Patent application number | Description | Published |
20120162175 | PIXEL UNIT OF ORGANIC LIGHT EMITTING DIODE AND DISPLAY PANEL USING THE SAME - A pixel unit for driving an organic light emitting diode (OLED) is disclosed. The pixel unit includes a driving transistor, a compensating capacitor, a selecting switch module, a power switch and a configuration switch. One terminal of the compensating capacitor is coupled to a gate of the driving transistor. The selecting switch module provides the ground voltage or the compensating voltage to the other terminal of the compensating capacitor according to a first control signal. The power switch is coupled between a power voltage and a drain of the driving transistor and is controlled by a second control signal. The configuration switch receives the first control signal for controlling a connecting configuration of the driving transistor. The pixel unit is driven according to the first and the second control signals for compensating threshold voltage shifting of the OLED and the driving transistor. | 06-28-2012 |
20130069537 | PIXEL CIRCUIT AND DRIVING METHOD THEREOF - The disclosure relates to a pixel circuit which includes an LED, a storage capacitor, a driving transistor, and first to third switching transistors. The driving transistor is utilized to control connection/disconnection between a power supply voltage and the LED. The first switching transistor receives a first scanning signal for controlling connection/disconnection between a gate of the driving transistor and the power supply voltage. The second switching transistor receives a second scanning signal for controlling connection/disconnection between the storage capacity and a ground voltage. The third switching transistor receives the first scanning signal for controlling connection/disconnection between the storage capacity and a data voltage. The first scanning signal and the second scanning signal are in antiphase to each other. A driving method thereof is also disclosed. | 03-21-2013 |
20130201086 | ACTIVE LIGHT EMITTING DEVICE - An active light emitting device disposed on a substrate is provided. The active light emitting device includes a scan line, a data line, a power line, a circuit unit, and a light emitting unit. The circuit unit is connected to the scan line, the data line, and the power line. The circuit unit at least includes an overlapping component which is at least partially overlapped with the power line. The light emitting unit is driven by the circuit unit. A light emitting region and a circuit region on the substrate are defined respectively by the light emitting unit and the circuit unit. | 08-08-2013 |
20130271501 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND OPERATING METHOD THEREOF - An organic light emitting diode (OLED) display and an operating method thereof are provided. The organic light emitting diode display includes an organic light emitting diode display panel and a driving circuit. The organic light emitting diode display panel has a plurality of pixels. The driving circuit is coupled to the organic light emitting display panel and receives a primitive display frame. The driving circuit generates a first frame and a second frame corresponding to the primitive display frame by a polarity inverting means, and outputs a zero gray-level pixel voltage to the corresponding pixels of the organic light emitting diode display panel corresponding to a negative polarity data of the first frame and the second frame, wherein the second frame is adjacent to the first frame. | 10-17-2013 |
20130335394 | DRIVING CIRCUIT OF AN ORGANIC LIGHT EMITTING DEVICE AND METHOD OF OPERATING A DRIVING CIRCUIT OF AN ORGANIC LIGHT EMITTING DEVICE - A driving circuit of an organic light emitting device includes a switch module, a capacitor, and a driving unit. The switch module includes a first switch unit and a second switch unit. The first switch unit is coupled to a data line. The second switch unit is coupled to the organic light emitting device. During a programming period, the first switch unit is turned on and the second switch unit is turned off; and during an emission period, the first switch unit is turned off and the second switch unit is turned on. The capacitor is coupled to the first switch unit for being charged to a data voltage according to a data current of the data line during the programming period. The driving unit is used for generating a driving current to drive the organic light emitting device according to the data voltage during the emission period. | 12-19-2013 |
