Patent application number | Description | Published |
20090255714 | Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board - A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin. | 10-15-2009 |
20110315437 | Printed circuit board with reinforced thermoplastic resin layer - A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher. | 12-29-2011 |
20150041206 | LAMINATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a laminate for a printed circuit board, a printed circuit board using the same, and a method of manufacturing the same. A laminate according to a preferred embodiment includes a primer layer formed on a metal foil and a resin layer formed on the primer layer. | 02-12-2015 |
20150107760 | CARRIER AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME - Disclosed herein are a carrier and a method of manufacturing a printed circuit board using the same. More specifically, in the carrier according to the present invention, the carrier has characteristics of a coefficient of thermal expansion (CTE), a glass transition temperature (Tg), and a storage modulus which are improved by an insulating layer including an epoxy resin and a liquid crystal oligomer. In addition, a first metal layer is formed on the insulating layer, such that the printed circuit board stacked on one surface or both surfaces of the carrier may be protected from deformation by physical impact and the warpage phenomenon may be minimized. | 04-23-2015 |
20150114693 | INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS MANUFACTURED BY USING THE SAME - Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized. | 04-30-2015 |
Patent application number | Description | Published |
20100141614 | Plasma display apparatus - A plasma display apparatus includes a plasma display panel, a chassis base at the rear of the plasma display panel and having a plurality of channels for guiding heated air to flow upwardly, and a thermal conductive medium between the plasma display panel and the chassis base. | 06-10-2010 |
20110183177 | Battery pack for a vehicle - A battery pack for a vehicle, the battery pack including a sealed inner case accommodating a battery module; an open external case surrounding the inner case, the open external case including a first opening part having an open side and a second opening part having another open side; and an air flow channel between an external surface of the inner case and an inner surface of the external case, the air flow channel connecting the first opening part and the second opening part. | 07-28-2011 |
20110183178 | Battery pack - A battery pack includes a secondary battery, an outer case receiving the secondary battery, and a cooling unit disposed at a predetermined position of the outer case, wherein the cooling unit includes a first heatsink disposed toward the inside of the outer case, a second heatsink disposed toward the outside of the outer case, and a thermoelectric device between the first heatsink and the second heatsink. | 07-28-2011 |
Patent application number | Description | Published |
20130050814 | PROJECTION SCREEN AND PROJECTION SYSTEM HAVING THE SAME - A projection screen is provided, which includes a reflective layer having plural reflective patterns which are spaced apart from one another and each of which includes an image reflective surface having an inclination angle against a horizontal direction so as to guide an image light toward a front of the screen, and plural external light absorption layers absorbing external lights incident to the screen. | 02-28-2013 |
20140139914 | REFLECTION TYPE SCREEN FOR FRONT PROJECTION DISPLAY APPARATUS - Provided is a front reflection screen for a front projection display apparatus. The front reflection screen includes a reflection layer configured to reflect an incident light including an image light projected from a projector and an external light, and a tint layer disposed before the reflection layer and including light absorbing particles to block a portion of the incident light. | 05-22-2014 |
20150261079 | LIGHT ABSORBING FILM, REFLECTION-TYPE SCREEN FOR FRONT PROJECTION DISPLAY DEVICE HAVING THE SAME, AND METHOD FOR MANUFACTURING LIGHT ABSORBING FILM - A method for manufacturing a light-absorbing film is provided, where the light-absorbing film absorbs external light incident on a reflection surface of a reflection-type screen. The method includes forming a dye layer by spreading dye, including a light absorbing material, on a surface of a first transparent film, laminating a second transparent film on the dye layer, forming a cylindrical film roll by winding the first and second transparent films, laminated on the dye layer, around a core, and forming a film member by slicing the film roll along a direction that is inclined with respect to a radial direction of the film roll. | 09-17-2015 |
20150261384 | TOUCH RECOGNITION DEVICE AND DISPLAY APPARATUS USING THE SAME - Provided is a touch recognition device and a display apparatus using the same. The touch recognition device includes: an image screen configured to display an image; a light source configured to emit light toward the image screen; a camera provided in the rear of the image screen and configured to detect at least one of infrared reflected and input from an object approaching or contacting the image screen; and a diffusion transmitter provided between the image screen and the camera, configured to diffuse the emitted light in response to the light source emitting the light, and configured to transmit the infrared in response to the light source emitting no light. | 09-17-2015 |
Patent application number | Description | Published |
20090057860 | Semiconductor memory package - Disclosed is a semiconductor memory package having a thin-film decoupling capacitor that reduces radio frequency noise. The semiconductor memory package in accordance with an embodiment of the present invention includes a substrate, a memory chip being mounted on one side of the substrate and a decoupling capacitor formed in the vicinity one the side of the substrate where the memory chip is mounted. | 03-05-2009 |
20090277673 | PCB having electronic components embedded therein and method of manufacturing the same - Provided is a PCB having electronic components embedded therein, the PCB including a core layer having electronic components embedded therein and a resin layer formed thereon and thereunder; internal layer circuits formed on the resin layer and being electrically connected to the electronic components; an insulating layer formed on the internal layer circuits; and external layer circuits formed on the insulating layer and being electrically connected to the internal layer circuits. | 11-12-2009 |
20110116246 | PRINTED CIRCUIT BOARD HAVING ELECTRO-COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component embedded printed circuit board and a method of manufacturing the same are disclosed. The electronic component embedded printed circuit board in accordance with an embodiment of the present invention can include a first substrate, which has a cavity formed therein, a first electronic component, which is embedded in the cavity in a face-down manner, a second electronic component, which is stacked on an upper side of the first electronic component and embedded in the cavity in a face-up manner, and a second substrate, which is stacked on upper and lower surfaces of the first substrate. | 05-19-2011 |
