| Patent application number | Description | Published |
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| 20100177487 | TAMPER RESPONDENT MODULE - A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component. | 07-15-2010 |
| 20130043015 | MANUFACTURING PROCESS AND HEAT DISSIPATING DEVICE FOR FORMING INTERFACE FOR ELECTRONIC COMPONENT - A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface so that minimal flux is provided. The method also includes preparing a die surface of an electronic device package, applying flux to the die surface, and removing excess flux from the die surface so that minimal flux is provided. The method further includes positioning a preform solder component on the die surface, positioning the heat dissipating member over the die surface and the preform solder component such that the flux layer of the bonding surface is in contact with the preform solder component, and reflowing the solder component using a reflow oven. A heat spreader is also described for use in the process. | 02-21-2013 |
| 20130058052 | Tamper Respondent Module - A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component. | 03-07-2013 |
| 20140209284 | MANUFACTURING PROCESS AND HEAT DISSIPATING DEVICE FOR FORMING INTERFACE FOR ELECTRONIC COMPONENT - A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface so that minimal flux is provided. The method also includes preparing a die surface of an electronic device package, applying flux to the die surface, and removing excess flux from the die surface so that minimal flux is provided. The method further includes positioning a preform solder component on the die surface, positioning the heat dissipating member over the die surface and the preform solder component such that the flux layer of the bonding surface is in contact with the preform solder component, and reflowing the solder component using a reflow oven. A heat spreader is also described for use in the process. | 07-31-2014 |
| 20140340845 | Fluid Cooled Enclosure For Circuit Module Apparatus And Methods Of Cooling A Conduction Cooled Circuit Module - A fluid cooled enclosure includes a fluid conduit that provides a fluid coolant path between sides of a housing. Optionally, the fluid conduit can provide bi-directional fluid coolant paths. In another example, an interface block can be provided with a first interface surface engaging an interface surface of a first end portion of the fluid conduit. In another example, a first end portion of the fluid conduit is fabricated with a first material composition and the interface block is fabricated with a second material composition that has a higher thermal conductivity than the first material composition. In further examples, methods of cooling a conduction cooled circuit module comprise the steps of mounting an interface block to a conduction cooled circuit module, mounting the interface block with respect to the fluid conduit, and cooling the electrical circuits of the conduction cooled circuit module by flowing fluid coolant through the fluid conduit. | 11-20-2014 |
| Patent application number | Description | Published |
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| 20110058812 | Optically Enabled Broadcast Bus - Embodiments of the present invention are directed to optical multiprocessing buses. In one embodiment, an optical broadcast bus includes a repeater, a fan-in bus optically coupled to a number of nodes and the repeater, and a fan-out bus optically coupled to the nodes and the repeater. The fan-in bus is configured to receive optical signals from each node and transmit the optical signals to the repeater, which regenerates the optical signals. The fan-out bus is configured to receive the regenerated optical signals output from the repeater and distribute the regenerated optical signals to the nodes. The repeater can also serve as an arbiter by granting one node at a time access to the fan-in bus. | 03-10-2011 |
| 20110211843 | Optical Broadcast With Buses With Shared Optical Interfaces - Various embodiments of the present invention are directed to optical broadcast buses configured with shared optical interfaces for fan-in and fan-out of optical signals. In one aspect, an optical broadcast bus ( | 09-01-2011 |
| 20130071064 | DEVICE FOR CONVERTING SIGNAL - A device for converting and optionally processing an optical signal comprises an optical cable having an optical-electrical conversion device at one end, the optical-electrical conversion device to convert the optical signal to an electrical signal or an electrical signal into an optical signal; a electrical package to removably receive the optical-electrical conversion device and generate processed signal; and a general circuit board attached to the electrical package and operable to receive the processed signal. | 03-21-2013 |
| 20140328596 | COMBINATION UNDERFILL-DAM AND ELECTRICAL-INTERCONNECT STRUCTURE FOR AN OPTO-ELECTRONIC ENGINE - A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided. | 11-06-2014 |
| 20150131940 | INTEGRATED OPTICAL SUB-ASSEMBLY - An optical subassembly includes a thru optical via ( | 05-14-2015 |
