Patent application number | Description | Published |
20100036065 | Maleimide-alpha-alkylstyrene-based tetrapolymer with low molten viscosity and continuous bulk process for producing it - Disclosed are a maleimide-α-alkylstyrene-based, heat-resistant bulk tetrapolymer and a preparation process thereof. More specifically, disclosed are a bulk tetrapolymer, comprising 5-60 wt % of an N-substituted maleimide monomer, 10-70 wt % of an α-alkylstyrene monomer, 5-50 wt % of an unsaturated nitrile monomer and 3-50 wt % of an aromatic vinyl monomer, as well as a continuous bulk polymerization process for preparing the same. The disclosed bulk tetrapolymer has a weight-average molecular weight (Mw) of 70,000-300,000 and a glass transition temperature of 150-200° C., shows excellent high-temperature thermal stability and heat resistance and a remarkably low melt viscosity, and thus is excellent not only in processability, but also in productivity, processability, moldability and blendability, when it is blended with other resins. Also, the continuous bulk polymerization process is equipped with a devolatilizer and enables the bulk tetrapolymer to be produced at low cost and high efficiency. | 02-11-2010 |
20100240851 | MALEIMIDE-ALPHA-ALKYLSTYRENE-BASED TERPOLYMER WITH LOW MOLTEN VISCOSITY AND CONTINUOUS BULK PROCESS FOR PRODUCING IT - Disclosed are a maleimide-α-alkylstyrene-based, heat-resistant bulk terpolymer and a preparation process thereof. More specifically, disclosed are a bulk terpolymer, comprising 5-60 wt % of an N-substituted maleimide monomer, 10-70 wt % of an α-alkylstyrene monomer and 5-50 wt % of an unsaturated nitrile monomer, as well as a continuous bulk polymerization process for preparing the same. The disclosed bulk terpolymer has a weight-average molecular weight (Mw) of 70,000-300,000 and a glass transition temperature of 140-200° C., shows excellent high-temperature thermal stability and heat resistance and a remarkably low melt viscosity, and thus is excellent not only in processability, but also in productivity, processability, moldability and blendability, when it is blended with other resins. Also, the continuous bulk polymerization process is equipped with a devolatilizer and enables the bulk terpolymer to be produced at low cost and high efficiency. | 09-23-2010 |
Patent application number | Description | Published |
20120099364 | RESISTIVE MEMORY DEVICES, INITIALIZATION METHODS, AND ELECTRONIC DEVICES INCORPORATING SAME - A resistive memory device and method of initialization are provided. The resistive memory device includes a first group of resistive memory cells connected between bit lines and a first plate and a second group connected between bit lines and a second plate. First and second initialization voltages are respectively applied to the first and second plates outside a normal path associated with a normal operation of the resistive memory cells. | 04-26-2012 |
20130227344 | DEVICE AND METHOD FOR REPAIRING MEMORY CELL AND MEMORY SYSTEM INCLUDING THE DEVICE - Provided are a method and an apparatus for repairing a memory cell in a memory test system. A test device detects a fail address by testing a memory device according to a test command, and temporarily stores the fail address in a fail address memory (FAM). The fail address is transmitted to the memory device according to a fail address transmission mode, is temporarily stored in a temporary fail address storage of the memory device, and is then stored in an anti-fuse array, which is a non-volatile storage device. To secure the reliability of data, stored data can be read to verify the data and a verification result can be transmitted in series or in parallel to the test device. | 08-29-2013 |
20130311717 | MAGNETIC RANDOM ACCESS MEMORY - A magnetic random access memory (MRAM), and a memory module, memory system including the same, and method for controlling the same are disclosed. The MRAM includes magnetic memory cells configured to change between at least two states according to a magnetization direction, and a mode register supporting a plurality of operational modes. | 11-21-2013 |
20130322162 | SEMICONDUCTOR MEMORY DEVICES AND RELATED METHODS OF OPERATION - A semiconductor memory device includes a cell array including one or more bank groups, where each of the one or more bank groups includes a plurality of banks and each of the plurality of banks includes a plurality of spin transfer torque magneto resistive random access memory (STT-MRAM) cells. The semiconductor memory device further includes a source voltage generating unit for applying a voltage to a source line connected to the each of the plurality of STT-MRAM cells, and a command decoder for decoding a command from an external source in order to perform read and write operations on the plurality of STT-MRAM cells. The command includes a combination of at least one signal of a row address strobe (RAS), a column address strobe (CAS), a chip selecting signal (CS), a write enable signal (WE), and a clock enable signal (CKE) | 12-05-2013 |
20130329489 | MAGNETO-RESISTIVE MEMORY DEVICE INCLUDING SOURCE LINE VOLTAGE GENERATOR - A MRAM includes a memory cell array of spin-transfer torque magnetic random access memory (STT-MRAM) cells and a source line commonly connected to the plurality of STT-MRAM cells. A source line voltage generator generates a source line driving voltage in response to an external power supply voltage and provides the source line driving voltage to the source line. | 12-12-2013 |
20140016404 | MAGNETIC RANDOM ACCESS MEMORY - A magnetic memory device such as a magnetic random access memory (MRAM), and a memory module and a memory system on which the magnetic memory device is mounted are disclosed. The MRAM includes magnetic memory cells each of which varies between at least two states according to a magnetization direction and an interface unit that provides various interface functions. The memory module includes a module board and at least one MRAM chip mounted on the module board, and further includes a buffer chip that manages an operation of the at least one MRAM chip. The memory system includes the MRAM and a memory controller that communicates with the MRAM, and may communicate an electric-to-optical conversion signal or an optical-to-electric conversion signal by using an optical link that is connected between the MRAM and the memory controller. | 01-16-2014 |
20140022836 | SEMICONDUCTOR MEMORY DEVICE HAVING RESISTIVE MEMORY CELLS AND METHOD OF TESTING THE SAME - A semiconductor memory device includes a memory cell array, a mode register set and a test circuit. The memory cell array includes a plurality of wordlines, a plurality of bitlines, and a plurality of spin-transfer torque magneto-resistive random access memory (STT-MRAM) cells, and each STT-MRAM cell disposed in a cross area of each wordline and bitline, and the STT-MRAM cell includes a magnetic tunnel junction (MTJ) element and a cell transistor. The MTJ element includes a free layer, a barrier layer and a pinned layer. A gate of the cell transistor is coupled to a wordline, a first electrode of the cell transistor is coupled to a bitline via the MTJ element, and a second electrode of the cell transistor is coupled to a source line. The mode register set is configured to set a test mode, and the test circuit is configured to perform a test operation by using the mode register set. | 01-23-2014 |
