuck. The electrostatic chuck comprises an electrode, and a surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck, the surface layer including a charge control layer comprising a surface resistivity of greater than about 10 | 03-21-2013 |
20130155569 | High Conductivity Electrostatic Chuck - In accordance with an embodiment of the invention, there is provided an electrostatic chuck comprising a conductive path covering at least a portion of a workpiece-contacting surface of a gas seal ring of the electrostatic chuck, the conductive path comprising at least a portion of an electrical path to ground; and a main field area of a workpiece-contacting surface of the electrostatic chuck comprising a surface resistivity in the range of from about 10 | 06-20-2013 |
Patent application number | Description | Published |
20090317964 | PLATEN FOR REDUCING PARTICLE CONTAMINATION ON A SUBSTRATE AND A METHOD THEREOF - Techniques for reducing particle contamination on a substrate are disclosed. In one particular exemplary embodiment, the technique may be realized with a platen having different regions, where the pressure levels in the regions may be substantially equal. For example, the platen may comprise a platen body comprising first and second recesses, the first recess defining a fluid region for holding fluid for maintaining a temperature of the substrate at a desired temperature, the second recess defining a first cavity for holding a ground circuit; a first via defined in the platen body, the first via having first and second openings, the first opening proximate to the fluid region and the second opening proximate to the first cavity, wherein pressure level of the fluid region may be maintained at a level that is substantially equal to pressure level of the first cavity. | 12-24-2009 |
20100265631 | REMOVAL OF CHARGE BETWEEN A SUBSTRATE AND AN ELECTROSTATIC CLAMP - An electrostatic clamp, which more effectively removes built up charge from a substrate prior to and during removal, is disclosed. Currently, the lift pins and ground pins are the only mechanisms used to remove charge from the substrate after implantation. The present discloses describes a clamp having one of more additional low resistance paths to ground. These additional conduits allow built up charge to be dissipated prior to and during the removal of the substrate from the clamp. By providing sufficient charge drainage from the backside surface of the substrate | 10-21-2010 |
20110036990 | PLATEN TO CONTROL CHARGE ACCUMULATION - An embossed platen to control charge accumulation includes a dielectric layer, a plurality of embossments on a surface of the dielectric layer to support a workpiece, each of a first plurality of the plurality of embossments having a conductive portion to contact a backside of the workpiece when the workpiece is in a clamped position, and a conductor to electrically couple the conductive portion of the first plurality of embossments to ground. An ion implanter having such an embossed platen is also provided. | 02-17-2011 |
20130248738 | PLATEN CLAMPING SURFACE MONITORING - An ion implanter includes a platen having a clamping surface configured to support a wafer for treatment with ions, the platen also having at least one pair of electrodes under the clamping surface, a clamping power supply configured to provide an AC signal to the at least one pair of electrodes and a sensed signal representative of the AC signal, and a controller. The controller is configured to receive the sensed signal from the clamping power supply when no wafer is clamped to the clamping surface. The controller is further configured to monitor the sensed signal and determine if the sensed signal is representative of deposits on the clamping surface exceeding a predetermined deposit threshold. | 09-26-2013 |
20140324372 | SYSTEM AND METHOD FOR ANALYZING VOLTAGE BREAKDOWN IN ELECTROSTATIC CHUCKS - A system, instructions and a method of determining when an impending failure is likely to occur absent corrective action are disclosed. The system samples the output of a power supply which powers an electrostatic chuck, and determines when that output is outside acceptable limits. The output is sampled at a sufficiently high frequency so as to detect transient anomalies, which are not detectable at lower sampling rates. In some embodiments, the output is converted to a frequency spectrum. The empirical model is compared to known good reference models and, in some embodiments, failure reference models of known failure modes to determine whether an impending failure will occur, and which type of failure. | 10-30-2014 |
Patent application number | Description | Published |
20100002832 | Medical X-Ray Imaging Apparatus - The invention relates to a medical X-ray imaging apparatus comprising a frame part, an X-ray source for producing X-rays, radiation receiving means for detecting radiation transmitted through an object, and support means for supporting the X-ray source and the receiving means in positions on opposite sides of the object. The support means are connected to the frame part so as to rotate around the axis of rotation provided with actuator means for rotating the said support means around the said axis of rotation. The apparatus makes possible both panoramic imaging and CT imaging, as selected by the operator. The X-ray apparatus comprises means for adjusting the ratio of enlargement so as to be optimal for each method of imaging used respectively. | 01-07-2010 |
20110176717 | METHOD AND DEVICE FOR X-RAY COMPUTER TOMOGRAPHY - A method, device and software for performing tomographic imaging with several offset values in such a way that the first imaging phase is performed by scanning at least a part of the object to be imaged by following the first arc of the first rotating movement to produce the first image information, —the offset of the imaging is changed between imaging phases during imaging, —at least one other imaging phase is performed with at least one changed offset to produce second image information of at least part of the object, —the said image information produced by different offsets is combined into three-dimensional image information. | 07-21-2011 |
20110305320 | X-Ray Imaging Systems and Methods - X-ray imaging systems and methods utilize an imaging apparatus comprising an emitter emitting X-rays through an object and a receiver receiving the X-rays. A control circuit controls the emitter and processes the X-rays received by the receiver to generate X-ray images of the object. The control circuit controls a display to display an initial view of the object, the display of the initial view being modifiable by a user; controls the imaging apparatus to generate an X-ray positioning image of the object based upon a user modification of the display of the initial view; controls the display to display the positioning image, the display of the positioning image being modifiable by a user; and controls the imaging apparatus to generate an X-ray image of the object based upon a user modification of the display of the positioning image. | 12-15-2011 |