Patent application number | Description | Published |
20090129079 | Light Emitting Module Especially For Use in an Optical Projection Apparatus, and Optical Projection Apparatus - A light-emitting module is specified, comprising at least two light sources disposed on a common carrier. At least one of said light sources includes at least two LED chips. Each light source ( | 05-21-2009 |
20090154155 | OPTICAL PROJECTION DEVICE - The invention relates to an optical projection device. Said optical projection device comprises a plurality of light-emitting diode chips and at least one optical element comprising a light input surface which is associated with at least one of the light-emitting diode chips. The light decoupling surface of the light-emitting diode chip, which is adapted to the refraction index, is optically connected to the light input surface of the associated optical element. | 06-18-2009 |
20100270569 | OPTOELECTRONIC COMPONENT - The invention relates to an optoelectronic component having at least one semi-conductor body ( | 10-28-2010 |
20100295073 | Optoelectronic Semiconductor Chip - An optoelectronic semiconductor chip ( | 11-25-2010 |
20130200412 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT - An optoelectronic semiconductor component includes a carrier and at least one optoelectronic semiconductor chip mounted on the carrier top. The semiconductor component includes at least one bonding wire, via which the semiconductor chip is electrically contacted, and at least one covering body mounted on a main radiation side and projects beyond the bonding wire. At least one reflective potting compound encloses the semiconductor chip laterally and extends at least as far as the main radiation side of the semiconductor chip. The bonding wire is covered completely by the reflective potting compound or completely by the reflective potting compound together with the covering body. | 08-08-2013 |
20130207133 | LIGHT-EMITTING DIODE - A light-emitting diode includes a carrier with a mounting face and includes a metallic basic body and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein an outer face of the metallic basic body includes the mounting face, the at least two light-emitting diode chips connect in parallel with one another, the at least two light-emitting diode chips are embedded in a reflective coating, the reflective coating covering the mounting face and side faces of the light-emitting diode chips, and the light-emitting diode chips protrude with their radiation exit surfaces out of the reflective coating, and the radiation exit surfaces face away from the carrier. | 08-15-2013 |
20140098556 | Optoelectronic Semiconductor Module and Display Having a Plurality of Such Modules - An optoelectronic semiconductor module includes a plurality of light-emitting areas, which emit light when in operation. At least two abutting lateral edges of at least one light-emitting area are arranged at an angle of more than 0 degrees and less than 90 degrees to each other. Further embodiments relate to a display having a plurality of such modules. | 04-10-2014 |
20150041834 | LIGHT-EMITTING DIODES - A light-emitting diode includes a carrier including a metallic basic body having an outer face including a mounting face; and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein the at least two light-emitting diode chips are embedded in a reflective coating covering the mounting face and side faces of the at least two light-emitting diode chips, the at least two light-emitting diode chips have radiation exit surfaces facing away from the carrier, and the at least two light-emitting diode chips protrude with radiation exit surfaces out of the reflective coating, or the reflective coating terminates flush with the radiation exit surfaces of the at least two light-emitting diode chips. | 02-12-2015 |