20140146600 | MEMORY SYSTEM HAVING VARIABLE OPERATING VOLTAGE AND RELATED METHOD OF OPERATION - A magneto-resistive random access memory (MRAM) comprising an MRAM cell array having an MRAM cell, and a control and voltage generation unit configured to generate a back bias voltage for the MRAM cell. The control and voltage generation unit comprising a command decoder configured to generate a decoding signal in response to a command output from a memory controller, and a voltage controller and generator configured to generate the back bias voltage with a magnitude based on the decoding signal and a reset signal output from the memory controller. | 05-29-2014 |
20140219000 | OTP CELL ARRAY INCLUDING PROTECTED AREA, SEMICONDUCTOR MEMORY DEVICE INCLUDING THE SAME, AND METHOD OF PROGRAMMING THE SAME - A method of programming a memory device including a one-time programmable (OTP) cell array configured to include at least one of a protected area and a programmable area are disclosed. The method includes receiving a fuse-program command to initiate a fuse-programming operation; checking whether the programmable area exists in the OTP cell array, terminating the fuse-programming operation when the OTP cell array does not include the programmable area, performing a fuse-programming operation on the programmable area when the OTP cell array includes the programmable area thereby programming fuses to create a fuse-programmed area; setting the fuse-programmed area of the OTP cell array as the protected area. | 08-07-2014 |
20140223257 | SEMICONDUCOTR MEMORY DEVICE INCLUDING NON-VOLATILE MEMORY CELL ARRAY - A semiconductor memory device that may correct error data using an error correction circuit is disclosed. The semiconductor memory device may include a DRAM cell array, a parity generator, a nonvolatile memory cell array and an error correction circuit. The parity generator is configured to generate a first set of parity bits having at least one bit based on input data. The nonvolatile memory cell array may store the input data and the first set of parity bits corresponding to the input data, and to output first data corresponding to the input data, and a second set of parity bits corresponding to the first set of parity bits. The error correction circuit is configured to generate second data as corrected data based on the first data. | 08-07-2014 |
Patent application number | Description | Published |
20120219580 | HIGHLY PATHOGENIC AVIAN INFLUENZA VIRUS PROTEIN VACCINE DERIVED FROM TRANSGENIC PLANT, AND PREPARING METHOD THEREOF - The present invention relates to a method for producing transgenic plants, which involves producing hemagglutinin proteins of the H5N1 virus using a plant transformation recombinant vector, wherein said vector can express hemagglutinin proteins of the H5N1 virus, the highly pathogenic avian influenza virus, and transport proteins expressed in plants to the endoplasmic reticulum and enable the retention of the proteins in the endoplasmic reticulum to enable glycosylation required for antigen activity. The present invention also relates to a method for the mass production of hemagglutinin proteins of the antigenic H5N1 virus from transgenic plants or a vaccine composition for the avian influenza virus comprising the transgenic plants or the hemagglutinin proteins produced from the plants. The transgenic plants can be used as edible vaccines, antigenic hemagglutinin proteins produced can be used as protein vaccines for the H5N1 avian influenza virus, or as diagnostic reagents for avian influenza virus infection. | 08-30-2012 |
20120255069 | DNA FRAGMENT FOR IMPROVING TRANSLATION EFFICIENCY, AND RECOMBINANT VECTOR CONTAINING SAME - The present invention relates to a DNA fragment for improving translation efficiency, and a recombinant vector containing the same, and more specifically, to a DNA fragment which comprises any one nucleotide sequence selected from the group consisting of SEQ ID NOs: 1-6, SEQ ID NOs: 8-10, SEQ ID NOs: 13 and 14 and SEQ ID NO: 16, and improves the translation efficiency of a heterologous protein placed in the downstream, and a recombinant vector containing the DNA fragment. The DNA fragment for improving translation efficiency according to the present invention and a recombinant vector containing the same can improve the translation of a heterologous protein in a transgenic plant. In addition, if a leader polynucleotide inducing the targeting to a particular cellular organelle of a plant is further linked to the recombinant vector in an operable manner, the heterologous protein is targeted to the specific cellular organelle and can be stably accumulated, thereby enabling the mass production of the heterologous protein from the plant. | 10-04-2012 |
Patent application number | Description | Published |
20110073223 | STEEL SHEET FOR GALVANIZING WITH EXCELLENT WORKABILITY, AND METHOD FOR MANUFACTURING THE SAME - A high strength ductile steel sheet for extra deep drawing mainly used for interior or exterior plates of automobile bodies, and a method for manufacturing the same are disclosed. The steel sheet comprises, by weight %, C: 0.010% or less, Si: 0.1% or less, Mn: 0.06˜1.5%, P: 0.15% or less, S: 0.020% or less, Sol. Al: 0.10˜0.40%, N: 0.010% or less, Ti: 0.003˜0.010%, Nb: 0.003˜0.040%, B: 0.0002˜0.0020%, Mo: 0.05% or less, one or both of Sb: 0.005˜0.05% and Sn: 0.005˜0.05%, a total amount of Sb and Sn being in the range of 0.005˜0.1% when both of Sb and Sn are added to the steel sheet, and the balance of Fe and other unavoidable impurities. The steel sheet has surface agglomerates having an average diameter of 1 μm or less, and a tensile strength of 28˜50 kgf/mm | 03-31-2011 |
20110100516 | Bake Hardening Steel with Excellent Surface Properties and Resistance to Secondary Work Embrittlement, and Preparation Method Thereof - Provided are a bake hardening steel having a crystalline grain size of ASTM No. 9 or more and a method for preparing the bake hardening steel by controlling the winding, rolling and cooling conditions. The bake hardening steel includes: C:0.0016˜0.0025%, Si:0.02% or less, P:0.01˜0.05%, S:0.01% or less, sol.Al:0.08˜0.12%, N:0.0025% or less, Ti:0.003% or less, Nb:0.003˜0.011%, Mo:0.01˜0.1%, B:0.0005˜0.0015% or less, balance Fe and other inevitable impurities, wherein % is weight %, and Mn and P satisfy the relation of −30(° C.)≧803P−24.4Mn−58. | 05-05-2011 |
20120267012 | ZINC-PLATED STEEL SHEET FOR HOT PRESSING HAVING OUTSTANDING SURFACE CHARACTERISTICS, HOT-PRESSED MOULDED PARTS OBTAINED USING THE SAME, AND A PRODUCTION METHOD FOR THE SAME - Provided is a zinc-plated steel sheet for hot pressing having outstanding surface characteristics, comprising: a steel foundation plate comprising a metal surface diffusion layer of which the Gibbs free energy reduction per mole of oxygen during oxidation is less than that of Cr; an aluminum-rich layer containing at least 30 wt. % of aluminium formed on the surface diffusion layer, and a zinc plating layer formed on the aluminum-rich layer. In this way, a metal having a low affinity for oxygen is coated to an effective thickness prior to annealing and thus the creation of annealing oxides at the surface of the steel sheet is suppressed and a uniform zinc plating layer is formed, and alloying of the zinc plating layer is promoted during press-processing heat treatment. Cracking in the steel foundation plate during hot press molding is prevented. | 10-25-2012 |
