Patent application number | Description | Published |
20090061585 | High-voltage vertical transistor with a multi-gradient drain doping profile - A high-voltage transistor includes first and second trenches that define a mesa in a semiconductor substrate. First and second field plate members are respectively disposed in the first and second trenches, with each of the first and second field plate members being separated from the mesa by a dielectric layer. The mesa includes a plurality of sections, each section having a substantially constant doping concentration gradient, the gradient of one section being at least 10% greater than the gradient of another section. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. | 03-05-2009 |
20100065903 | High-voltage vertical transistor with a varied width silicon pillar - In one embodiment, a vertical HVFET includes a pillar of semiconductor material a pillar of semiconductor material arranged in a loop layout having at least two substantially parallel and substantially linear fillet sections each having a first width, and at least two rounded sections, the rounded sections having a second width narrower than the first width, a source region of a first conductivity type being disposed at or near a top surface of the pillar, and a body region of a second conductivity type being disposed in the pillar beneath the source region. First and second dielectric regions are respectively disposed on opposite sides of the pillar, the first dielectric region being laterally surrounded by the pillar, and the second dielectric region laterally surrounding the pillar. First and second field plates are respectively disposed in the first and second dielectric regions. | 03-18-2010 |
20100109077 | High-voltage vertical transistor with a multi-gradient drain doping profile - A high-voltage transistor includes first and second trenches that define a mesa in a semiconductor substrate. First and second field plate members are respectively disposed in the first and second trenches, with each of the first and second field plate members being separated from the mesa by a dielectric layer. The mesa includes a plurality of sections, each section having a substantially constant doping concentration gradient, the gradient of one section being at least 10% greater than the gradient of another section. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. | 05-06-2010 |
20100155773 | VTS insulated gate bipolar transistor - In one embodiment, a power transistor device comprises a substrate that forms a PN junction with an overlying buffer layer. The power transistor device further includes a first region, a drift region that adjoins a top surface of the buffer layer, and a body region. The body region separates the first region from the drift region. First and second dielectric regions respectively adjoin opposing lateral sidewall portions of the drift region. The dielectric regions extend in a vertical direction from at least just beneath the body region down at least into the buffer layer. First and second field plates are respectively disposed in the first and second dielectric regions. A trench gate that controls forward conduction is disposed above the dielectric region adjacent to and insulated from the body region. | 06-24-2010 |
20100155831 | Deep trench insulated gate bipolar transistor - In one embodiment, a power transistor device comprises a substrate of a first conductivity type that forms a PN junction with an overlying buffer layer of a second conductivity type. The power transistor device further includes a first region of the second conductivity type, a drift region of the second conductivity type that adjoins a top surface of the buffer layer, and a body region of the first conductivity type. The body region separates the first region from the drift region. First and second dielectric regions respectively adjoin opposing lateral sidewall portions of the drift region. The dielectric regions extend in a vertical direction from at least just beneath the body region down at least into the buffer layer. A trench gate that controls forward conduction is disposed above the dielectric region adjacent to and insulated from the body region. | 06-24-2010 |
20100159649 | Method of fabricating a deep trench insulated gate bipolar transistor - In one embodiment, a method comprises forming an epitaxial layer over a substrate of an opposite conductivity type, the epitaxial layer being separated by a buffer layer having a doping concentration that is substantially constant in a vertical direction down to the buffer layer. A pair of spaced-apart trenches is formed in the epitaxial layer from a top surface of the epitaxial layer down at least into the buffer layer. A dielectric material is formed in the trenches over the first and second sidewall portions. Source/collector and body regions of are formed at the top of the epitaxial layer, the body region separating the source/collector region of the pillar from a drift region of the epitaxial layer that extends from the body region to the buffer layer. An insulated gate member is then formed in each of the trenches adjacent to and insulated from the body region. | 06-24-2010 |