20140085284 | ORGANIC LIGHT EMITTING DIODE DISPLAY APPARATUS - An organic light emitting diode (OLED) display apparatus includes a power circuit and a pixel. The power circuit serves to provide a first voltage. The pixel includes a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, a capacitor, and an OLED. During a programming period, a first terminal of the capacitor receives a data voltage through the turned-on first transistor, a first terminal of the second transistor receives the first voltage, a control terminal of the second transistor is coupled to a second terminal of the capacitor and coupled to a second terminal of the second transistor through the turned-on third transistor, and the power circuit regulates a voltage level or a current of the first voltage to accelerate a voltage level of the control terminal of the second transistor to reach a target voltage. | 03-27-2014 |
20140209868 | ORGANIC LIGHT EMITTING DIODE DISPLAY APPARATUS AND PIXEL CIRCUIT THEREOF - An organic light emitting diode display apparatus and a pixel circuit thereof are provided. The pixel circuit includes a switch unit, a capacitor, a first transistor, a second transistor, a third transistor and an organic light emitting diode. In a pre-charging period, a first terminal of the capacitor receives a data voltage through the switch unit, and a second terminal of the capacitor receives a high voltage through the turned-on first transistor. In a programming period, the first terminal of the capacitor receives the data voltage through the switch unit, and the second terminal of the capacitor receives the high voltage that is encoded through the turned-on second and third transistors. In a display period, the first terminal of the capacitor receives a ground voltage through the switch unit, and the first and third transistors are turned-off. | 07-31-2014 |
20140362068 | DRIVING CIRCUIT - A driving circuit includes a first transistor, a capacitor, a second transistor, and a charging circuit. The input terminal of the first transistor is electrically connected to a voltage source. The output terminal of the first transistor is electrically connected to an organic light-emitting diode. The first terminal of the capacitor is electrically connected to the control terminal of the first transistor. The input terminal of the second transistor is electrically connected to the second terminal of the capacitor. The control terminal of the second transistor is electrically connected to a scan line. The output terminal of the second transistor is electrically connected to the output terminal of the first transistor. The charging circuit is electrically connected to the first and second terminals of the capacitor, the scan line, and a current source. | 12-11-2014 |
20150049006 | PIXEL CIRCUIT OF ORGANIC LIGHT EMITTING DIODE - A pixel circuit of an organic light emitting diode (OLED) is provided. The pixel circuit includes an OLED, a first transistor, a second transistor and a capacitor. The OLED receives a first voltage. A terminal of the first transistor is coupled to the OLED, and another terminal of the first transistor receives a second voltage. A terminal of the second transistor is coupled to the terminal of the first transistor, another terminal of the second transistor is coupled to a control terminal of the first transistor, a control terminal of the second transistor receives a scan signal. The capacitor is coupled between the control terminal of the first transistor and a third voltage. When the scan signal is enabled, the second voltage is set to a data voltage, the third voltage is set to a reference voltage, and the first voltage is set to a low voltage. | 02-19-2015 |
20150049007 | PIXEL DRIVING CIRCUIT OF ORGANIC-LIGHT EMITTING DIODE - A pixel driving circuit of an organic light emitting diode includes a first transistor including a first terminal, a control terminal and a second terminal and a capacitor including a first terminal and a second terminal. The first terminal and the second terminal of the capacitor are electrically coupled to the first terminal and the control terminal of the first transistor at a first node and a second node respectively. In a first period, a power source does not provide a power supply voltage to the first node, and a data voltage and a variable voltage are written in the first node and the second node respectively. In a second period, the power source provides the power supply voltage to the first node. The first transistor provides a driving current to an organic light emitting diode based on the voltage of the first node and the second node. | 02-19-2015 |
20150123081 | PIXEL ARRAY SUBSTRATE AND ORGANIC LIGHT-EMITTING DIODE DISPLAY - A pixel array substrate includes a first substrate, pixel units, data lines, scan lines, constant voltage lines, a constant voltage source, a constant voltage pad, and a conductive pattern. The first substrate has pixel regions and a peripheral region surrounding the pixel regions. The conductive pattern includes conductive lines interlaced with each other to form a net and a conductive frame that surrounds and is electrically coupled to the conductive lines. The conductive frame is in electrical contact with the constant voltage pad within the peripheral region. Each pixel region is defined by two adjacent scan lines and two adjacent data lines. A portion of one of the constant voltage lines located completely within each of the pixel regions is in electrical contact with one of the conductive lines within the pixel region. An OLED display including the pixel array substrate and another OLED are also provided. | 05-07-2015 |