Patent application number | Description | Published |
20080295928 | Method for Manufacturing High Strength Steel Strips with Superior Formability and Excellent Coatability - A method for manufacturing a steel sheet used for structural members, elements, etc. of automobiles including a front side member, pillar, and the like, and more particularly, a method for manufacturing a steel sheet having a high strength and formability as well as hot-dip galvanizing properties is disclosed. In the method, after an aluminum killed steel slab, which comprises, by weight %,: C: 0.05% to 0.25%; Si: 0.1% to 1.5%; S: 0.02% or less; N: 0.01% or less; Al: 0.02% to 2.0%; Mn: 1.0% to 2.5%; P: 0.001% to 0.1%; Sb: 0.005% to 0.10%; the balance of Fe and other unavoidable impurities, is subjected to a homogenization treatment at a temperature range of 1050° C. to 1300° C., the aluminum killed steel slab is subjected to a hot rolling under a finishing hot rolling temperature of 850° C. to 950° C. and a coiling temperature of 400° C. to 700° C., followed by a cold rolling under a cold rolling reduction ration of 30% to 80%, and annealing the cold rolled steel sheet. | 12-04-2008 |
20090053556 | HIGH MN STEEL SHEET FOR HIGH CORROSION RESISTANCE AND METHOD OF MANUFACTURING GALVANIZING THE STEEL SHEET - A high-manganese hot-dip coated steel sheet is disclosed which provides high corrosion resistance, high ductility and high strength, mainly used for inner and outer panels of automobiles, and a method of manufacturing the same. The high-manganese hot-dip coated steel sheet includes a substrate steel sheet having a composition of (in weight %) 0.1 to 1.5% of C, 5 to 35% of Mn, and the remainder includes Fe and other unavoidable impurities, and a hot-dip zinc coating layer formed on the substrate steel sheet, the hot-dip zinc coating layer having a composition of (in weight %) 0.1 to 10% of Mn, 5 to 15% of Fe, and the remainder including Zn and other unavoidable impurities. | 02-26-2009 |
20090202382 | HIGH MANGANESE STEEL STRIPS WITH EXCELLENT COATABILITY AND SUPERIOR SURFACE PROPERTY, COATED STEEL STRIPS USING STEEL STRIPS AND METHOD FOR MANUFACTURING THE STEEL STRIPS - A high-ductility, high-strength and high Mn steel strip used for steel strips of automobiles requiring superior formability and high strength, a plated steel strip produced by using the same, and a manufacturing method thereof are disclosed. The high Mn steel strip comprises, by weight %, 0.2˜1.5% of C, 10˜25% of Mn, 0.01˜3.0% of Al, 0.005˜2.0% of Si, 0.03% or less of P, 0.03% or less of S, 0.040% or less of N, and the balance of Fe and other unavoidable impurities. The high-ductility, high-strength and high Mn steel strip, and the plated steel strip produced by using the same have superior surface properties and plating characteristics. | 08-13-2009 |
Patent application number | Description | Published |
20110174274 | Fuel Pump Module - A fuel pump module including: a reservoir installed in a fuel tank, the reservoir being charged with a predetermined amount of fuel; a fuel pump installed in the reservoir and pumping the fuel contained in the reservoir to an internal combustion engine; a jet pump injecting a fuel jet into the reservoir to thereby introduce the fuel stored in the fuel tank into the reservoir; a guide tube installed on the jet pump and guiding both the fuel jet and the fuel introduced from the fuel tank along with the fuel jet into the reservoir; and a filter unit partitioning the interior of the reservoir into a fuel suction area, into which the fuel is introduced by the fuel pump, and a fuel charging area, which is charged with the fuel from the fuel tank, thus preventing foreign substances from being introduced from the fuel charging area into the fuel suction area. | 07-21-2011 |
20110174275 | Fuel Supply System - Provided is a fuel supply system. The fuel supply system includes a fuel pump module mounted in a fuel tank and including a reservoir having a predetermined amount of fuel filled therein and a fuel pump mounted in the reservoir to suck the fuel filled in the reservoir and supply it to an internal combustion engine; a fuel supply line supplying fuel from the fuel pump module to the internal combustion engine; and a fuel return line returning the fuel from the internal combustion engine to the fuel tank, wherein the inside of the reservoir is provided with a bypass tube connecting the fuel return line to the fuel pump to directly supply the fuel returned through the fuel return line to the fuel pump through the bypass tube. | 07-21-2011 |
20110206543 | Fuel Pump Module with Driver Equipped Inside Fuel Tank - Provided is a fuel pump module used for a car, and more particularly, to a fuel pump module with a driver equipped inside a fuel tank capable of solving a problem of space limitation due to the installation of the driver by disposing the driver for controlling a BLDC fuel pump between a flange and a reservoir and mounting it in the fuel tank, minimizing the degradation in performance of the BLDC fuel pump caused by voltage drop and efficiency degradation due to a wire by reducing a length of a wire for electrically connecting the driver with the BLDC fuel pump, and achieving a sufficient heat radiation effect by directly transferring the heat energy generated from electrical devices such as FET, MCU, or the like, mounted in the driver to the fuel in the fuel tank through the case cover. | 08-25-2011 |
20120060974 | APPARATUS FOR SENSING FUEL LEVEL IN FUEL TANK - Provided is an apparatus for sensing a fuel level in a fuel tank for sensing an amount of fuel remaining in the fuel tank mounted in a vehicle. The apparatus for sensing a fuel level according to the present invention senses a residual amount of fuel in a fuel tank by contacting a resistance substrate with a wiper, the apparatus including: a case that forms a sealable filling solution filling space and has a filling solution inlet formed on a top thereof; a stopper that blocks the filling solution inlet formed in the case to seal the filling solution filling space; and a filling solution that is filled in the filling solution filling space to perform an anti-rusting and lubricating function, wherein the resistance substrate and the wiper are disposed in the filling solution filling space. | 03-15-2012 |
Patent application number | Description | Published |
20090104412 | External Light Blocking Film For Display Device, Filter For Display Device Having The Same, And Method Of Fabricating The Same - A method of fabricating an external light blocking film for a display device is provided. The method includes a step of applying a curable resin in which a photochromic colorant is mixed on a backing of a transparent resin; a step of disposing a photo-mask having a predetermined pattern on the curable resin and then irradiating the photochromic colorant through the photo-mask with light having a first wavelength which makes the photochromic colorant color-changed; a step of removing the photo-mask and then curing the curable resin. The method can improve fabrication efficiency. | 04-23-2009 |
