Patent application number | Description | Published |
20100084716 | Semiconductor device - Provided is a semiconductor device including a substrate, a gate insulating film which is formed on the substrate, and a gate electrode which is provided on the gate insulating film. The gate electrode includes a first metal silicide including a first metal material, and a second metal silicide including one of a second metal material and the second metal material in a contact portion between the gate insulating film and the gate electrode. The second metal silicide including the second metal material is a metal-rich silicide in which the composition ratio of the second metal material to silicon in the second metal silicide including the second metal is greater than 1. | 04-08-2010 |
20130037795 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - An element using a semiconductor layer is formed between wiring layers and, at the same time, a gate electrode is formed using a conductive material other than a material for wirings. A first wiring is embedded in a surface of a first wiring layer. A gate electrode is formed over the first wiring. The gate electrode is coupled to the first wiring. The gate electrode is formed by a process different from a process for the first wiring. Therefore, the gate electrode can be formed using a material other than a material for the first wiring. Further, a gate insulating film and a semiconductor layer are formed over the gate electrode. | 02-14-2013 |
20130049134 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME - In a semiconductor device and a method of making the same, a first transistor has a gate stack comprising an underlying layer formed of a first material and an overlying layer formed of a second material. A second transistor has a gate stack comprising an underlying layer formed of a third material and an overlying layer formed of the second material. A third transistor has a gate stack comprising an underlying layer formed of the first material and an overlying layer formed of a fourth material. A fourth transistor has a gate stack comprising an underlying layer formed of the third material and an overlying material formed of the fourth material. Each of the first through fourth materials has a respectively different work function, so that each of the first through fourth transistors has a respectively different threshold voltage. | 02-28-2013 |
20130181221 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A circuit including an inverter is provided for a wiring layer. | 07-18-2013 |
20130200363 | SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - There is provided a readily manufacturable semiconductor device including two transistors having mutually different characteristics. The semiconductor device includes a substrate, a multilayer wiring layer disposed over the substrate, a first transistor disposed in the multilayer wiring layer, and a second transistor disposed in a layer different from a layer including the first transistor disposed therein of the multilayer wiring layer, and having different characteristics from those of the first transistor. This can provide a readily manufacturable semiconductor device including two transistors having mutually different characteristics. | 08-08-2013 |
20130200472 | SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - The performances of semiconductor elements disposed in a multilayer wiring layer are improved. A semiconductor device includes: a first wire disposed in a first wiring layer; a second wire disposed in a second wiring layer stacked over the first wiring layer; a gate electrode arranged between the first wire and the second wire in the direction of stacking of the first wiring layer and the second wiring layer, and not coupled with the first wire and the second wire; a gate insulation film disposed over the side surface of the gate electrode; and a semiconductor layer disposed over the side surface of the gate electrode via the gate insulation film, and coupled with the first wire and the second wire. | 08-08-2013 |
20140054584 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device is provided which includes an N-type semiconductor layer and a P-type semiconductor layer coexisting in the same wiring layer without influences on the properties of a semiconductor layer. The semiconductor device includes a first wiring layer with a first wiring, a second wiring layer with a second wiring, and first and second transistors provided in the first and second wiring layers. The first transistor includes a first gate electrode, a first gate insulating film, a first oxide semiconductor layer, a first hard mask layer, and first insulating sidewall films covering the sides of the first oxide semiconductor layer. The second transistor includes a second gate electrode, a second gate insulating film, a second oxide semiconductor layer, and a second hard mask layer. | 02-27-2014 |
20140061810 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Provided is an in-wiring-layer active element (component) which allows for electrical isolation between a gate electrode and a channel in a top gate structure. A semiconductor device includes a first wiring layer, a second wiring layer, and a semiconductor element. The first wiring layer has a first interlayer insulating layer, and a first wire embedded in the first interlayer insulating layer. The second wiring layer has a second interlayer insulating layer, and second wires embedded in the second interlayer insulating layer. The semiconductor element is provided at least in the second wiring layer. The semiconductor element includes a semiconductor layer provided in the second wiring layer, a gate insulating film provided in contact with the semiconductor layer, a gate electrode provided on the opposite side of the semiconductor layer via the first gate insulating film, and a first side wall film provided over a side surface of the semiconductor layer. | 03-06-2014 |