Patent application number | Description | Published |
20090160406 | CHARGING METHOD AND SYSTEM UTILIZING THE SAME - A charging method for a rechargeable battery is disclosed. A preset power is provided to the rechargeable battery when the rechargeable battery is connected to a charger for execution of a first charge process. A use state of the rechargeable battery is obtained. A first adjustable charge power is provided to the rechargeable battery when the rechargeable battery is reconnected to the charger for execution of a second charge process. | 06-25-2009 |
20100072948 | CHARACTERISTIC TRACKING METHOD AND CIRCUIT FOR A BATTERY MODULE - A characteristic tracking method for a battery module including at least one battery is disclosed. A look-up table is provided according to a primary characteristic of the battery. It is determined whether a battery has satisfied a preset condition when the battery module is operated from a usage state to an idling state. The battery is measured to have obtained a first voltage and a real capacity when the battery satisfies the preset condition. The measured first voltage is utilized to locate a table capacity of the battery from the look-up table. The look-up table is updated according to the real capacity and the table capacity. A peripheral circuit of characteristic tracking method has been exhibited. | 03-25-2010 |
20120133331 | METHOD FOR CHECKING AND MODULATING BATTERY CAPACITY AND POWER BASED ON DISCHARGING/CHARGING CHARACTERISTICS - A method for checking and modulating battery capacity and power based on charging/discharging characteristics is provided. In terms of discharge, a relationship between an open circuit voltage and an output electric capacity of a battery is measured to obtain a first characteristic curve. A relationship between a voltage and the output electric capacity of a battery at a predetermined maximum charge/discharge current rate is measured to obtain a second characteristic curve. A characteristic boundary line passing the first and the second characteristic points respectively selected from the first and the second characteristic curves is established. A voltage value corresponding to the first characteristic point is higher than a voltage value corresponding to the second characteristic point. The first and the second characteristic curves, and the characteristic boundary line define an operation range. The battery is charged/discharged within the operation range. | 05-31-2012 |
20130110428 | Method And System For Estimating A Capacity Of A Battery | 05-02-2013 |
20130127423 | BATTERY PACK AND METHOD OF CONTROLLING CHARGE-AND-DISCHARGE OF BATTERY PACK BY ITS THERMOELECTRIC PROPERTY - A battery pack and a method for controlling charge-and-discharge of the battery pack by its thermoelectric property are provided, in which the battery pack has a plurality of thermal regions divided by different ranges of temperature. The battery pack includes a plurality of parallel-connected battery groups and a plurality of variable resistances. The parallel-connected battery groups are located in the thermal regions respectively, and each of the parallel-connected battery groups includes batteries connected in parallel. The variable resistances are disposed between two parallel-connected battery groups. | 05-23-2013 |
20130166234 | METHOD FOR ESTIMATING BATTERY DEGRADATION - A method for estimating battery degradation is provided. In this method, a remaining capacity is obtained by looking up a device characteristic table according to a steady open circuit voltage of a battery. Besides, a constant current is provided to charge the battery, and when a terminal voltage of the battery reaches to a charging preset voltage, a constant voltage is provided to charge the battery. The transition point information at the transition from a constant current mode to a constant voltage mode, which includes a transition point estimated open circuit voltage, a transition point voltage, a transition point current and a transition point battery temperature, is analyzed based on voltage, current, temperature and capacity information measured during the charging process. A battery degradation index is calculated from the transition point information. | 06-27-2013 |