20090104413 | Filter For Display Device And Method For Fabricating The Same - A filter for a display device and a method for fabricating the filter are provided. The filter includes a base including a transparent polymer resin and a color compensation colorant mixed in the transparent polymer resin, an external light blocking pattern formed at the base, and an electromagnetic wave blocking layer formed on the base. | 04-23-2009 |
20090116249 | External Light Blocking Film For Display Device, Method Of Fabricating The Same And Filter Having The Same - An external light blocking film includes a base of transparent resin and an external light blocking pattern having a plurality of external light blocking parts. The external light blocking part is formed by filling a groove with a light absorption material. One end of the external light blocking part is exposed on a surface of the base, and the other end of the external light blocking part is buried in the base. The one end has a shape of a stripe and the other end has a shape of a zigzag curve when viewed from the front. Furthermore, a method of fabricating an external light blocking film and a filter for a display device having an external light blocking film are provided. The external light blocking film has an excellent ability to absorb external light. A complicated pattern of the external light blocking film can be easily formed without additional machining processes, whereby the fabrication time and cost can be saved. | 05-07-2009 |
20090126986 | Electromagnetic Shielding Film For Display Device, Filter Having The Same, And Method Of Fabricating The Same - An electromagnetic shielding film for a display device includes a transparent, resinous first base, an intaglio pattern formed on at least one side of the first base, and an electromagnetic shielding pattern containing a conductive material with which the intaglio pattern is filled. A method of fabricating an electromagnetic shielding film for a display device, includes the steps of coating a first curable resin on one surface of a transparent backing, forming an intaglio pattern on the first curable resin using a patterning roll and curing the first curable resin, filling the intaglio pattern with a second curable resin containing a conductive material, and curing the second curable resin. | 05-21-2009 |
20100073794 | OPTICAL FILTER FOR COMPENSATING FOR COLOR SHIFT AND DISPLAY DEVICE HAVING THE SAME - An optical filter for compensating for color shift is provided in front of a display panel of a display device. The optical filter includes a background layer and a green wavelength absorption pattern provided with a predetermined thickness on the background layer. The green wavelength absorption pattern absorbs a green wavelength of light. The green wavelength absorption pattern contains a material that absorbs a green wavelength of light in the range of 510 nm to 560 nm, and can also contain a white light absorbing material. A green's complementary color absorbing part absorbs a wavelength of light complementary to green, and contains at least one of a material absorbing a blue wavelength of light in the range of 440 nm to 480 nm and a material absorbing a red wavelength of light in the range of 600 nm to 650 nm. A first thick-film layer, a first thin-film layer, and a second thick-film layer are stacked over one another in the order named. | 03-25-2010 |
20110116025 | OPTICAL FILTER FOR DISPLAY DEVICE AND DISPLAY DEVICE HAVING THE SAME - An optical filter provided in front of a display panel of a display device includes a background layer and a color shift-reducing pattern formed to a predetermined thickness at the background layer. The color shift-reducing pattern has a plurality of partial areas, and at least two partial areas of the plurality of partial areas have different light absorptivities and/or light diffusivities. The at least two partial areas may contain different amounts of a light-absorbing material that cause the different light-absorptivities and/or different amounts of a light-diffusing material that cause the different light diffusivities. The color shift-reducing pattern may have first and second partial areas, in which only the first partial area may contain the light-absorbing material, and only the second partial area may contain the light-diffusing material. The light-absorbing material may include a green wavelength-absorbing material that absorbs light having green wavelengths from 510 nm to 560 nm. The light-diffusing material may include light-diffusing beads. | 05-19-2011 |
20110128483 | OPTICAL FILM FOR REDUCING COLOR SHIFT AND LCD DEVICE HAVING THE SAME - An optical film for reducing color shift is provided in front of a display panel of an LCD device. The optical film includes a background layer, and a plurality of lens parts, which are spaced apart from each other, engraved or embossed on the background layer. The color of light incident on the optical film from the display panel varies depending on the watching angle and the gray level due to birefringence by a liquid crystal in the display panel. The lens parts diffuse light incident thereon and then to mix the diffused light with light passing between the lens parts. The lens parts have a depth to width ratio of 0.25 or more, a spacing to pitch ratio ranging from 0.5 to 0.95, and a pitch of 45 μm or less. An LCD device may include the optical film. | 06-02-2011 |
20130320336 | Oxide Semiconductor Sputtering Target, Method Of Manufacturing Thin-Film Transistors Using The Same, And Thin Film Transistor Manufactured Using The Same - An oxide semiconductor sputtering target which is used for depositing a thin film having high electron mobility and high operational reliability, a method of manufacturing thin-film transistors (TFTs) using the same, and a TFT manufactured using the same. The oxide semiconductor sputtering target is used in a sputtering process for depositing an active layer on a TFT. The oxide semiconductor sputtering target is made of a material based on a composition including indium (In), tin (Sn), gallium (Ga) and oxygen (O). The method includes the step of depositing an active layer using the above-described oxide semiconductor sputtering target. The thin-film transistor may be used in a display device, such as a liquid crystal display (LCD) or an organic light-emitting display (OLED). | 12-05-2013 |
Patent application number | Description | Published |
20090014301 | TIME DELAY OUTPUT APPARATUS FOR CIRCUIT BREAKER - A time delay output apparatus for a circuit breaker includes a switch disposed at one side of a main shaft rotatable in directions to open/close a fixed contactor and a movable contactor, and a delay member disposed between the main shaft and the switch so as to operate the switch with a preset time delay, thereby simplifying the construction and reducing the size as well as enhancing operational reliability by stably obtaining a time delay. | 01-15-2009 |
20100164661 | CYLINDER TYPE BISTABLE PERMANENT MAGNETIC ACTUATOR - Disclosed is a cylinder type bistable permanent magnetic actuator, the bistable actuator including, a cylinder formed by rolling a thin plate so as to form an inner space, a mover reciprocatingly installed within the cylinder in a lengthwise direction of the cylinder, first and second coils installed near both end portions of the cylinder, respectively, by interposing the mover therebetween, and a permanent magnet installed between the first and second coils. | 07-01-2010 |