20100301412 | Power integrated circuit device with incorporated sense FET - In one embodiment, a power integrated circuit device includes a main lateral high-voltage field-effect transistor (HVFET) and an adjacently-located lateral sense FET, both of which are formed on a high-resistivity substrate. A sense resistor is formed in a well region disposed in an area of the substrate between the HVFET and the sense FET. A parasitic substrate resistor is formed in parallel electrical connection with the sense resistor between the source regions of the HVFET and the sense FET. Both transistor devices share common drain and gate electrodes. When the main lateral HVFET and the sense FET are in an on-state, a voltage potential is produced at the second source metal layer that is proportional to a first current flowing through the lateral HVFET. | 12-02-2010 |
20110042726 | High-voltage transistor device with integrated resistor - A high-voltage device structure comprises a resistor coupled to a tap transistor that includes a JFET in a configuration wherein a voltage provided at a terminal of the JFET is substantially proportional to an external voltage when the external voltage is less than a pinch-off voltage of the JFET. The voltage provided at the terminal being substantially constant when the external voltage is greater than the pinch-off voltage. One end of the resistor is substantially at the external voltage when the external voltage is greater than the pinch-off voltage. When the external voltage is negative, the resistor limits current injected into the substrate. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. | 02-24-2011 |
20110073942 | High-voltage transistor structure with reduced gate capacitance - In one embodiment, a high voltage field-effect transistor (HVFET) includes a field oxide layer that covers a first well region, the field oxide layer having a first thickness and extending in a second lateral direction from a drain region to near a second well region. A gate oxide covers a channel region and has a second dimension in a first lateral direction. A gate extends in the second lateral direction from the source region to over a portion of the field oxide layer, the gate being insulated from the channel region by the gate oxide, the gate extending in the first lateral dimension over an inactive area of the HVFET beyond the second dimension of the gate oxide, the gate being insulated from the first and second well regions over the inactive area by the field oxide layer. | 03-31-2011 |
20110089476 | Checkerboarded high-voltage vertical transistor layout - In one embodiment, a transistor fabricated on a semiconductor die includes a first section of transistor segments disposed in a first area of the semiconductor die, and a second section of transistor segments disposed in a second area of the semiconductor die adjacent the first area. Each of the transistor segments in the first and second sections includes a pillar of a semiconductor material that extends in a vertical direction. First and second dielectric regions are disposed on opposite sides of the pillar. First and second field plates are respectively disposed in the first and second dielectric regions. Outer field plates of transistor segments adjoining first and second sections are either separated or partially merged. | 04-21-2011 |
20110140166 | Method of fabricating a deep trench insulated gate bipolar transistor - In one embodiment, a method comprises forming an epitaxial layer over a substrate of an opposite conductivity type, the epitaxial layer being separated by a buffer layer having a doping concentration that is substantially constant in a vertical direction down to the buffer layer. A pair of spaced-apart trenches is formed in the epitaxial layer from a top surface of the epitaxial layer down at least into the buffer layer. A dielectric material is formed in the trenches over the first and second sidewall portions. Source/collector and body regions of are formed at the top of the epitaxial layer, the body region separating the source/collector region of the pillar from a drift region of the epitaxial layer that extends from the body region to the buffer layer. An insulated gate member is then formed in each of the trenches adjacent to and insulated from the body region. | 06-16-2011 |
20110233657 | High-voltage vertical transistor with a varied width silicon pillar - In one embodiment, a vertical HVFET includes a pillar of semiconductor material a pillar of semiconductor material arranged in a loop layout having at least two substantially parallel and substantially linear fillet sections each having a first width, and at least two rounded sections, the rounded sections having a second width narrower than the first width, a source region of a first conductivity type being disposed at or near a top surface of the pillar, and a body region of a second conductivity type being disposed in the pillar beneath the source region. First and second dielectric regions are respectively disposed on opposite sides of the pillar, the first dielectric region being laterally surrounded by the pillar, and the second dielectric region laterally surrounding the pillar. First and second field plates are respectively disposed in the first and second dielectric regions. | 09-29-2011 |