20140167706 | CHARGING METHOD FOR A RECHARGEABLE BATTERY AND CHARGING ARCHITECTURE THEREWITH - A charging method for a rechargeable battery and a related charging architecture are provided. The provided charging method includes following steps. A characteristic curve of the rechargeable battery related to charge cycle vs. a residual capacity of a non-constant voltage charging stage under a warranty life limitation is provided. An expected residual capacity corresponding to a condition when a terminal voltage of the rechargeable battery reaches a limited charge voltage is found from the characteristic curve related to the charge cycle vs. the residual capacity of the non-constant voltage charging stage by using a current charge cycle count of the rechargeable battery. A real residual capacity corresponding to a condition when the terminal voltage of the rechargeable battery reaches the limited charge voltage approaches to the expected residual capacity by adjusting a charging current of the rechargeable battery. | 06-19-2014 |
Patent application number | Description | Published |
20120106140 | LIGHT-EMITTING DIODE LAMP AND METHOD OF MAKING - A Light-Emitting Diode (LED) lamp includes a heat sink with a number of passive air flow ducts defined at least partially by fins of the heat sink and a cover plate over the fins. The heat sink includes a body with a cavity, a number of fins radiating outwards from the body, and a cover plate covering the fins. Each passive air flow duct includes top and bottom openings for air flow. | 05-03-2012 |
20120201007 | SYSTEMS AND METHODS PROVIDING THERMAL SPREADING FOR AN LED MODULE - A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad. | 08-09-2012 |
20120292655 | LIGHT EMITTING DIODE CARRIER - A light emitting diode (LED) carrier assembly includes an LED die mounted on a silicon submount, a middle layer that is thermally conductive and electrically isolating disposed below the silicon submount, and a printed circuit board (PCB) disposed below the middle layer. The middle layer is bonded with the silicon submount and the PCB. | 11-22-2012 |
20120293978 | LED LAMP WITH IMPROVED LIGHT OUTPUT - The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure. | 11-22-2012 |
20120299019 | Systems and Methods Providing Semiconductor Light Emitters - A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board. | 11-29-2012 |
20120306341 | LIGHT-EMITTING-DIODE-BASED LIGHT BULB - The embodiments of a light-emitting-diode-based (LED-based) light bulb and an LED assembly described provide mechanisms of reflecting generated by LED emitters toward the back of the LED-based light bulb. An upper substrate and a lower substrate are used to support upper and lower LED emitters. A slanted and reflective surface between the upper substrate and the lower substrate reflects light generated by the lower LED emitters toward the backside of the LED-based light bulb. | 12-06-2012 |
20120313518 | LED LAMP AND METHOD OF MAKING THE SAME - A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module. | 12-13-2012 |
20130027946 | WIDE ANGLE BASED INDOOR LIGHTING LAMP - The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination. | 01-31-2013 |
20130038222 | COLOR TEMPERATURE ADJUSTMENT FOR LED LAMPS USING SWITCHES - A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time. | 02-14-2013 |
20130094180 | COATED DIFFUSER CAP FOR LED ILLUMINATION DEVICE - The present disclosure provides an illumination device. The illumination device includes a light emitting device (LED) on a substrate. A heat sink is thermally connected to the LED device. A cap is secured over the substrate and covers the LED device. The cap includes a coating material that comprises both diffusion and reflection characteristics. | 04-18-2013 |
20130148346 | ENERGY STAR COMPLIANT LED LAMP - The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments. | 06-13-2013 |
20130155673 | LED LIGHTING APPARATUS WITH FLEXIBLE LIGHT MODULES - The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings. | 06-20-2013 |
20130309790 | Systems and Methods Providing Semiconductor Light Emitters - A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board. | 11-21-2013 |
20130314915 | LED LAMP AND METHOD OF MAKING THE SAME - A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module. | 11-28-2013 |
20140184081 | Color Temperature Adjustment for LED Lamps Using Switches - A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time. | 07-03-2014 |
20140185301 | Energy Star Compliant LED Lamp - The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments. | 07-03-2014 |
20140198499 | LED Lighting Apparatus with Flexible Light Modules - The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings. | 07-17-2014 |
20140240957 | LED Lamp with Improved Light Output - The present disclosure involves an LED lamp. The LED lamp includes a plurality of light-emitting diode (LED) light sources located on a substrate. At least a subset of the LED light sources is free of a phosphor coating. The LED lamp includes a multi-layered cap structure located over at least the subset of the LED light sources. The cap structure contains a phosphor material and a diffuser material. The cap structure is physically separated from the subset of the LED light sources by a gap. The LED lamp includes a cover structure positioned over and surrounding the LED light sources and the cap structure. | 08-28-2014 |