20100164662 | Monostable permanent magnetic actuator using laminated steel core - A monostable permanent magnetic actuator using a laminated steel core, comprises: lamination cores formed as a plurality of metallic thin plates are laminated to each other; a coil disposed to be adjacent to the lamination cores, and configured to apply a magnetic force to the lamination cores by an external power; a mover mounted in the lamination cores so as to be movable in upper and lower directions; permanent magnets installed at the lamination cores, and configured to apply an upward and downward magnetic force to the mover; and an elastic means configured to apply an elastic force to the mover in an opposite direction to the permanent magnets. | 07-01-2010 |
Patent application number | Description | Published |
20110195531 | APPARATUS AND METHOD FOR EVALUATING OPTICAL PROPERTIES OF LED AND METHOD FOR MANUFACTURING LED DEVICE - An optical property evaluation apparatus includes: a light conversion filter converting light emitted from an LED chip or a bare LED package, which is to be evaluated, into a different wavelength of light, and emitting a specific color of light; and an optical property measurement unit receiving the specific color of light emitted from the light conversion filter and measuring the optical properties of the received light. | 08-11-2011 |
20120298954 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME - There are provided a semiconductor light emitting device and a manufacturing method of the same. The semiconductor light emitting device includes a light emitting structure including first and second conductive semiconductor layers with an active layer interposed therebetween; first and second bonding electrodes connected to the first and second conductive semiconductor layers, respectively; a transparent electrode layer formed on the second conductive semiconductor layer; a plurality of nano structures formed on the transparent electrode layer; and a passivation layer formed to cover the plurality of nano-structures, wherein refractive indexes of the transparent electrode layer, the plurality of nano-structures, and the passivation layer may be sequentially reduced. | 11-29-2012 |
20120299040 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - There is provided a semiconductor light emitting device including: a light transmissive substrate; a light emitting part; first and second electrodes electrically connected to the first and second conductivity type semiconductor layers, respectively; and a rear reflective part including a reflective metallic layer, and a light transmissive dielectric layer interposed between the light transmissive substrate and the reflective metallic layer. | 11-29-2012 |
20140080230 | APPARATUS AND METHOD FOR EVALUATING OPTICAL PROPERTIES OF LED AND METHOD FOR MANUFACTURING LED DEVICE - An optical property evaluation apparatus includes: a light conversion filter converting light emitted from an LED chip or a bare LED package, which is to be evaluated, into a different wavelength of light, and emitting a specific color of light; and an optical property measurement unit receiving the specific color of light emitted from the light conversion filter and measuring the optical properties of the received light. | 03-20-2014 |
Patent application number | Description | Published |
20080292968 | Organic/Inorganic Composite Separator Having Morphology Gradient, Manufacturing Method Thereof and Electrochemical Device Containing the Same - Disclosed is an organic/inorganic composite separator including: a porous substrate having pores; and a porous active layer containing a mixture of inorganic particles and a binder polymer with which at least one surface of the porous substrate is coated. The organic/inorganic composite separator of the present invention may be useful to enhance peeling and scratch resistances and improve a lamination characteristic by introducing a porous active layer onto a porous substrate having pores, the porous active layer having heterogeneity of morphology toward a thickness direction in which a content ratio of the binder polymer/inorganic particles present in a surface layer is higher than that of the binder polymer/inorganic particles present inside the surface layer. Accordingly, the stability and performances of a battery can be improved together since the detachment of inorganic particles from the porous active layer may be reduced during the assembly process of the electrochemical device. | 11-27-2008 |
20080311479 | Electrode With Enhanced Safety and Electrochemical Device Having the Same - Disclosed is an electrode having a current collector coated with an electrode active material, wherein non-coated regions of the electrode and boundary regions of intermittently pattern-coated electrodes are coated with a porous active layer including a mixture of inorganic particles and a binder polymer. The electrode of the present invention may be useful to improve safety of a battery and also minimize reduction in the capacity of a battery by introducing the porous active layer onto non-coated regions of the electrode and/or boundary regions of the intermittently pattern-coated electrodes to prevent internal short circuit caused by the contact between both electrodes, wherein the boundary regions are coated with the electrode active material but vulnerable to the electrical short circuit. | 12-18-2008 |
20090111026 | ORGANIC/INORGANIC COMPOSITE SEPARATOR HAVING POROUS ACTIVE COATING LAYER AND ELECTROCHEMICAL DEVICE CONTAINING THE SAME - An organic/inorganic composite separator includes (a) a polyolefin porous substrate having pores; and (b) a porous active layer containing a mixture of inorganic particles and a binder polymer, with which at least one surface of the polyolefin porous substrate is coated, wherein the porous active layer has a peeling force of 5 gf/cm or above, and a thermal shrinkage of the separator after being left alone at 150° C. for 1 hour is 50% or below in a machine direction (MD) or in a transverse direction (TD). This organic/inorganic composite separator solves the problem that inorganic particles in the porous active layer formed on the porous substrate are extracted during an assembly process of an electrochemical device, and also it may prevent an electric short circuit between cathode and anode even when the electrochemical device is overheated. | 04-30-2009 |
20100261047 | ELECTROCHEMICAL DEVICE HAVING DIFFERENT KINDS OF SEPARATORS - An electrochemical device includes a plurality of unit cells, each having a first separator and a cathode and an anode positioned at both sides of the first separator, and a continuous single second separator interposed between adjacent unit cells in correspondence with each other in a laminated pattern and arranged to surround each unit cell. The first separator includes a heat-resisting porous substrate having a melt point of 200° C. or above and a first porous coating layer formed on at least one surface of the heat-resisting porous substrate and made of a mixture of a plurality of inorganic particles and a binder polymer. The second separator includes a polyolefin porous substrate and a second porous coating layer formed on at least one surface of the polyolefin porous substrate and made of a mixture of a plurality of inorganic particles and a binder polymer. | 10-14-2010 |