20110141711 | ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - An electronic component embedded printed circuit board and a method of manufacture the same are disclosed. The electronic component embedded printed circuit board in accordance with an embodiment of the present invention can include a dielectric core substrate, which has a cavity formed therein, an electronic component, which is housed in the cavity and has an electrode formed on one surface thereof, an insulation layer, which is formed on both surface of the dielectric core substrate, a via, which is formed in the insulation layer such that the via is electrically connected to the electrode, and a first circuit pattern, which is formed on the insulation layer such that the first circuit pattern is electrically connected to the via. | 06-16-2011 |
20110214913 | ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURNG METHOD THEREOF - An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, an electro device embedded printed circuit board is manufactured by: adhering an electro device on an upper surface of a supporting body; stacking a pure resin layer and an insulating reinforcing layer on an upper side of the supporting body, wherein the electro device is embedded in the pure resin layer; removing the supporting body; stacking an insulation layer on a lower side of the electro device, a reinforcing material having been impregnated in the insulation layer; and patterning a circuit on each of the reinforcing layer and the insulation layer. | 09-08-2011 |
20110216515 | ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, an electro device embedded printed circuit board is manufactured by: adhering a first electro device on a supporting body through a face-down method; adhering a second electro device on an upper surface of the first electro device through a face-up method; stacking a pure resin layer and a reinforcing layer on an upper side of the supporting body, wherein the first electro device and the second electro device are embedded in the pure resin layer; removing the supporting body; stacking an insulation layer on a lower side of the first electro device, a reinforcing material having been impregnated in the insulation layer; and patterning a circuit on each of the reinforcing layer and the insulation layer. | 09-08-2011 |
20120017435 | Method of manufacturing PCB having electronic components embedded therein - A method of manufacturing a PCB having electronic components embedded therein, including: preparing a copper foil layer including a thin copper foil coated with a resin layer; fixing electronic components onto the resin layer; forming a core layer in which the electronic components are embedded; forming internal layer circuits which are electrically connected to the electronic components; forming an insulating layer on the internal layer circuits; and forming external layer circuits on the insulating layer such that the external layer circuits are electrically connected to the internal layer circuits. | 01-26-2012 |
20120291274 | PRINTED CIRCUIT BOARD HAVING ELECTRO-COMPONENT AND MANUFACTURING METHOD THEREOF - An electronic component embedded printed circuit board and a method of manufacturing the same are disclosed. The electronic component embedded printed circuit board in accordance with an embodiment of the present invention can include a first substrate, which has a cavity formed therein, a first electronic component, which is embedded in the cavity in a face-down manner, a second electronic component, which is stacked on an upper side of the first electronic component and embedded in the cavity in a face-up manner, and a second substrate, which is stacked on upper and lower surfaces of the first substrate. | 11-22-2012 |
20130127299 | PIEZOELECTRIC DEVICE OF POLYMER - The present invention relates to a piezoelectric device of a multi-layered structure on which first electrodes and second electrodes are sequentially stacked on a piezoelectric polymer and single surfaces or both surfaces of piezoelectric polymer. | 05-23-2013 |
20150263506 | APPARATUS AND METHOD FOR CONTROLLING ADAPTIVE RECLOSING BASED ON TRANSIENT STABILITY - An apparatus and method for controlling adaptive reclosing based on transient stability of a power transmission line are disclosed. The apparatus includes a power angle calculation unit, an integral square error (ISE) second-order differential calculation unit, a stability determination unit, and a disconnection signal generation unit. The power angle calculation unit acquires the instantaneous value of a power angle based on voltage and phase angle measurement signals. The ISE second-order differential calculation unit acquires the instantaneous value of the second-order differential of the ISE of the power angle. The stability determination unit determines whether a system is stable or unstable based on the transitions in the instantaneous value of the second-order differential of the ISE. The disconnection signal generation unit generates a first disconnection signal and a second disconnection signal adapted to open or reclose the circuit breaker at the leader end and the circuit breaker at the follower end. | 09-17-2015 |
Patent application number | Description | Published |
20100304198 | ELECTRODE ASSEMBLY FOR SECONDARY BATTERY AND METHOD OF MANUFACTURING THE SAME - An electrode assembly for a secondary battery and a method of manufacturing the same are disclosed. The electrode assembly includes a first separator wound to form a plurality of stacked first separator members; a second separator wound with the first separator to form a plurality of stacked second separator members to be respectively positioned between the first separator members; and a plurality of electrode members positioned between the first separator members and the second separator members. An inner surface of one of the first separator members positioned at the innermost side and an inner surface of one of the second separator members positioned at the innermost side face each other. | 12-02-2010 |
20110104572 | ELECTRODE ASSEMBLY FOR SECONDARY BATTERY AND METHOD OF MAKING THE ELECTRODE ASSEMBLY - An electrode assembly for a secondary battery and a method of manufacturing the same are disclosed. An electrode assembly comprises: a plurality of separator members formed by winding a central separator member, wherein the central separator member is a predeterminated portion of the separator; and a plurality of electrode members positioned between each of the separator members; wherein the separator including the plurality of separator members and the central separator member is one of the plurality of separator members, and wherein both opposite ends of the central separator member is curved in opposite directions, respectively. | 05-05-2011 |
20110171521 | Secondary battery - A secondary battery including an electrode assembly, the electrode assembly including a positive electrode plate, a negative electrode plate, and a separator; a pouch accommodating the electrode assembly; and a dissipation member, the dissipation member contacting the electrode assembly and protruding to an exterior of the pouch from an interior of the pouch. | 07-14-2011 |