20140254180 | Systems and Methods Providing Thermal Spreading for an LED Module - A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad. | 09-11-2014 |
20140293615 | WIDE ANGLE BASED INDOOR LIGHTING LAMP - The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a substrate. A light-emitting diode (LED) is disposed over the substrate. A first lens is disposed over the LED. A second lens is disposed over the first lens. The first lens and the second lens are configured to refract light that is emitted by the LED backward. | 10-02-2014 |
20140307435 | LIGHT-EMITTING-DIODE-BASED LIGHT BULB - A lighting apparatus includes a first substrate, a plurality of first light-emitting devices disposed on the first substrate, a second substrate disposed over the first substrate, and a plurality of second light-emitting devices disposed on the second substrate. A reflective surface is disposed between the first substrate and the second substrate. The reflective surface is configured to reflect light emitted by at least some of the first light-emitting devices in a direction that is at least partially toward the first substrate. The reflective surface has one of: a saw-patterned side view profile, or a curved side view profile that is free of having an inflection point. | 10-16-2014 |
20150085493 | LIGHT-EMITTING DIODE LAMP AND METHOD OF MAKING - An apparatus includes a light-emitting device. A diffuser is disposed over the light-emitting device. A heat sink is disposed below, and thermally coupled to, the light-emitting device. The heat sink includes a body and a plurality of fins that radially protrude from the body of the heat sink. The fins define a plurality of ducts. A cover plate circumferentially surrounds the heat sink. The cover plate includes a plurality of openings that are disposed over the plurality of ducts, respectively. | 03-26-2015 |
Patent application number | Description | Published |
20100252930 | Method for Improving Performance of Etch Stop Layer - A method of forming an interconnect structure includes providing a dielectric layer; forming a metal line in the dielectric layer; and forming a composite etch stop layer (ESL), which includes forming a lower ESL over the metal line and the dielectric layer; and forming an upper ESL over the lower ESL. The upper ESL and the lower ESL have different compositions. The step of forming the lower ESL and the step of forming the upper ESL are in-situ performed. | 10-07-2010 |
20120256324 | Method for Improving Performance of Etch Stop Layer - A method of forming an interconnect structure includes providing a dielectric layer; forming a metal line in the dielectric layer; and forming a composite etch stop layer (ESL), which includes forming a lower ESL over the metal line and the dielectric layer; and forming an upper ESL over the lower ESL. The upper ESL and the lower ESL have different compositions. The step of forming the lower ESL and the step of forming the upper ESL are in-situ performed. | 10-11-2012 |
20130193541 | UV Radiation Recovery of Image Sensor - A method of an embodiment comprises forming a dielectric layer on a first side of an image sensor substrate, and exposing the dielectric layer to ultraviolet (UV) radiation. The image sensor substrate comprises a photo diode. A structure of an embodiment comprises a substrate and a charge-less dielectric. The substrate comprises a photo diode. The charge-less dielectric layer is on a first side of the substrate, and a total charge of the charge-less dielectric results in an average voltage drop of less than 0.2 V across the charge-less dielectric layer. | 08-01-2013 |
20130241018 | Grids in Backside Illumination Image Sensor Chips and Methods for Forming the Same - A device includes a semiconductor substrate having a front side and a backside, a photo-sensitive device disposed on the front side of the semiconductor substrate, and a first and a second grid line parallel to each other. The first and the second grid lines are on the backside of, and overlying, the semiconductor substrate. The device further includes an adhesion layer, a metal oxide layer over the adhesion layer, and a high-refractive index layer over the metal layer. The adhesion layer, the metal oxide layer, and the high-refractive index layer are substantially conformal, and extend on top surfaces and sidewalls of the first and the second grid lines. | 09-19-2013 |
20140007905 | WAFER CLEANING SYSTEM AND METHOD USING ELECTROLYTIC GAS FOR BACK-END PURGE - A wafer cleaning system includes a platform, a plurality of wafer holding units over the platform, a front-end rinse nozzle, and a back-end purge unit. The plurality of wafer holding units is set to define a reference plane of wafer holding. The front-end rinse nozzle is above the reference plane and configured to dispense a first rinse fluid toward the reference plane. The back-end purge unit is below the reference plane and configured to dispense an electrolytic gas | 01-09-2014 |