20110045168 | ORGANIC/INORGANIC COMPOSITE POROUS MEMBRANE AND ELECTROCHEMICAL DEVICE USING THE SAME - The present invention provides an organic/inorganic composite porous separator, which comprises: (a) a porous substrate having pores; and (b) an organic/inorganic composite layer formed by coating at least one region selected from the group consisting of a surface of the substrate and a part of pores present in the substrate with a mixture of inorganic porous particles and a binder polymer, wherein the inorganic porous particles have a plurality of macropores with a diameter of 50 nm or greater in the particle itself thereby form a pore structure, a manufacturing method thereof, and an electrochemical device using the same. As an additional pathway for lithium ions is created due to a number of pores existing in the inorganic porous particle itself, degradation in the battery performance can be minimized, and energy density per unit weight can be increased by the weight loss effect. | 02-24-2011 |
Patent application number | Description | Published |
20110138615 | CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME - Disclosed herein is a carrier for manufacturing a printed circuit board, including: a magnetic sheet; and a metal layer attached to at least one side of the magnetic sheet by magnetic properties of the magnetic sheet. The carrier is advantageous in that its structure can be simplified without performing a vacuum or releasing process at the time of the attachment and separation of the carrier, thus reducing process cost and process time and maintaining the size of a printed circuit board. | 06-16-2011 |
20110138621 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities. | 06-16-2011 |
20110139858 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities. | 06-16-2011 |
20110180205 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing to the carrier and maintaining the compatibility between the substrate and manufacturing facilities. | 07-28-2011 |
20110315745 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities. | 12-29-2011 |
20120088334 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - Disclosed herein is a method for manufacturing a semiconductor package which uses a base member | 04-12-2012 |
20120103671 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manufacturing the same capable of implementing a slim and small semiconductor package by the printed circuit board configured to include a circuit layer and an insulating layer as a single layer and shortening a process time and reducing processing costs by forming a bump using a screen printing method. Further, disclosed herein is a method for manufacturing a printed circuit board capable of improving a warpage problem of the printed circuit board that occurs during a polishing process by adopting a coining process instead of a polishing process. | 05-03-2012 |
20120152753 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board that simultaneously forms a via and an embedding land and thus improves the matching value of the via and the embedding land to secure interlayer conduction reliability, and further simultaneously forms the via and the embedding land to reduce manufacturing costs. In addition, the embedding land is formed to be embedded in the second insulating layer to implement high-density/high-integration of the printed circuit board and a via is formed in less time as compared to a method of forming a via hole using laser to reduce a process time. | 06-21-2012 |
20130119540 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a semiconductor package and a method for manufacturing the same. The method includes preparing a substrate having one surface and the other surface; mounting a semiconductor device mounted on one surface of the substrate; forming external connection terminals on the other surface of the substrate; forming a warpage preventing layer formed on one surface of the substrate or the other surface of the substrate; and performing a reflow process on the substrate. | 05-16-2013 |
20140027156 | MULTILAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a multilayer type coreless substrate, the method including: (A) preparing a carrier substrate including at least one copper foil formed on one surface or both surfaces of an insulating surface; (B) forming a coreless printed circuit precursor on one surface or both surfaces of the carrier substrate; (C) separating the carrier substrate; (D) performing a polishing cutting process on the coreless printed circuit precursor; and (E) laminating a plurality of other insulating layers on a flat outer surface of the coreless printed circuit precursor, the plurality of other insulating layers sequentially including other circuit layers and other pillars. | 01-30-2014 |
20140060899 | PREPREG, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD - Disclosed herein are prepreg, a copper clad laminate (CCL), and a printed circuit board. When a reinforcing member formed of organic fiber including a liquid crystal polymer resin or a super engineering resin and a base resin having the same component as the reinforcing member are used, a coefficient of thermal expansion (CTE) and rigidity may be adjusted. In addition, during an operation of a semiconductor chip mounted on the printed circuit board, the semiconductor chip and the printed circuit board expand and contract due to heat by as much as similar degrees, and thus, the reliability of a solder joint may be enhanced. Moreover, fiber protrusion failure may be prevented compared with a case a via hole is processed by using a CO | 03-06-2014 |
Patent application number | Description | Published |
20120106368 | METHOD AND APPARATUS OF DETECTING RESOURCE ASSIGNMENT INFORMATION IN WIRELESS COMMUNICATION SYSTEM - A method and apparatus of detecting resource assignment information by a user equipment (UE) in a wireless communication system is provided. The UE detects a number of Assignment Advanced-MAP (A-A-MAP) groups and a number of a plurality of A-A-MAP Information Elements (IEs) included in each of the A-A-MAP groups, extracts type and flag of each of the plurality of A-A-MAP IEs; and performs blind detection of resource assignment information on the basis of the type and flag of each of the A-A-MAP IEs. | 05-03-2012 |
20120257669 | DATA PROCESSING METHOD, EQUALIZER AND RECEIVER - A data processing method, an equalizer, and a receiver in a wireless communication system including a relay station are provided. The data processing method includes: receiving a base station signal from a base station; receiving a relay station signal from a relay station; determining a propagation delay between the base station signal and the relay station signal; generating an equalizing signal in which interference generated between the base station signal and the relay station signal is alleviated in consideration of the propagation delay; and recovering information bits transmitted by the base station from the equalizing signal. According to an exemplary embodiment of the present invention, it is possible to alleviate performance deterioration due to an interference problem generated in a relay system. | 10-11-2012 |
