Patent application number | Description | Published |
20090067959 | Substrate processing apparatus, substrate transfer apparatus, substrate clamp apparatus, and chemical liquid treatment apparatus - The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections ( | 03-12-2009 |
20090305612 | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method - An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates. | 12-10-2009 |
20120193506 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE TRANSFER APPARATUS, SUBSTRATE CLAMP APPARATUS, AND CHEMICAL LIQUID TREATMENT APPARATUS - The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections each for polishing a semiconductor wafer (W), and a swing transporter for transferring the wafer (W). The swing transporter includes a wafer clamp mechanism adapted to clamp the wafer (W), a vertically moving mechanism for vertically moving the wafer clamp mechanism along a frame of a casing of the polishing section, and a swing mechanism for swinging the wafer clamp mechanism about a shaft adjacent to the frame. | 08-02-2012 |
20120308356 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER DEVICE - A substrate processing apparatus can prevent photo-corrosion of, e.g., copper interconnects due to exposure of a surface to be processed of a substrate to light, and can perform processing, such as cleaning, of a substrate surface while preventing photo-corrosion of, e.g., copper interconnects due to exposure to light. The substrate processing apparatus includes a plurality of processing areas housing therein processing units which have been subjected to light shielding processing; and at least one transfer area housing therein a transfer robot and disposed between two adjacent ones of the plurality of processing areas. A light shielding wall is provided between the transfer area and each of the two adjacent processing areas, and a light-shielding maintenance door is provided for the front opening of the transfer area. The processing units are coupled to the light shielding walls in a light-shielding manner. | 12-06-2012 |
20140302676 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTRATE HOLDING MECHANISM, AND SUBSTRATE HOLDING METHOD - An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates. | 10-09-2014 |
20150050863 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTRATE HOLDING MECHANISM, AND SUBSTRATE HOLDING METHOD - An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates. | 02-19-2015 |
Patent application number | Description | Published |
20140212689 | FILM AND METHOD FOR MANUFACTURING SAME - Disclosed are a film with high strength which does not easily deteriorate, and a method for manufacturing the film. A step for manufacturing a film formed on the molding surface of a die, includes an initial film-forming step for forming, on the molding surface of the die, an initial film having a carbon film which has a plurality of nano-carbons, and to which a plurality of fullerenes are applied, and a nitrogen compound layer and a sulfurized layer which are situated between the carbon film and the die, and an intermittent heating step for intermittently heating the initial film formed in the initial film-forming step under a non-oxidizing atmosphere. | 07-31-2014 |
20140239549 | CASTING MEMBER, CASTING METHOD, AND METHOD OF MANUFACTURING LUBRICANT USED FOR CASTING - In the invention, a nano carbon layer that is constituted by a nano carbon group is formed on a molten metal contact surface of a casting member, and a lubricant that has a pulverulent body, which is constituted by BN, graphite, talc or silica, as a main component is applied onto the nano carbon layer. It is preferable that a nitrided layer be formed between the nano carbon layer and the molten metal contact surface of the casting member when the nano carbon layer is formed, and that the lubricant applied to the nano carbon layer have a BN pulverulent body as a main component. According to the invention, the mold releasability and fluidity of the casting member can be maintained even if the number of times of casting is increased, and the cost of the process of subjecting the molten metal contact surface of the casting member to the surface treatment can be reduced. | 08-28-2014 |
20140306091 | CASTING MEMBER AND METHOD FOR MANUFACTURING SAME - Disclosed are an inexpensive casting member on which a film with high peel strength is formed, and a method for manufacturing the casting member. A surface-treated mold ( | 10-16-2014 |