20110272758 | Integrated transistor and anti-fuse as programming element for a high-voltage integrated circuit - A semiconductor device comprises an N type well region in a P type substrate. A source region of a MOSFET is laterally separated from a boundary of the well region, which comprises the drain of the MOSFET. An insulated gate of the MOSFET extends laterally from the source region to at least just past the boundary of the well region. A polysilicon layer, which forms a first plate of a capacitive anti-fuse, is insulated from an area of the well region, which forms the second plate of the anti-fuse. The anti-fuse is programmed by application of a voltage across the first and second capacitive plates sufficient to destroy at least a portion of the second dielectric layer, thereby electrically shorting the polysilicon layer to the drain of the HVFET. This abstract is provided to allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. | 11-10-2011 |
20110273950 | Method and apparatus for programming an anti-fuse element in a high-voltage integrated circuit - A method for programming a programmable block of a power IC device includes selecting an anti-fuse element of the programmable block to be programmed. The anti-fuse element includes first and second capacitive plates separated by a dielectric layer. A voltage pulse is then applied to a pin of the power IC device. The pin is connected to a drain of a high-voltage field-effect transistor (HVFET) that drives an external load via the pin during a normal operating mode of the power IC device. The voltage pulse, which is coupled to the first capacitive plate of the anti-fuse element, has a potential sufficiently high to cause a current to flow through the anti-fuse element that destroys at least a portion of the dielectric layer, thereby electrically shorting the first and second capacitive plates | 11-10-2011 |
20110276292 | Method and apparatus for reading a programmable anti-fuse element in a high-voltage integrated circuit - In a method for reading a programmable anti-fuse block of a high-voltage integrated circuit a first voltage is applied to a first pin of the HVIC, the first voltage being lowered to a second voltage at a first node. Current is shunted from the first node, thereby lowering the second voltage to a third voltage. An isolation circuit block is then activated to couple the third voltage to a common node of the programmable anti-fuse block, the common node being coupled to a plurality of anti-fuses, each anti-fuse having a programmed state. A read signal is generated that causes a voltage potential representative of the programmed state of each anti-fuse to be latched into a corresponding latch element. | 11-10-2011 |
20120058607 | Method of fabricating a deep trench Insulated Gate Bipolar Transistor - In one embodiment, a method comprises forming an epitaxial layer over a substrate of an opposite conductivity type, the epitaxial layer being separated by a buffer layer having a doping concentration that is substantially constant in a vertical direction down to the buffer layer. A pair of spaced-apart trenches is formed in the epitaxial layer from a top surface of the epitaxial layer down at least into the buffer layer. A dielectric material is formed in the trenches over the first and second sidewall portions. Source/collector and body regions of are formed at the top of the epitaxial layer, the body region separating the source/collector region of the pillar from a drift region of the epitaxial layer that extends from the body region to the buffer layer. An insulated gate member is then formed in each of the trenches adjacent to and insulated from the body region. | 03-08-2012 |
20120061720 | VTS insulated gate bipolar transistor - In one embodiment, a power transistor device comprises a substrate that forms a PN junction with an overlying buffer layer. The power transistor device further includes a first region, a drift region that adjoins a top surface of the buffer layer, and a body region. The body region separates the first region from the drift region. First and second dielectric regions respectively adjoin opposing lateral sidewall portions of the drift region. The dielectric regions extend in a vertical direction from at least just beneath the body region down at least into the buffer layer. First and second field plates are respectively disposed in the first and second dielectric regions. A trench gate that controls forward conduction is disposed above the dielectric region adjacent to and insulated from the body region. | 03-15-2012 |
20120061755 | Checkerboarded high-voltage vertical transistor layout - In one embodiment, a transistor fabricated on a semiconductor die includes a first section of transistor segments disposed in a first area of the semiconductor die, and a second section of transistor segments disposed in a second area of the semiconductor die adjacent the first area. Each of the transistor segments in the first and second sections includes a pillar of a semiconductor material that extends in a vertical direction. First and second dielectric regions are disposed on opposite sides of the pillar. First and second field plates are respectively disposed in the first and second dielectric regions. Outer field plates of transistor segments adjoining first and second sections are either separated or partially merged. | 03-15-2012 |