20130003897 | METHOD AND APPARATUS FOR DEMODULATING DOWNLINK SIGNAL IN WIRELESS COMMUNICATION SYSTEM - There is provided a method and apparatus in which a user equipment demodulates a downlink signal in a wireless communication system. The user equipment receives a first orthogonal frequency division multiplexing (OFDM) signal from a first node serving the mobile station, receives a second OFDM signal from a second node different from the first node, and demodulates the first OFDM signal and the second OFDM signal in a fast Fourier transform (FFT) section. The first OFDM signal and the second OFDM signal are either normal mode signals each having a first cyclic prefix (CP) or cooperative mode signals each having a second CP, and the second CP has a longer length than the first CP. | 01-03-2013 |
20140160917 | DEVICE FOR GENERATING RANGING SIGNAL OF WIRELESS COMMUNICATION SYSTEM AND METHOD OF GENERATING RANGING SIGNAL OF WIRELESS TERMINAL - There are provided a method of generating a ranging signal of a wireless terminal and a device for generating a ranging signal of a wireless communication system that can generate the ranging signal using one IFFT engine independently from a mode of the ranging signal transmitted in uplink in a wireless communication system in which a frequency interval of subcarriers used to generate an initial ranging signal and a frequency interval of subcarriers using periodic ranging are different. In this way, it is possible to decrease complexity of hardware and design of the wireless terminal, and decrease power consumption of the wireless terminal through hardware simplification. | 06-12-2014 |
20140161215 | DEVICE AND METHOD FOR ESTIMATING CARRIER FREQUENCY OFFSET OF OFDM SIGNALS TRANSMITTED AND RECEIVED THROUGH PLURALITY OF POLARIZED ANTENNAS - Provided are a device and method for estimating carrier frequency offset of OFDM signals transmitted and received through a plurality of polarized antennas that may accurately estimate carrier frequency offset used for carrier frequency synchronization acquisition when there is interference between polarized waves. | 06-12-2014 |
Patent application number | Description | Published |
20090190054 | Display Substrate, Method Of Manufacturing The Same And Liquid Crystal Display Panel Having The Display Substrate - A display substrate includes a plurality of transistors, a plurality of color filters, a plurality of pixel electrodes, a plurality of supporting members, and a plurality of filling members. The transistors are connected to a plurality of gate lines extending in a first direction on a base substrate and a plurality of data lines extending in a second direction crossing the first direction. The color filters are disposed over the transistors, and have a plurality of holes. The pixel electrodes are disposed on the color filters, and electrically connect to the transistors. The supporting members are disposed on the color filters, and maintain a gap between the base substrate and a substrate opposing the base substrate. The filling members are comprised of the same material as the supporting members, and fill the holes. | 07-30-2009 |
20090207328 | Liquid Crystal Display Having High Luminance and High Display Quality - A liquid crystal display (LCD) having high luminance and color renditions is provided. The liquid crystal display includes a first insulating substrate, a gate line and a data line crossing each other on the first insulating substrate to define a pixel. First and second sub-pixel electrodes divide the pixel into two parts. A first switching element drives the first sub-pixel electrode and a second switching element drives the second sub-pixel electrode. A second insulating substrate faces the first insulating substrate. A color pattern is arranged on the second insulating substrate and overlaps the first sub-pixel electrode. A contrast pattern overlaps the second sub-pixel electrode. | 08-20-2009 |
20100033418 | LIQUID CRYSTAL DISPLAY - The present invention provides a liquid crystal display (LCD). The LCD includes: a liquid crystal panel that includes a plurality of gate lines; and a gate driver that includes a plurality of stages, which are connected to the gate lines, respectively, and sequentially provide a plurality of gate signals to the gate lines, respectively, and a first dummy stage and a second dummy stage that are separated from each other, wherein the first dummy stage is enabled by a carry signal of one of the stages, and the second dummy stage is enabled by a carry signal of the first dummy stage and initializes each of the stages. | 02-11-2010 |
20100038650 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device includes first and second substrates, and first and second alignment keys. The first and second substrates have first and second display regions and first and second peripheral regions, respectively. The first alignment key is disposed in the first peripheral region of the first substrate. The first alignment key includes a first pattern and a second pattern. The second alignment key is disposed in the second peripheral region of the second substrate such that the second alignment key faces the first alignment key. As a result, first alignment key may be formed through a procedure of forming the pixel electrode. Therefore, there exists no deviation between the first alignment key and the pixel electrode and the first alignment key may be easily detected because of the first pattern that is opaque, so that misalignment is prevented. | 02-18-2010 |
20110140111 | THIN FILM TRANSISTOR ARRAY PANEL AND METHOD FOR MANUFACTURING THE SAME - A thin film transistor array panel is provided and includes a gate line, a gate insulating layer covering the gate line, a semiconductor layer disposed on the gate insulating layer, and a data line and a drain electrode disposed on the semiconductor layer. The data line and the drain electrode have a dual-layered structure including a lower layer and an upper layer with the lower layer having a first portion protruded outside the upper layer and the semiconductor layer having a second portion protruded outside the edge of the lower layer. | 06-16-2011 |
20110164198 | LIQUID CRYSTAL DISPLAY AND METHOD OF MANUFACTURING THE SAME - A vertical alignment liquid crystal display includes a first substrate and a second substrate disposed opposite the first substrate. The first substrate includes a first insulation substrate, as well as a first pixel electrode and a second pixel electrode disposed in a same layer with the first pixel electrode on the first insulation substrate. The second substrate includes a second insulation substrate, a first patterned conductive layer disposed on only a portion of the second insulation substrate which is above the first pixel electrode, and a second patterned conductive layer disposed on only a portion of the second insulation substrate which is above the second pixel electrode. | 07-07-2011 |
