Patent application number | Description | Published |
20090075484 | Method of Processing A Substrate, Spin Unit for Supplying Processing Materials to A Substrate, and Apparatus for Processing A Substrate Having the Same - In a spin unit for rotating a substrate and a method of processing the substrate, the substrate is secured on a support and is rotated on the support. Processing materials including drying gases, etching solutions and cleaning solutions are selectively supplied onto a bottom surface of the rotating substrate. The same processing materials are also selectively supplied onto a top surface of the substrate. The top and bottom surfaces of the substrate are simultaneously processed by simultaneous supply of the processing materials through the first and second sub-injectors. | 03-19-2009 |
20130081658 | APPARATUS AND METHOD FOR TREATING SUBSTRATE - Provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes a housing providing a space for performing a process, and a plurality of support members vertically arranged in the housing at predetermined intervals to support edges of substrates, respectively. | 04-04-2013 |
20130318815 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD - Provided is an apparatus for treating a substrate using a supercritical fluid. The substrate treating apparatus includes a housing, a support member disposed within the housing to support the substrate, a supercritical fluid supply unit in which the supercritical fluid is stored, a supply tube connecting the supercritical fluid supply unit to the housing to adjust an amount of supercritical fluid supplied from the supercritical fluid supply unit into the housing, and a vent tube branched from the supply tube to discharge the supercritical fluid remaining in the supply tube. A switching valve opening or closing the vent tube is disposed in the vent tube. | 12-05-2013 |
20150303036 | SUBSTRATE TREATMENT APPARATUS INCLUDING SEALING MEMBER HAVING ATYPICAL SECTION - A substrate treatment apparatus includes a seal on at least one of upper or lower chambers of a process chamber. The seal hermetically closes the substrate treatment region, and may be at a location to prevent a gap from forming between the upper and lower chambers. The lower chamber includes an inner wall and an outer wall defining a groove including the seal. The inner wall has a top surface lower than that of the outer wall. The seal has an atypical cross-sectional shape with a recess facing the substrate treatment region. | 10-22-2015 |
20150343496 | APPARATUS FOR TREATING SUBSTRATE - A substrate-treating apparatus is disclosed. The substrate-treating apparatus may include a vessel configured to provide a treatment space therein, a substrate-supporting unit provided in the vessel to support a substrate, and a spraying member configured to spray treatment solution on the substrate loaded on the substrate-supporting unit. The vessel may have an inner side surface, on which at least one texture pattern is formed. | 12-03-2015 |
Patent application number | Description | Published |
20090085859 | DISPLAY APPARATUS AND CONTROL METHOD THEREOF - A display apparatus includes a display panel which includes a data pixel which is formed to a display area in which an image is displayed, and a dummy pixel which is formed to a non display area in which the image is not displayed, a light source unit which supplies a light to the data pixel and the dummy pixel, a light source driving unit which supplies a driving power to the light source unit, a light sensing unit which senses the light emitted from the dummy pixel, and a light source control unit which controls the light source driving unit so that at least one of brightness and a color coordinate of sensed light has a predetermined reference value. | 04-02-2009 |
20090262276 | LIQUID CRYSTAL DISPLAY - A liquid crystal display (“LCD”) includes; a lower receiving container which includes; a bottom plate, sidewalls extending from the bottom plate, a first through-hole formed in the bottom plate, and a guide pole disposed on the bottom plate and which substantially surrounds the first through-hole, a plurality of light sources disposed within the lower receiving container; an optical sensor printed circuit board (“PCB”) attached to a bottom surface of the bottom plate, wherein the optical sensor printed circuit board covers the first through-hole, and an optical sensor mounted on the optical sensor PCB and inserted into the first through-hole. | 10-22-2009 |
20110063261 | LIQUID CRYSTAL DISPLAY DEVICE INCLUDING IMPROVED CIRCUIT SUBSTRATE CONNECTION - A display device includes; a display panel including; a data line, a gate line insulated from the data line and a pixel respectively connected to the data line and the gate line, a first printed circuit board (“PCB”) which drives the display panel and is disposed adjacent to the display panel, the first PCB having a first driving circuit disposed thereon, a second PCB disposed adjacent to the first PCB and the display panel, the second PCB having a second driving circuit and a control circuit disposed thereon, wherein the second driving circuit drives the display panel and the control circuit controls the first driving circuit and the second driving circuit. | 03-17-2011 |
Patent application number | Description | Published |