20140077206 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A semiconductor device has a p-type metal oxide semiconductor layer; a source electrode connected with the p-type metal oxide semiconductor layer; a drain electrode connected with the p-type metal oxide semiconductor layer; and a gate electrode arranged to oppose to a part of the p-type metal oxide semiconductor layer. The gate electrode and the drain electrode are separated from each other in a top view. | 03-20-2014 |
20140183525 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - The present invention makes it possible to increase the selectivity of a gate insulation film in an active element formed in a wiring layer. | 07-03-2014 |
Patent application number | Description | Published |
20090020742 | SOLID ELECTROLYTE SWITCHING ELEMENT, AND FABRICATION METHOD OF THE SOLID ELECTROLYTE ELEMENT, AND INTEGRATED CIRCUIT - The switching element of the present invention is of a configuration that includes: a first electrode ( | 01-22-2009 |
20090316484 | SEMICONDUCTOR MEMORY DEVICE, METHOD OF DRIVING THE SAME AND METHOD OF MANUFACTURING THE SAME - Disclosed is a semiconductor storage device comprising a semiconductor substrate, a first and a second impurity diffusion layer formed in the semiconductor substrate, a gate insulating film formed on the semiconductor substrate, and a first gate electrode formed on the semiconductor substrate via the gate insulating film. The gate insulating film has a nitrogen-containing silicon oxide film inside, and a silicon oxide film is so arranged on both sides of the nitrogen-containing silicon oxide film as to sandwich the nitrogen-containing silicon oxide film. In addition, the nitrogen composition in the nitrogen-containing silicon oxide film is increased from the semiconductor substrate side to the first gate electrode side. | 12-24-2009 |
20100044775 | SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE - Provided is a semiconductor memory device that can retain information by trapping electric charges into a trap level in a gate insulating film. The information retention capacity is improved by restricting lateral diffusion of electric charges. The semiconductor memory device is provided with a semiconductor substrate ( | 02-25-2010 |
20100059730 | RESISTANCE CHANGE ELEMENT AND SEMICONDUCTOR DEVICE INCLUDING THE SAME - To use a resistance change element having an MIM structure, which is obtained by stacking a metal, a metal oxide, and a metal, as a switching element, it is necessary to achieve OFF resistance higher than that required in a memory element by a factor of at least 1000. On the other hand, when a resistance change element is used as a memory element and when the difference between the ON resistance and the OFF resistance is a large value, high performance, for example, a short readout time, can be achieved. The present invention therefore provides a resistance change element capable of maintaining low ON resistance and achieving high OFF resistance. High OFF resistance can be achieved while low ON resistance is maintained by adding a second metal that is not contained in a metal oxide, which is a resistance change material, the second metal being capable of charge-compensating for metal deficiency or oxygen deficiency. | 03-11-2010 |
Patent application number | Description | Published |
20110198709 | Semiconductor device and method of manufacturing the same - A semiconductor device includes a gate stack structure. The gate stack structure includes an interfacial layer formed on a semiconductor substrate, a high-k dielectric formed on the interfacial layer, a silicide gate including a diffusive material and an impurity metal, and formed over the high-k dielectric, and a barrier metal with a barrier effect to the diffusive material, and formed between the high-k dielectric and the metal gate. The impurity metal has a barrier effect to the diffusive material so that the diffusive material in the silicide gate can be prevented from being introduced into the high-k dielectric. | 08-18-2011 |
20120309184 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of forming a semiconductor device includes forming an interfacial layer on a semiconductor substrate, forming a high-k dielectric on the interfacial layer, forming a barrier metal on the high-k dielectric, forming a poly-silicon layer on the barrier metal, patterning the interfacial layer, the high-k dielectric, the barrier metal and the poly-silicon to form a gate stack forming spacers, extension regions, sidewalls and source/drain regions, forming an interlayer dielectric on the gate stack, etching off a portion of the interlayer dielectric to expose the poly-silicon layer, forming an impurity metal layer, which includes an impurity metal having a barrier effect to the diffusive material, and a metal layer including a diffusive material, on the poly-silicon layer and converting the poly-Si layer into a silicide containing the impurity metal. The barrier metal includes a titanium nitride (TiN) or a tantalum nitride (TaN). | 12-06-2012 |