Patent application number | Description | Published |
20100038023 | Pressure Sensitive Adhesive Composition for Transporting Flexible Substrate - Disclosed herein is an adhesive composition for transporting a flexible substrate, which is used to manufacture a flexible display device using a flexible substrate such as a plastic substrate by using a conventional line for manufacturing a liquid crystal display device comprising a glass substrate. The present invention provides an adhesive composition for transporting a flexible substrate, which includes 100 parts by weight of an adhesive for transporting a flexible substrate and 0.001 to 5 parts by weight of an antistatic agent, an adhesive sheet containing the composition, and a method of transporting a flexible substrate using the same. | 02-18-2010 |
20100188620 | ACRYLIC PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS - The present invention relates to an acrylic pressure-sensitive adhesive composition, and more particularly, to an acrylic pressure-sensitive adhesive composition, which comprises (a) 100 weight parts of an acrylic copolymer, (b) 0.001 to 30 weight parts of an antistatic agent; and (c) 0.01 to 10 weight parts of a corrosion inhibitor, thereby being optically transparent, causing durability and reliability not to change, and simultaneously improving antistatic performance and preventing generation of corrosion although the adhesive composition comes into contact with a metal surface. | 07-29-2010 |
20110003091 | ACRYLIC PRESSURE SENSITIVE ADHESIVE COMPOSITIONS HAVING PLASTICIZER - The present invention relates to an acrylic pressure-sensitive adhesive composition. More specifically, the present invention relates to an acrylic pressure-sensitive adhesive composition comprising a) acrylic copolymers; b) a hydrophilic plasticizer; and c) a hydrophobic plasticizer. The acrylic pressure-sensitive adhesive composition according to the present invention has no mura under moisture and heat resistant condition, and thus has an excellent stain resistance of adherends, and an excellent wettability, endurance reliability, transparency and adhesion reliability, regardless of whether surface property of the adherend is hydrophillic or hydrophobic. | 01-06-2011 |
20110033695 | NANOCOMPOSITES, POLYMER COMPOSITIONS COMPRISING THE SAME AND PREPARATION METHODS THEREOF - Provided are a nanocomposite including a layered inorganic material and a random copolymer containing a hydrophobic monomer and a hydrophilic monomer, a polymer composition including the nanocomposite, and a method for preparing the polymer composition. The random copolymer can be prepared at a low cost in a simple process and function as a compatibilizer in small amounts to maintain excellent properties of the nanocomposite including excellent mechanical characteristics such as abrasion resistance, hardness, tensile modulus and tear resistance, excellent thermal characteristics, high liquid and gas permeability, and low flammability. | 02-10-2011 |
20110242796 | BACKLIGHT UNIT - The present invention relates to a backlight unit. In the present invention, the backlight unit is constituted by attaching the pressure sensitive adhesive formulated with light scattering particles to a substrate that light emitting bodies are present. Said pressure sensitive adhesive does not cause looseness, peel-off and curl even in a severe condition such as high temperature or high temperature and high humidity as well as a phenomenon such as yellowing or whitening. Therefore, the present invention may provide a unit having high brightness and excellent luminance uniformity, overcoming step height due to the light emitting body and having thin thickness, and is also advantageous to be applied to a flexible device. | 10-06-2011 |
20120202337 | WAFER PROCESSING SHEET - Provided is a sheet for processing a wafer. The sheet can exhibit excellent heat resistance and dimensional stability, prevent breakage of a wafer in response to residual stress due to excellent stress relaxation properties, inhibit damage to or dispersion of the wafer due to application of a non-uniform pressure, and also exhibit excellent cuttability. The sheet can effectively prevent a blocking phenomenon from occurring during wafer processing. For these reasons, the sheet can be useful for processing a wafer in various wafer preparation processes such as dicing, back-grinding and picking-up. | 08-09-2012 |
20130201145 | PRESSURE SENSITIVE ADHESIVE COMPOSITION FOR TOUCH PANEL (As Amended) - Provided are a pressure-sensitive adhesive composition for a touch panel, a conductive film, a touch panel and a pressure-sensitive adhesive film. The exemplary pressure-sensitive adhesive composition for a touch panel, the conductive film or the pressure-sensitive adhesive film has excellent durability and optical properties such as transparency. In addition, such physical properties are stably maintained under severe conditions. Particularly, a pressure-sensitive adhesive layer is attached to a conductor thin film, and thus resistance change of the conductor thin film is effectively inhibited even when the conductor thin film is exposed to the severe conditions. Therefore, the pressure-sensitive adhesive composition may be effectively used to manufacture a touch panel. | 08-08-2013 |