20140231814 | THIN FILM TRANSISTOR ARRAY PANEL AND METHOD OF MANUFACTURING THE SAME - In a thin film transistor array panel and a method of manufacturing the same, a thin passivation layer is positioned between a first field generating electrode and a second field generating electrode. The thin passivation layer overlaps the first and second field generating electrodes. The thin passivation layer includes a transparent photosensitive organic material. When forming the first field generating electrode, the passivation layer is used as a photosensitive film. Accordingly, the passivation layer and the first field generating electrode may be formed using a same single photo-mask. Accordingly, the manufacturing cost of the thin film transistor array panel may be reduced. | 08-21-2014 |
20140232963 | LIQUID CRYSTAL DISPLAY AND MANUFACTURING METHOD THEREOF - A liquid crystal display, includes: a substrate; a gate line including a gate pad and a data line including a data pad, the gate and data lines being disposed on the substrate; a thin film transistor connected to the gate line and the data line; an organic layer disposed on the thin film transistor; a pixel electrode disposed on the organic layer; a first contact assistant disposed on the gate pad; a second contact assistant disposed on the data pad; a first insulating layer disposed on the pixel electrode; and a common electrode disposed on the first insulating layer, the common electrode overlapping with the pixel electrode. The common electrode includes first cutouts, the first insulating layer includes second cutouts, the plane shapes of the first and second cutouts are substantially the same, and the pixel electrode includes a polycrystalline transparent conductive material. | 08-21-2014 |
20140267999 | LIQUID CRYSTAL DISPLAY AND MANUFACTURING METHOD THEREOF - A liquid crystal display includes a first substrate, gate lines and data lines disposed on a display area of the first substrate, a common voltage line disposed on a peripheral area of the first substrate, a common voltage transmission unit extending from the common voltage line, an organic layer disposed on the common voltage transmission unit and the common voltage line, a connecting member disposed on the organic layer disposed on the peripheral area, a first insulating layer disposed on the pixel electrode and the connecting member, a common electrode disposed on the first insulating layer, and a short point connecting the connecting member and the common electrode to each other. The common electrode and the first insulating layer include a plurality of cutouts in the peripheral region and display region of the first substrate which have substantially a same plane shape as each other. | 09-18-2014 |
20150061986 | LIQUID CRYSTAL DISPLAY - A liquid crystal display includes pixels which is disposed in row and column directions, respectively includes pixel electrodes, and arranged along a first pixel column to a sixth pixel column, gate lines including pairs of two adjacent gate lines for each pixel row in the row direction, data lines including a first data line at a left side of the first pixel column, a second data line between the second and third pixel columns, a third data line between the fourth and fifth pixel columns, and a fourth data line at a right side of the sixth pixel column; and common voltage lines including a first common voltage line between the first and second pixel columns, a second common voltage line between the third and fourth pixel columns, and a third common voltage line between the fifth and sixth pixel columns. | 03-05-2015 |
20150062472 | LIQUID CRYSTAL DISPLAY - A display device may include an insulating layer. The display device may further include a first field-generating electrode that overlaps the insulating layer. The display device may further include a second field-generating electrode that overlaps the first field-generating electrode and has a cutout. An exposed portion of the insulating layer may be exposed through the cutout and may be exposed between an edge (or boundary) of the first field-generating electrode and an end portion of the second field-generating electrode in a layout view of the display device. | 03-05-2015 |
Patent application number | Description | Published |
20140177242 | Substrate for Optical Device - The present invention relates to a substrate for an optical device, which is configured to connect an optical element substrate and an electrode substrate in a fitting manner, and simultaneously, to form one or more bridge pads which are insulated from the optical element substrate by a horizontal insulating layer, on the optical element substrate. The substrate for an optical device according to a first aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of an insulating material to form a conductive layer on at least a portion of the upper surface thereof, are connected to both side surfaces of the optical element substrate, respectively, and are wire-bonded to the electrodes of the optical elements; and a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate. The substrate for an optical device according to a second aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of a metal material to be connected to both side surfaces of the optical element substrate, respectively, and are wire-bonded to the electrodes of the optical elements; a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate; and a fitting-type vertical insulating layer which is interposed between the optical element substrate and the electrode substrate so as to be connected to the fitting means. | 06-26-2014 |
