Suleiman
Basem Suleiman, Northy Sydney AU
Patent application number | Description | Published |
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20130110861 | Facilitating Extraction and Discovery of Enterprise Services | 05-02-2013 |
Mohammed A. Suleiman, Dhahran SA
Patent application number | Description | Published |
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20130202356 | Asphalt Compositions with Sulfur Modified Polyvinyl Acetate (PVAc) - Provided is an asphalt composition that includes a sulfur modified polymer composition and method of making same. The inclusion of 50% by weight sulfur, or greater, into the polymer composition results in a composition that is softer and having an increased melting point, relative to the unmodified polymer composition. | 08-08-2013 |
20130203902 | Sulfur Modified Polyvinyl Acetate (PVAc) - Provided are a sulfur modified polymer composition, free from asphalt, bitumen or like compounds, and method of making same. The inclusion of 50% by weight sulfur, or greater, into the polymer composition results in a composition that is softer and having an increased melting point, relative to the unmodified polymer composition. | 08-08-2013 |
Tareq E.a. Suleiman, Riyadh SA
Patent application number | Description | Published |
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20130241140 | LARGE CAPACITY AUTOMATIC PAPER TRAY - A large capacity automatic printer paper tray operatively mounts a printing device to its upper extent. A paper support is disposed in a frame of the paper tray and is slideably supported by vertical frame rails. A drive screw rotatably secured in the frame is operatively coupled to the paper support. An actuator motor operatively drives the drive screw to raise and lower the paper support. Lower and upper limit sensors control the motor to limit downward and upward movement of the paper support. A paper pick-up interface plate transfers a top paper from the paper support into a paper pick-up roller of the mounted print device, via a feed roller of the print device. A pull-track sensor operates the motor to maintain a top level of paper on the paper support between a minimum and a maximum pull-track threshold. | 09-19-2013 |
Wan Mohd Misuari Suleiman, Kuala Lumpur MY
Patent application number | Description | Published |
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20140097526 | PACKAGED IC HAVING PRINTED DIELECTRIC ADHESIVE ON DIE PAD - A method of assembling a packaged integrated circuit (IC) includes printing a viscous dielectric polymerizable material onto a die pad of a leadframe having metal terminals positioned outside the die pad. An IC die having a top side including a plurality of bond pads is placed with its bottom side onto the viscous dielectric polymerizable material. Bond wires are wire bonded between the plurality of bond pads and the metal terminals of the leadframe. | 04-10-2014 |
20140327123 | PACKAGED IC HAVING PRINTED DIELECTRIC ADHESIVE ON DIE PAD - A packaged integrated circuit (IC) includes a leadframe having metal terminals positioned outside the die pad. An IC die having a top side including a plurality of bond pads is placed with its bottom side onto attached by a dielectric polymer material to the die pad. Bond wires are between the plurality of bond pads and the metal terminals of the leadframe. A mold material different from said dielectric polymer material provides encapsulation for the packaged IC. An area of the dielectric polymer material exceeds an area of the IC die. The dielectric polymer material forms a dielectric polymer/mold material interface with the mold material. | 11-06-2014 |