20130202884 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION FOR TOUCH PANEL - Provided are a pressure-sensitive adhesive composition for a touch panel, a conductive film, a touch panel and a pressure-sensitive adhesive film. The exemplary pressure-sensitive adhesive composition for a touch panel, the conductive film or the pressure-sensitive adhesive film has excellent durability and optical properties such as transparency. In addition, such physical properties are stably maintained under severe conditions. Particularly, a pressure-sensitive adhesive layer is attached to a conductor thin film, and thus resistance change of the conductor thin film is effectively inhibited even when the conductor thin film is exposed to the severe conditions. Therefore, the pressure-sensitive adhesive composition may be effectively used to manufacture a touch panel. | 08-08-2013 |
20130224436 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION - Provided is a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition may be applied as a light diffusing or scattering material to various display devices or lighting apparatuses. | 08-29-2013 |
20130240862 | ADHESIVE FILM AND METHOD OF ENCAPSULATING ORGANIC ELECTRODE DEVICE USING THE SAME - An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer. | 09-19-2013 |
20130251989 | ADHESIVE FILM - The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability. | 09-26-2013 |
20130299064 | SWELLING TAPE FOR FILLING GAP - A swelling tape for filling a gap and a method of filling a gap are provided. The swelling tape can be applied within the gap having a fluid to realize a 3D shape thereby filling the gap, and be used to fix a subject forming the gap as necessary. | 11-14-2013 |
20130306221 | SWELLING TAPE FOR FILLING GAP - A swelling tape for filling a gap and a method of filling a gap are provided. The swelling tape can be applied within the gap having a fluid to realize a 3D shape thereby filling the gap, and be used to fix a subject forming the gap as necessary. | 11-21-2013 |
20130331522 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION - There is provided a pressure sensitive adhesive composition and a pressure sensitive adhesive. A pressure sensitive adhesive composition example of the present application can provide a pressure sensitive adhesive having, for example, a high shear resistance together with an excellent peeling property or tacking property with respect to an attachment target surface. | 12-12-2013 |
20140037936 | PREPARATION METHOD FOR POROUS PRESSURE SENSITIVE ADHESIVE ARTICLE - There is provided a preparation method for a porous pressure sensitive adhesive article, a porous pressure sensitive adhesive article, and an abrasive pad. According to an example of the present application, as a porous pressure sensitive adhesive article including a pressure sensitive adhesive layer formed on a porous article, an article having excellent resistance to an external shear strength and to peeling can be provided. Further, according to the above method, the porous article can be attached firmly to a large-area adherent. In an example, the porous article may be an abrasive pad. | 02-06-2014 |
20140044959 | SOLVENTLESS COMPOSITION AND METHOD FOR PREPARING THE SAME - Provided are a solventless composition and a method of preparing the same. Here, the solventless composition may effectively manufacture a film that is uniform without substantial deviation in thickness and has a large but uniform thickness or an excellent physical property such as thermal resistance during manufacture of a film. In addition, the composition of the present invention does not induce contamination during the manufacture of the film. Furthermore, by preventing gelation or phase separation of components of the composition, the composition capable of manufacturing a substrate film having an excellent physical property such as optical transparency, thermal resistance and dimension stability may be provided. | 02-13-2014 |
20140045319 | SUBSTRATE FILM AND METHOD OF MANUFACTURING THE SAME - Provided are a substrate film and a method of manufacturing the substrate film. The substrate film may have excellent thermal resistance and dimensional stability, has excellent stress relaxation to prevent damage of a wafer caused by remaining stress, inhibits damage to or flying-off of the wafer caused by application of a non-uniform pressure during the processing of the wafer, and has excellent cuttability. Accordingly, the substrate film of the present invention can be effectively used as a processing sheet in a process of processing various kinds of wafers including dicing, back-grinding or picking-up. | 02-13-2014 |
20140057102 | TOUCH PANEL | 02-27-2014 |
20140065324 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION - The present invention relates to a pressure sensitive adhesive composition, a polarizer and a liquid crystal display device. The present invention may provide a pressure sensitive adhesive which can have excellent stress relaxation characteristic to effectively inhibit light leakage by dimension change of optical films such as polarizing plates. In addition, a pressure sensitive adhesive having excellent physical properties such as adhesion durability and workability may be provided. | 03-06-2014 |
20140079926 | METHOD OF PREPARING PRESSURE-SENSITIVE ADHESIVE PRODUCT - The present application relates to a method of preparing a pressure-sensitive adhesive product and the pressure-sensitive adhesive product. According to the present application, the pressure-sensitive adhesive product having different physical properties on both surfaces, for example, having different peeling strengths on both surfaces, or having a structure in which a pressure-sensitive adhesive and a support are sequentially formed may be efficiently provided. | 03-20-2014 |
20140091296 | ADHESIVE FILM AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE - Provided are an adhesive film, an encapsulated product of an organic electronic device using the same, and a method of encapsulating an organic electronic device. Particularly, the adhesive film encapsulating the organic electronic device to cover an entire surface of the organic electronic device includes an adhesive layer including a curable resin and a moisture adsorbent. The adhesive layer has a viscosity in a temperature range of 30 to 130° C. of 10 | 04-03-2014 |