20150048408 | Method for Manufacturing a Can Package-Type Optical Device, and Optical Device Manufactured Thereby - The present invention relates to a method for manufacturing an optical device, and to an optical device manufactured thereby, which involve using a substrate itself as a heat-dissipating plate, and adopting a substrate with vertical insulation layers formed thereon, such that electrode terminals do not have to be extruded out from a sealed space, and thus enabling the overall structure and manufacturing process for an optical device to be simplified. | 02-19-2015 |
20150117035 | Heat Sink for Chip Mounting Substrate and Method for Manufacturing the Same - Provided is a heat sink for a chip mounting substrate in which a heat dissipation material is embedded. The heat sink includes: an accommodation portion configured to accommodate a substrate whereon a chip is mounted or to be mounted, and support or fix the accommodated substrate; and a heat dissipation portion configured to insulate the accommodated substrate, and dissipate heat generated from the substrate or the chip mounted on the substrate to an outside through a heat dissipation material contained in the heat dissipation portion. Accordingly, since the heat sink for a chip mounting substrate in which a heat dissipation material is embedded is manufactured by injection molding, a manufacturing process can be simplified. Further, since the heat sink of a single structure is used, a TIM bonding layer for bonding the substrate and the heat sink is not required, and an electrical insulating layer formed by anodizing an upper surface of the heat sink for electrical insulation between the substrate and the heat sink is not required, and thus the structure can be simplified. | 04-30-2015 |
20150129905 | Optical Device and Method for Manufacturing Same - The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate. | 05-14-2015 |
20150147580 | High Heat-Radiant Optical Device Substrate - An optical device substrate includes metal plates and insulating layers formed between the metal plates. Each insulating layer includes a cured insulating layer formed by curing insulating material and an anodized layer merged with each metal plate, the anodized layer formed by anodizing a first metal and a second metal of each metal plate. The first metal and the second metal include a first anodized layer and a second anodized layer, respectively, and are electrically insulated by interfaces including a first interface formed between the first metal and the first anodized layer, a second interface formed between the first anodized layer and the cured insulating layer, a third interface formed between the cured insulating layer and the second metal and a fourth interface formed between the second anodized layer and the second metal. | 05-28-2015 |
20150372209 | OPTICAL DEVICE AND METHOD FOR MANUFACTURING SAME - An optical device includes a metal substrate wherein at least one vertical insulation layer is formed from the upper to the lower surface; a metal plated layer formed on the upper surface of the metal substrate except for the vertical insulation layer; and an optical device chip bonded to one portion of the metal plated layer. One electrode of the optical device chip is electrically connected to a bonded surface of the metal plated layer, and the other electrode of the optical device chip is wire bonded to the other portion of metal plated layer. The optical device chip and a peripheral region thereof is shielded with a sealant, and at least one groove is formed on a partial surface of the metal plated layer so that a portion of the sealant is directly bonded to the metal substrate. | 12-24-2015 |
20160064146 | CAPACITOR - The present invention relates to a capacitor. The capacitor includes a substrate; a dielectric layer formed on the substrate; and an electrode layer comprising a first electrode layer and a second electrode layer formed on the dielectric layer, wherein the first electrode layer and the second electrode layer are separated from each other, and at least a portion of the first electrode layer and at least a portion of the second electrode layer are disposed on a same surface. With this configuration, applying the electricity becomes easy, and since the first and the second electrode layers function as the electrodes being charged with different polarity electrical charges respectively, manufacturing thereof becomes easy, and the structure thereof is simple. | 03-03-2016 |
20160095222 | Chip Substrate Comprising Cavity with Curved Surfaces - A chip substrate includes conductive portions, an insulation portion and a cavity. The conductive portions are laminated in one direction to constitute the chip substrate. The insulation portion is interposed between the conductive portions to electrically isolate the conductive portions. The cavity is formed on an upper surface of the chip substrate at a predetermined depth in a region including the insulation portion. The cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature. | 03-31-2016 |