20140264478 | INTERFACE FOR METAL GATE INTEGRATION - A metal oxide semiconductor field effect transistor (MOSFET) includes a semiconductor substrate and a interlayer dielectric (ILD) over the semiconductor substrate. A gate structure is formed within the ILD and disposed on the semiconductor substrate, wherein the gate structure includes a high-k dielectric material layer and a metal gate stack. One or more portions of a protection layer are formed over the gate stack, and a contact etch stop layer is formed over the ILD and over the one or more portions of the protection layer. The metal gate stack includes aluminum and the protection layer includes aluminum oxide. | 09-18-2014 |
20140273385 | INTERFACE FOR METAL GATE INTEGRATION - A metal oxide semiconductor field effect transistor (MOSFET) includes a semiconductor substrate and an interlayer dielectric (ILD) over the semiconductor substrate. A gate structure is formed within the ILD and disposed on the semiconductor substrate, wherein the gate structure includes a high-k dielectric material layer and a metal gate stack. One or more portions of a protection layer are formed over the gate stack, and a contact etch stop layer is formed over the ILD and over the one or more portions of the protection layer. The metal gate stack includes aluminum and the protection layer includes aluminum oxide. | 09-18-2014 |
20150236067 | Grids in Backside Illumination Image Sensor Chips and Methods for Forming the Same - A device includes a semiconductor substrate having a front side and a backside, a photo-sensitive device disposed on the front side of the semiconductor substrate, and a first and a second grid line parallel to each other. The first and the second grid lines are on the backside of, and overlying, the semiconductor substrate. The device further includes an adhesion layer, a metal oxide layer over the adhesion layer, and a high-refractive index layer over the metal layer. The adhesion layer, the metal oxide layer, and the high-refractive index layer are substantially conformal, and extend on top surfaces and sidewalls of the first and the second grid lines. | 08-20-2015 |
Patent application number | Description | Published |
20110075778 | METHODS FOR CONTROLLING A MAIN CLOCK SOURCE SHARED BETWEEN DIFFERENT WIRELESS COMMUNICATIONS MODULES AND APPARATUSES USING THE SAME - A communications apparatus is provided. A first wireless communications module provides a first wireless communications service and communicates with a first communications device in compliance with a first protocol. A second wireless communications module provides a second wireless communications service and communicates with a second communications device in compliance with a second protocol. A clock source is shared by the first and the second communications modules and provides a reference clock to the first and the second communications modules. The first wireless communications module detects a request from the second wireless communications module for activating the clock source, determines whether the reference clock has been stably generated by the clock source, and adjusts an electrical characteristic of the clock source to facilitate the reference clock output from the clock source to achieve a target frequency when the reference clock has not been stably generated. | 03-31-2011 |
20110076945 | Methods for Controlling a Main Clock Source Shared Between Different Wireless Communication Modules and Apparatuses Using the Same - A wireless communications module coexisting with a wireless telephony communications module includes a radio frequency (RF) module, a MODEM, a clock generator and distributor and a system control logic. The system control logic issues an external interrupt (EINT) signal to the wireless telephony communications module for activating a clock source via the wireless telephony communications module. When the clock source is activated, the clock generator and distributor receives a reference clock from the activated clock source, converts the reference clock into one or more internal clocks and drives the internal clock or clocks to the RF module and the MODEM for synchronization therebetween. | 03-31-2011 |
20120287772 | METHOD FOR PERFORMING SERIAL TRANSPORT COMMUNICATION, AND ASSOCIATED DEVICE - A method for performing serial transport communication is provided, where the method is utilized for performing communication between a plurality of devices, each of which provides a user with a plurality of wireless communication functions respectively complying with different wireless communication standards. The method includes: with regard to a first wireless communication function of the plurality of wireless communication functions, utilizing a serial transport protocol to perform communication between the plurality of devices through a transport bus; and with regard to a second wireless communication function of the plurality of wireless communication functions, utilizing the serial transport protocol to perform communication between the plurality of devices through the transport bus. An associated device is also provided. | 11-15-2012 |