20140106207 | SWELLING TAPE FOR FILLING GAP - A swelling tape for filling a gap, a method of manufacturing the swelling tape for filling a gap, a method of filling a gap, an electrode assembly and a secondary battery are provided. For example, the swelling tape can be applied inside a gap in which a fluid exists so as to fill the gap by becoming a 3D form, and can be useful at anchoring a subject in which the gap is formed, as necessary. | 04-17-2014 |
20140110699 | ADHESIVE FILM - An adhesive film used to encapsulate an organic electronic diode (OED) is provided. The adhesive film may be useful in effectively preventing penetration of moisture into an encapsulated structure of the organic electronic diode when the organic electronic diode is encapsulated, and effectively performing the encapsulation process under moderate conditions without causing damage to the organic electronic diode during the encapsulation process. | 04-24-2014 |
20140134433 | TOUCH PANEL - Provided is a touch panel. The touch panel includes a base and a pressure-sensitive adhesive layer attached to the base and including an acryl-based polymer containing an acryl polymer containing 5 to 30 parts by weight of isobornyl (meth)acrylate, and 5 to 40 parts by weight of methyl (meth)acrylate in a polymerized form. Accordingly, it can effectively inhibit penetration of oxygen, moisture or other impurities at an interface between the base and the pressure-sensitive adhesive layer, or at an interface between a conductor thin film and the pressure-sensitive adhesive layer, and prevent degradation in optical properties such as visibility, etc. due to bubbles generated at the pressure-sensitive adhesive interface. In addition, when the pressure-sensitive adhesive layer is directly attached to the conductor thin film and even exposed to severe conditions such as high temperature or high temperature and high humidity, a change in the resistance of the conductor thin film may be effectively inhibited, and thus the touch panel can be stably driven for a long time. | 05-15-2014 |
20140134434 | TOUCH PANEL - Provided is a touch panel. The touch panel includes a base and a pressure-sensitive adhesive layer attached to the base and having a peel strength with respect to a polycarbonate sheet of 1,900 g/25 mm or more. The pressure-sensitive adhesive layer includes an acryl polymer compound containing an acryl polymer and a thiol polymer derived by binding a thiol compound into a chain, or a side chain or terminal end of a chain of the acryl polymer. Accordingly, penetration of oxygen, moisture or other impurities at an interface between the base film and the pressure-sensitive adhesive layer, or at an interface between a conductor thin film and a pressure-sensitive adhesive layer may be effectively inhibited, and degradation in optical properties such as visibility due to bubbles generated at a pressure-sensitive adhesive interface may be prevented. In addition, when the pressure-sensitive adhesive layer is directly attached to the conductor thin film and even exposed to severe conditions such as high temperature or high temperature and high humidity, the change in the resistance of the conductor thin film may be effectively inhibited, and thus the touch panel may be stably driven for a long time. | 05-15-2014 |
20140217621 | ENCAPSULATION FILM - The present application relates to an encapsulating film, an electronic device and a method of manufacturing the same. In the present application, an encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided. | 08-07-2014 |
20140264302 | ADHESIVE AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING THE SAME - An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive. | 09-18-2014 |
20140290829 | SWELLING TAPE FOR FILLING GAP - A swelling tape for filling a gap and a method of filling a gap are provided. The swelling tape can be applied within the gap having a fluid to realize a 3D shape thereby filling the gap, and be used to fix a subject forming the gap as necessary. | 10-02-2014 |
20140298862 | PRESSURE-SENSITIVE ADHESIVE TAPE - Provided are a pressure-sensitive adhesive tape, a polishing pad, a method of manufacturing the same, a polishing device and a method of manufacturing a glass substrate. The illustrative pressure-sensitive adhesive tape may be a pressure-sensitive adhesive tape for a polishing material. The pressure-sensitive adhesive tape may be effectively fixed to a surface plate without bubbles, and have excellent resistance to water and a polishing solution and shear strength applied in a polishing process. In addition, the pressure-sensitive adhesive tape may be easily removed from a carrier or surface plate for a polishing pad without residues after polishing. | 10-09-2014 |
20140318707 | METHOD FOR MANUFACTURING ELECTORNIC DEVICE - Provided is a method of manufacturing an electronic device. An electronic device having excellent moisture blocking property and durability may be provided by the method. | 10-30-2014 |