20120068761 | Method and apparatus for protection of an anti-fuse element in a high-voltage integrated circuit - A soft clamp semiconductor device for preventing inadvertent programming of an unselected anti-fuse (AF) element comprises a MOSFET which includes a first well region disposed in a substrate. Source and drain regions are disposed in the first well region, the drain region being electrically coupled to the first capacitive plate of the AF element and the source region being electrically coupled to a second capacitive plate of the AF element. An insulated gate is disposed over a channel area of the first well region that separates the drain and source regions. A gate capacitance of the MOSFET is substantially less than a capacitance of the unselected AF element such that when a programming voltage is applied to the first capacitive plate, a current flows through the MOSFET that charges the second capacitive plate, thereby reducing a voltage build-up across the unselected AF element. | 03-22-2012 |
20120146105 | High-voltage transistor device with integrated resistor - A high-voltage device structure comprises a resistor coupled to a tap transistor that includes a JFET in a configuration wherein a voltage provided at a terminal of the JFET is substantially proportional to an external voltage when the external voltage is less than a pinch-off voltage of the JFET. The voltage provided at the terminal being substantially constant when the external voltage is greater than the pinch-off voltage. One end of the resistor is substantially at the external voltage when the external voltage is greater than the pinch-off voltage. When the external voltage is negative, the resistor limits current injected into the substrate. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. | 06-14-2012 |
20120199885 | Integrated Transistor and Anti-Fuse Programming Element for a High-Voltage Integrated Circuit - A semiconductor device includes an N type well region in a P type substrate. A source region of a MOSFET is laterally separated from a boundary of the well region, which includes the drain of the MOSFET. An insulated gate of the MOSFET extends laterally from the source region to at least just past the boundary of the well region. A polysilicon layer, which forms a first plate of a capacitive anti-fuse, is insulated from an area of the well region, which forms the second plate of the anti-fuse. The anti-fuse is programmed by application of a voltage across the first and second capacitive plates sufficient to destroy at least a portion of the second dielectric layer, thereby electrically shorting the polysilicon layer to the drain of the HVFET. | 08-09-2012 |
20120273885 | High-Voltage Transistor Structure with Reduced Gate Capacitance - In one embodiment, a high voltage field-effect transistor (HVFET) includes a field oxide layer that covers a first well region, the field oxide layer having a first thickness and extending in a second lateral direction from a drain region to near a second well region. A gate oxide covers a channel region and has a second dimension in a first lateral direction. A gate extends in the second lateral direction from the source region to over a portion of the field oxide layer, the gate being insulated from the channel region by the gate oxide, the gate extending in the first lateral dimension over an inactive area of the HVFET beyond the second dimension of the gate oxide, the gate being insulated from the first and second well regions over the inactive area by the field oxide layer. | 11-01-2012 |
20120306012 | Power Integrated Circuit Device With Incorporated Sense FET - In one embodiment, a power integrated circuit device includes a main lateral high-voltage field-effect transistor (HVFET) and an adjacently-located lateral sense FET, both of which are formed on a high-resistivity substrate. A sense resistor is formed in a well region disposed in an area of the substrate between the HVFET and the sense FET. A parasitic substrate resistor is formed in parallel electrical connection with the sense resistor between the source regions of the HVFET and the sense FET. Both transistor devices share common drain and gate electrodes. When the main lateral HVFET and the sense FET are in an on-state, a voltage potential is produced at the second source metal layer that is proportional to a first current flowing through the lateral HVFET. | 12-06-2012 |
20120313140 | Method of Fabricating a Deep Trench Insulated Gate Bipolar Transistor - In one embodiment, a method comprises forming an epitaxial layer over a substrate of an opposite conductivity type, the epitaxial layer being separated by a buffer layer having a doping concentration that is substantially constant in a vertical direction down to the buffer layer. A pair of spaced-apart trenches is formed in the epitaxial layer from a top surface of the epitaxial layer down at least into the buffer layer. A dielectric material is formed in the trenches over the first and second sidewall portions. Source/collector and body regions of are formed at the top of the epitaxial layer, the body region separating the source/collector region of the pillar from a drift region of the epitaxial layer that extends from the body region to the buffer layer. An insulated gate member is then formed in each of the trenches adjacent to and insulated from the body region. | 12-13-2012 |