20120289276 | Communication Apparatus and Methods for Managing a Communication Indication Assessment Procedure and a Wireless Communications Service in Communications Apparatus - A communication apparatus is provided. The communications apparatus includes multiple radio modules and a manager. Each of the radio modules is arranged to provide a predetermined wireless communications service in compliance with a predetermined protocol. The manager is arranged to handle a communication indication assessment procedure of the radio modules to obtain an assessment result. The communication indication assessment procedure is performed by at least one of the radio modules, and the assessment result is shared with all of the radio modules. | 11-15-2012 |
20130040575 | COMMUNICATION METHOD, AND BLUETOOTH DEVICE UTILIZING THE COMMUNICATION METHOD - A communication method for a Bluetooth device in a scatternet which may include several piconets is proposed. The method includes transmitting data to a peer device in the first piconet, determining whether there is any buffered data to be transmitted to the peer device in the first piconet, and switching from the first piconet to the next piconet to transmit data to a peer device in the second piconet according to the determination result. | 02-14-2013 |
20130094491 | COMMUNICATIONS APPARATUSES AND METHOD FOR MULTI-LEVEL TRANSMISSION POWER CONTROL THEREOF - A communications apparatus is provided. A radio module transmits first packets before establishing a connection with a peer communications device. A transmission power utilized for transmitting the first packets is adjustable, so that multiple levels of transmission power are utilized for transmitting the first packets. | 04-18-2013 |
20140154985 | METHOD FOR CONTROLLING BLUETOOTH DEVICE FOR POWER CONSERVATION - A method for controlling a Bluetooth device for power conservation includes the steps of: establishing a Bluetooth link; controlling the Bluetooth device to enter sniff mode; handling a sniff anchor point after wakeup preparation and before sleep preparation; and handling a wakeup operation between the wakeup preparation and the sleep preparation. The wakeup/sleep preparation can be also done as few times as possible in the invention such that the power consumption of the Bluetooth device is effectively reduced. | 06-05-2014 |
20150230171 | METHOD FOR CONTROLLING BLUETOOTH DEVICE FOR POWER CONSERVATION - A method for controlling a Bluetooth device for power conservation includes the steps of: establishing a Bluetooth link; controlling the Bluetooth device to enter sniff mode; handling a sniff anchor point after wakeup preparation and before sleep preparation; and handling a wakeup operation between the wakeup preparation and the sleep preparation. The wakeup operation is a BLE (Bluetooth Low Energy) operation or a Wi-Fi operation. The wakeup/sleep preparation can be also done as few times as possible in the invention such that the power consumption of the Bluetooth device is effectively reduced. | 08-13-2015 |
Patent application number | Description | Published |
20120306028 | SEMICONDUCTOR PROCESS AND STRUCTURE THEREOF - A semiconductor process is provided, including: a substrate is provided, a buffer layer is formed, and a dielectric layer having a high dielectric constant is formed, wherein the methods of forming the buffer layer include: (1) an oxidation process is performed; and a baking process is performed; Alternatively, (2) an oxidation process is performed; a thermal nitridation process is performed; and a plasma nitridation process is performed; Or, (3) a decoupled plasma oxidation process is performed. Furthermore, a semiconductor structure fabricated by the last process is also provided. | 12-06-2012 |
20130012012 | SEMICONDUCTOR PROCESS - A semiconductor process includes the following steps. A substrate having an oxide layer thereon is provided. A high temperature process higher than 1000° C. is performed to form a melting layer between the substrate and the oxide layer. A removing process is performed to remove the oxide layer and the melting layer. | 01-10-2013 |
20130045594 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE HAVING METAL GATE - A manufacturing method for a semiconductor device having a metal gate includes providing a substrate having at least a first semiconductor device formed thereon, forming a first gate trench in the first semiconductor device, forming a first work function metal layer in the first gate trench, and performing a decoupled plasma oxidation to the first work function metal layer. | 02-21-2013 |