20140319497 | PHOTOCURABLE ADHESIVE FILM FOR ORGANIC ELECTRONIC DEVICE SEAL, ORGANIC ELECTRONIC DEVICE, AND METHOD FOR SEALING SAME - Provided are a photocurable pressure-sensitive adhesive composition including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator, an organic electronic device having an encapsulant including a photocured product of the composition using a curable pressure-sensitive adhesive film which is a film-state product including the composition, and a method for manufacturing an organic electronic device using the curable pressure-sensitive adhesive film. Particularly, due to the method including laminating a photocurable pressure-sensitive adhesive film including a curable pressure-sensitive adhesive layer including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator to an top substrate, and radiating light to an entire surface of the curable pressure-sensitive adhesive layer to perform photocuring, and laminating the photocured curable pressure-sensitive adhesive layer to a bottom substrate on which an organic light emitting element is formed to cover an entire surface of the organic light emitting element, mechanical strength and a simple process caused by photocuring to the organic light emitting element without direct light irradiation may be achieved, and a lifespan of the element may be increased. | 10-30-2014 |
20140319999 | ENCAPSULATION FILM - Provided are an encapsulating film, an electronic device and a method of manufacturing the same. An encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided. | 10-30-2014 |
20140332782 | ADHESIVE FILM - An adhesive film, a method for preparing an adhesive film, and an organic electronic device are provided. According to the adhesive film in exemplary embodiments of the present invention, fluidity of an adhesive can be controlled in the case of applying the adhesive between objects to be subsequently adhered to each other and then thermal-compressing by including an adhesive layer with cured side faces contacting with the outside. The adhesive film is used, for example for assembling a panel and the like, and thereby a defect rate at the time of assembling a panel and the like can be reduced and excellent work characteristics can be provided. In addition, before being applied to a panel or the like, a moisture absorbent included inside an adhesive layer of an adhesive film can be protected from external moisture or the like, thereby being easily stored, and also when it is applied to a product, reliability of life span, and the like can be secured. | 11-13-2014 |
20140377554 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION - Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and an organic electronic device. The exemplary pressure-sensitive adhesive composition may provide an encapsulating layer of the pressure-sensitive adhesive film and the organic electronic device, which exhibits excellent moisture blocking property, transparency, durability and reliability at a high temperature and high humidity, step difference compensating property and adhesive strength. | 12-25-2014 |
20150034940 | ADHESIVE FILM AND PRODUCT FOR ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING SAME - Provided are an adhesive film and an organic electronic device (OED) encapsulation product using the same. As moisture resistance is maintained by preventing traveling of moisture in a matrix resin, moisture or oxygen input to the organic electronic device from an external environment may be effectively prevented, and temporal stability, life span and durability may be enhanced even when a panel of the organic electronic device is formed as a thin film, thereby ensuring long-term reliability. | 02-05-2015 |
20150048356 | ADHESIVE FILM AND SEALING PRODUCT FOR ORGANIC ELECTRONIC DEVICE USING SAME - Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process. | 02-19-2015 |
20150050853 | CONDUCTIVE LAMINATE, AND TOUCH PANEL COMPRISING SAME - The present invention is relates to conductive laminate. The conductive laminate is applied to a touch panel or touch screen, thereby exhibiting excellent durability, and a pressure-sensitive adhesive layer included in the conductive laminate may prevent a change in resistance of a conductive layer, and effectively inhibit lift-off or peeling, or generation of bubbles at a pressure-sensitive adhesive interface. As a result, performances of the touch panel or touch screen including the conductive laminate may be stably maintained for a long time. | 02-19-2015 |
20150060836 | ADHESIVE FILM AND SEALING METHOD FOR ORGANIC ELECTRONIC DEVICE USING SAME - Provided are an adhesive film, an organic electronic device (OED) encapsulation product using the same, and a method of encapsulating the organic electronic device, and more particularly, an adhesive film for encapsulating an organic electronic element including a first adhesive layer having a loss coefficient (tan δ) at 60 to 100° C. of 1 to 5, and a second adhesive layer formed on the first adhesive layer, and a method of encapsulating an organic electronic device using the same. | 03-05-2015 |
20150079387 | OPTICAL MEMBER, PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND LIQUID CRYSTAL DISPLAY - Provided are an optical member, a pressure-sensitive adhesive composition, and an LCD. The optical member may have excellent endurance reliability even when a pressure-sensitive adhesive layer is formed to have a thickness of 20 μm or less. | 03-19-2015 |
20150079726 | METHOD OF MANUFACTURING ORGANIC ELECTRONIC DEVICE - Provided is a method of manufacturing an organic electronic device using a pressure-sensitive adhesive film. The method of manufacturing an organic electronic device including an encapsulation layer having excellent moisture barrier property and adhesiveness may be provided. In addition, according to the manufacturing method, for example, though the encapsulation layer is formed on an entire surface of an organic electronic element, a flexibility phenomenon of the organic electronic device may be minimized, and the organic electronic device may be manufactured without damage to the organic electronic element for a short process time. | 03-19-2015 |