Soojae
Soojae Kim, Pohang-Si KR
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20150151270 | SODIUM-NANO LIQUID REACTIVITY EXPERIMENT APPARTUS - A sodium-nanoliquid reactivity experiment apparatus includes: a storage tank that stores liquid sodium; a mixing tank that is connected to the storage tank through a first transport line to receive supply of the liquid sodium and that injects nanoparticles to mix the nanoparticles with the liquid sodium; and a reactor that is connected to the mixing tank through a second transport line to receive supply of a sodium-nanoparticle mixture and that injects water to react the water with the sodium-nanoparticle mixture. | 06-04-2015 |
Soojae Park, Seongnam-Si KR
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20150048522 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on the first semiconductor chip to expose at least a portion of the first semiconductor chip, and a stress-relieving structure provided at an edge of the first semiconductor chip and configured to relieve stress applied between the first semiconductor chip and the second semiconductor chip. | 02-19-2015 |
20150054148 | SEMICONDUCTOR PACKAGES INCLUDING HEAT EXHAUST PART - According to example embodiments, a semiconductor package includes a lower package, upper packages on the lower package and laterally spaced apart from each other, a lower heat exhaust part between the lower package and the upper packages, an intermediate heat exhaust part between the upper packages and connected to the lower heat exhaust part, and an upper heat exhaust part on the upper packages and connected to the intermediate heat exhaust part. | 02-26-2015 |
Soojae Park, Gyeonggi-Do KR
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20150115468 | SEMICONDUCTOR PACKAGE HAVING MAGNETIC CONNECTION MEMBER - Provided is a semiconductor package including a wiring substrate having top and bottom surfaces facing each other. A first semiconductor chip is disposed on the wiring substrate in a flip-chip manner. The first semiconductor chip has a first surface facing the top surface of the wiring substrate and a second surface opposite to the first surface. First connection members are disposed between the wiring substrate and the first semiconductor chip. The first connection members include first and second contact members each including one or more magnetic materials. The first contact members include portions disposed in the second contact members. The one or more magnetic material of the first contact members have an opposite polar orientation to that of the second contact members. | 04-30-2015 |
Soojae Park, Asan-Si KR
Patent application number | Description | Published |
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20160120032 | PACKAGE FRAME AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME - A package frame includes a plurality of unit regions disposed on one surface of the package frame, a peripheral region surrounding the unit regions on the one surface, and a wrinkled structure disposed on the one surface in the peripheral region. A first surface of the wrinkled structure extends from the one surface and is disposed at a different level than the one surface. Each of the unit regions includes a plurality of conductive pads. | 04-28-2016 |