20130058182 | Method and Apparatus for Programming an Anti-Fuse Element in a High-Voltage Integrated Circuit - A method for programming a programmable block of a power IC device includes selecting an anti-fuse element of the programmable block to be programmed. The anti-fuse element includes first and second capacitive plates separated by a dielectric layer. A voltage pulse is then applied to a pin of the power IC device. The pin is connected to a drain of a high-voltage field-effect transistor (HVFET) that drives an external load via the pin during a normal operating mode of the power IC device. The voltage pulse, which is coupled to the first capacitive plate of the anti-fuse element, has a potential sufficiently high to cause a current to flow through the anti-fuse element that destroys at least a portion of the dielectric layer, thereby electrically shorting the first and second capacitive plates | 03-07-2013 |
20130187219 | High-Voltage Vertical Transistor With a Varied Width Silicon Pillar - In one embodiment, a vertical HVFET includes a pillar of semiconductor material a pillar of semiconductor material arranged in a loop layout having at least two substantially parallel and substantially linear fillet sections each having a first width, and at least two rounded sections, the rounded sections having a second width narrower than the first width, a source region of a first conductivity type being disposed at or near a top surface of the pillar, and a body region of a second conductivity type being disposed in the pillar beneath the source region. First and second dielectric regions are respectively disposed on opposite sides of the pillar, the first dielectric region being laterally surrounded by the pillar, and the second dielectric region laterally surrounding the pillar. First and second field plates are respectively disposed in the first and second dielectric regions. | 07-25-2013 |
20130207192 | Power Integrated Circuit with Incorporated Sense FET - In one embodiment, a power integrated circuit device includes a main lateral high-voltage field-effect transistor (HVFET) and an adjacently-located lateral sense FET, both of which are formed on a high-resistivity substrate. A sense resistor is formed in a well region disposed in an area of the substrate between the HVFET and the sense FET. A parasitic substrate resistor is formed in parallel electrical connection with the sense resistor between the source regions of the HVFET and the sense FET. Both transistor devices share common drain and gate electrodes. When the main lateral HVFET and the sense FET are in an on-state, a voltage potential is produced at the second source metal layer that is proportional to a first current flowing through the lateral HVFET. | 08-15-2013 |
20130234243 | Checkerboarded High-Voltage Vertical Transistor Layout - In one embodiment, a transistor fabricated on a semiconductor die is arranged into sections of elongated transistor segments. The sections are arranged in rows and columns substantially across the semiconductor die. Adjacent sections in a row or a column are oriented such that the length of the transistor segments in a first one of the adjacent sections extends in a first direction, and the length of the transistor segments in a second one of the adjacent sections extends in a second direction, the first direction being substantially orthogonal to the second direction. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. | 09-12-2013 |
20130293256 | Method and Apparatus for Reading a Programmable Anti-Fuse Element in a High-Voltage Integrated Circuit - A semiconductor device comprises an N type well region in a P type substrate. A source region of a MOSFET is laterally separated from a boundary of the well region, which comprises the drain of the MOSFET. An insulated gate of the MOSFET extends laterally from the source region to at least just past the boundary of the well region. A polysilicon layer, which forms a first plate of a capacitive anti-fuse, is insulated from an area of the well region, which forms the second plate of the anti-fuse. The anti-fuse is programmed by application of a voltage across the first and second capacitive plates sufficient to destroy at least a portion of the second dielectric layer, thereby electrically shorting the polysilicon layer to the drain of the HVFET. This abstract is provided to allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. | 11-07-2013 |
