Spuhler
Bernhard Spuhler, Offenbach DE
Patent application number | Description | Published |
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20100268398 | System Unit For A Computer - A system unit for a computer comprising at least one plug-in card provided with components and a ventilator for cooling the components, wherein the system unit is also provided with a controller for setting the ventilator speed as a function of a signal of a temperature sensor. Measures are provided which, irrespective of whether the system unit is integrated in a horizontal or vertical position, such as in a switchgear cabinet, effect a good level of cooling. | 10-21-2010 |
Philipp Spuhler, Duesseldorf DE
Patent application number | Description | Published |
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20120258306 | METHOD FOR GLUING FILM-LIKE SUBSTRATES - A method for adhesively bonding film-like substrates, in which a two-component polyurethane adhesive is applied to a film and then a second film is applied, a two-component polyurethane adhesive being used that consists of—a component A containing at least one prepolymer having at least two NCO groups,—a component B containing at least one polymeric or oligomeric crosslinker having at least two groups that react with NCO groups, wherein component B contains 0.05 to 5 wt. % of a low-molecular-weight compound C, which—should have a nucleophilic group that reacts with NCO groups and—contains a hydrogen-bridging group, selected from O═C—O | 10-11-2012 |
Philipp S. Spuhler, Brookline, MA US
Patent application number | Description | Published |
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20090160457 | CIRCUIT FOR THE DETECTION OF SOLDER-JOINT FAILURES IN A DIGITAL ELECTRONIC PACKAGE - The solder-joint integrity of digital electronic packages, such as FPGAs or microcontrollers that have internally connected input/output buffers, is evaluated by applying a time-varying voltage through one or more solder-joint networks to charge a charge-storage component. Each network includes an I/O buffer on the die in the package and a solder-joint connection, typically one or more such connections inside the package and between the package and a board. The time constant for charging the component is proportional to the resistance of the solder-joint network, hence the voltage across the charge-storage component is a measurement of the integrity of the solder-joint network. | 06-25-2009 |
Udo Spuhler, Neustadt DE
Patent application number | Description | Published |
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20100092774 | PRESSURE SENSITIVE ADHESIVE FOR PAPER LABELS - Paper labels coated with a pressure sensitive adhesive (PSA), wherein | 04-15-2010 |