20130072028 | PROCESS FOR FABRICATING SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING METAL OXIDE SEMICONDUCTOR DEVICE - A process for fabricating a semiconductor device is described. A silicon oxide layer is formed. A nitridation process including at least two steps is performed to nitridate the silicon oxide layer into a silicon oxynitride (SiON) layer. The nitridation process comprises a first nitridation step and a second nitridation step in sequence, wherein the first nitridation step and the second nitridation step are different in the setting of at least one parameter. | 03-21-2013 |
20130075874 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF - A semiconductor structure includes a substrate, an oxide layer, a metallic oxynitride layer and a metallic oxide layer. The oxide layer is located on the substrate. The metallic oxynitride layer is located on the oxide layer. The metallic oxide layer is located on the metallic oxynitride layer. In addition, the present invention also provides a semiconductor process for forming the semiconductor structure. | 03-28-2013 |
20130078818 | SEMICONDUCTOR PROCESS - A semiconductor process includes the following steps. A substrate is provided. At least a fin-shaped structure is formed on the substrate and an oxide layer is formed on the substrate without the fin-shaped structure forming thereon. A thermal treatment process is performed to form a melting layer on at least a part of the sidewall of the fin-shaped structure. | 03-28-2013 |
20130171837 | SEMICONDUCTOR PROCESS - A semiconductor process includes the following steps. A substrate having a recess is provided. A decoupled plasma nitridation process is performed to nitride the surface of the recess for forming a nitrogen containing liner on the surface of the recess. A nitrogen containing annealing process is then performed on the nitrogen containing liner. | 07-04-2013 |
20140073111 | Method of Forming Isolation Structure - The present invention provides a method of forming an isolation structure. A substrate is provided, and a trench is formed in the substrate. Next, a semiconductor layer is formed on a surface of the trench. A nitridation is carried out to form a nitridation layer in the semiconductor layer. Lastly, an insulation layer is filled into the trench. | 03-13-2014 |
Patent application number | Description | Published |
20110300047 | METHOD FOR RECYCLING SILICON - A method for recycling silicon, comprises a filtrating step, providing a siliceous mortar containing silicon carbide, silicon and a buffer, and further filtering out the buffer form the siliceous mortar to obtain a siliceous slurry; a removing step, heating the siliceous slurry till the buffer has evaporated to obtain a mixture of silicon and silicon carbide; a stirring step, placing the mixture of silicon and silicon carbide in a liquid-substrate followed by stirring and incubating for a while to obtain a sedimentation of the mixture of silicon and silicon carbide and a suspension containing the liquid-substrate and silicon; and a purifying step, filter off the liquid-substrate in the suspension, and silicon powders are obtained. | 12-08-2011 |
20110300048 | METHOD FOR RECYCLING SILICON CARBIDE - A method for recycling silicon carbide, comprises a filtrating step, providing a siliceous mortar with silicon carbide, silicon and a buffer, and further filtering out the buffer form the siliceous mortar to obtain a siliceous slurry; a first removing step, heating the siliceous slurry to evaporate the buffer and obtain a mixture of silicon and silicon carbide; a dissolving step, placing the mixture of silicon and silicon carbide in an alkaline solution to dissolve the silicon from the mixture of silicon and silicon carbide into the alkaline solution; and a second removing step, completely removing the alkaline solution containing dissolved silicon, in order to obtain purified silicon carbide. | 12-08-2011 |
20120020853 | METHOD OF MANUFACTURING ALUMINA BY RECYCLING NICKEL-ALUMINUM - A method of manufacturing alumina by recycling nickel-aluminum comprises a step of “soaking,” by soaking a purified mineral of nickel-aluminum into an alkaline buffer followed by keeping at an environment of 1 ATM to obtain a rough solution of aluminate; a step of “filtration,” by filtering out a purified mineral of nickel and cobalt from the rough solution of aluminate to obtain a solution of aluminate; a step of “purification,” by adding a de-impurity reagent into the solution of aluminate to remove the impurity of vanadates, molybdates and silicates from the solution of aluminate, in order to obtain a purified solution of aluminate; a step of “sedimentation,” by precipitating out aluminum hydroxide from the purified solution of aluminate; and a step of “calcination,” by calcining the aluminum hydroxide, finally to obtain alumina. | 01-26-2012 |