20130328114 | Integrated Transistor and Anti-Fuse as Programming Element for a High-Voltage Integrated Circuit - A semiconductor device includes an N type well region in a P type substrate. A source region of a MOSFET is laterally separated from a boundary of the well region, which includes the drain of the MOSFET. An insulated gate of the MOSFET extends laterally from the source region to at least just past the boundary of the well region. A polysilicon layer, which forms a first plate of a capacitive anti-fuse, is insulated from an area of the well region, which forms the second plate of the anti-fuse. The anti-fuse is programmed by application of a voltage across the first and second capacitive plates sufficient to destroy at least a portion of the second dielectric layer, thereby electrically shorting the polysilicon layer to the drain of the HVFET. | 12-12-2013 |
20140030868 | DEPOSIT/ETCH FOR TAPERED OXIDE - A process for fabricating a tapered field plate dielectric for high-voltage semiconductor devices is disclosed. The process may include depositing a thin layer of oxide, depositing a polysilicon hard mask, depositing a resist layer and etching a trench area, performing deep silicon trench etch, and stripping the resist layer. The process may further include repeated steps of depositing a layer of oxide and anisotropic etching of the oxide to form a tapered wall within the trench. The process may further include depositing poly and performing further processing to form the semiconductor device. | 01-30-2014 |
20140104888 | SEMICONDUCTOR DEVICE WITH SHARED REGION - A semiconductor device having a JFET and diode, includes a substrate, a second well region, and a second doped region that are of a first conductivity type. The JFET also includes a first well region, a first doped region, and a shared region that are of the second conductivity type. The second well region is disposed in the substrate adjacent to the first well region. A source of the JFET includes the first doped region disposed in the first well region. An anode of the diode includes the second doped region disposed in the second well region. Both a drain of the JFET and a cathode of the diode include the shared region disposed in the first well region. A diode current flows along a first lateral axis of the device while a JFET current flows along a second lateral axis of the device. | 04-17-2014 |
20140187019 | DEPOSIT/ETCH FOR TAPERED OXIDE - A process for fabricating a tapered field plate dielectric for high-voltage semiconductor devices is disclosed. The process may include depositing a thin layer of oxide, depositing a polysilicon hard mask, depositing a resist layer and etching a trench area, performing deep silicon trench etch, and stripping the resist layer. The process may further include repeated steps of depositing a layer of oxide and anisotropic etching of the oxide to form a tapered wall within the trench. The process may further include depositing poly and performing further processing to form the semiconductor device. | 07-03-2014 |
20140367771 | HIGH VOLTAGE SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE DEVICES - Metal-oxide-semiconductor field-effect transistor (MOSFET) devices are described which have a p-type region between the p-type well regions of the device. The p-type region can be either floating or connected to the p-type well regions by additional p-type regions. MOSFET devices are also described which have one or more p-type regions connecting the p-type well regions of the device. The p-type well regions can be arranged in a various geometric arrangements including square, diamond and hexagonal. Methods of making the devices are also described. | 12-18-2014 |
20150014770 | HIGH-VOLTAGE FIELD-EFFECT TRANSISTOR HAVING MULTIPLE IMPLANTED LAYERS - A method for fabricating a high-voltage field-effect transistor includes forming a body region, a source region, and a drain region in a semiconductor substrate. The drain region is separated from the source region by the body region. Forming the drain region includes forming an oxide layer on a surface of the semiconductor substrate over the drain region and performing a plurality of ion implantation operations through the oxide layer while tilting the semiconductor substrate such that ion beams impinge on the oxide layer at an angle that is offset from perpendicular. The plurality of ion implantation operations form a corresponding plurality of separate implanted layers within the drain region. Each of the implanted layers is formed at a different depth within the drain region. | 01-15-2015 |
20150084066 | HIGH VOLTAGE MOSFET DEVICES AND METHODS OF MAKING THE DEVICES - A SiC MOSFET device having low specific on resistance is described. The device has N+, P-well and JFET regions extended in one direction (Y-direction) and P+ and source contacts extended in an orthogonal direction (X-direction). The polysilicon gate of the device covers the JFET region and is terminated over the P-well region to minimize electric field at the polysilicon gate edge. In use, current flows vertically from the drain contact at the bottom of the structure into the JFET region and then laterally in the X direction through the accumulation region and through the MOSFET channels into the adjacent N+ region. The current flowing out of the channel then flows along the N+ region in the Y-direction and is collected by the source contacts and the final metal. Methods of making the device are also described. | 03-26-2015 |