20120038843 | LIQUID CRYSTAL DISPLAY - A liquid crystal display according to an exemplary embodiment of the present invention includes: a first substrate and an opposing second substrate; a first pixel electrode and a second pixel electrode disposed in a pixel area, on the first substrate, and including a plurality of branch electrodes; and a liquid crystal layer interposed between the first and second electrodes. Branches electrode of the first pixel electrode and the second pixel electrode are interlaced. The first pixel electrode has an extension disposed adjacent to the center of the pixel area, and a minimum distance between the extension and the adjacent branch electrode is different from an average minimum between the adjacent branch electrodes. | 02-16-2012 |
20120081627 | Lateral Electric Field Display Panel and Display Apparatus Having the Same - A display panel includes a first substrate including a plurality of pixels, a second substrate facing the first substrate, and a liquid crystal layer disposed between the first and second substrates. Each pixel includes a data line, a gate line insulated from the data line, a first signal line insulated from the data line, a second signal line insulated from the data line, a switching device connected to the data line and the gate line, a first pixel electrode connected to the switching device, and a second pixel electrode connected either the first signal line or the second signal line. The display panel displays an image according to an electric field generated between the first and second pixel electrodes. | 04-05-2012 |
20120182514 | LIQUID CRYSTAL DISPLAY - A liquid crystal display includes a first substrate, a second substrate, a liquid crystal layer between the substrates and including liquid crystal molecules, a first pixel electrode, and a second pixel electrode. The pixel electrodes each include a stem at an edge of a pixel area, and a plurality of branches extended from the stem. The branches of the pixel electrodes are alternately disposed. The liquid crystal display further includes a first region including a first interval between the branches of the first pixel electrode and adjacent branches of the second pixel electrode, and a second region including a second interval between the branches of the first pixel electrode and the adjacent branches of the second pixel electrode which is smaller than the first interval. The first region is where the stems of the first pixel electrode and the second pixel electrode are not disposed. | 07-19-2012 |
20120194774 | LIQUID CRYSTAL DISPLAY - A liquid crystal display includes: first and second substrate opposite to each other; data lines on the first substrate which transmits a first voltage; a voltage transmitting line on the first substrate which transmits a second voltage; and first and second pixel electrodes on the first substrate and spaced apart from each other, where one of the first and second pixel electrodes is applied with the first voltage through the data lines, the other of the first and second pixel electrodes is applied with the second voltage through the voltage transmitting line, each of the first and second pixel electrodes includes a stem and branches electrodes extending from the stem, the branches of the first pixel electrode and the branches of the second pixel electrode are alternately disposed, and the stems of the first and second pixel electrodes overlap at least a portion of the voltage transmitting line. | 08-02-2012 |
20130270565 | THIN FILM TRANSISTOR ARRAY PANEL AND METHOD FOR MANUFACTURING THE SAME - A thin film transistor array panel is provided and includes a gate line, a gate insulating layer covering the gate line, a semiconductor layer disposed on the gate insulating layer, and a data line and a drain electrode disposed on the semiconductor layer. The data line and the drain electrode have a dual-layered structure including a lower layer and an upper layer with the lower layer having a first portion protruded outside the upper layer and the semiconductor layer having a second portion protruded outside the edge of the lower layer. | 10-17-2013 |
20140117360 | THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF - Provided is a thin film transistor array panel. The thin film transistor array panel includes: an insulation substrate including a display area with a plurality of pixels and a peripheral area around the display area; a gate line and a data line positioned in the display area of the insulation substrate; a first driving signal transfer line and a second driving signal transfer line positioned in the peripheral area of the insulation substrate; a first insulating layer positioned on the gate line and the data line; and a first photosensitive film positioned on the first driving signal transfer line and the second driving signal transfer line, in which the first photosensitive film is disposed only in the peripheral area. | 05-01-2014 |
20140363961 | THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF - Provided is a thin film transistor array panel. The thin film transistor array panel includes: an insulation substrate including a display area with a plurality of pixels and a peripheral area around the display area; a gate line and a data line positioned in the display area of the insulation substrate; a first driving signal transfer line and a second driving signal transfer line positioned in the peripheral area of the insulation substrate; a first insulating layer positioned on the gate line and the data line; and a first photosensitive film positioned on the first driving signal transfer line and the second driving signal transfer line, in which the first photosensitive film is disposed only in the peripheral area. | 12-11-2014 |
Patent application number | Description | Published |
20100294543 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same. | 11-25-2010 |
20110088928 | HEAT DISSIPATING SUBSTRATE - Disclosed is a heat dissipating substrate, which includes a metal plate, an insulating film formed on the surface of the metal plate, a circuit pattern formed on the insulating film, and a first via formed to pass through at least a part of the metal plate so that the metal plate and the circuit pattern are electrically connected to each other, and also which exhibits superior heat dissipation effects and enables the configuration of a circuit board to be simple due to no need to additionally provide a ground layer and a power layer. | 04-21-2011 |
20120103589 | HEAT DISSIPATION DEVICE FOR POWER CONVERSION MODULE - Disclosed herein is a heat dissipation device for a power conversion module. The device includes a casing, a high-heat-dissipation heat sink and a circuit board. The casing includes a heat-dissipation fin unit which has heat dissipation fins arranged at positions spaced apart from each other by predetermined intervals. The casing has a mounting space therein. The high-heat-dissipation heat sink is installed in the mounting space of the casing. The circuit board is coupled to a lower surface of the casing. Therefore, the weight and size of the heat dissipation device can be reduced. In addition, the heat sink and the casing having the heat dissipation fins dissipate heat at the same time, thus enhancing the heat dissipation efficiency. Moreover, in an optimal design, the high-heat-dissipation heat sink is located at a position corresponding to a part which generates high heat so that the heat dissipation efficiency can be maximized. | 05-03-2012 |
20120121361 | LOOSE PREVENTING ASSEMBLY - Disclosed herein is a loose preventing assembly including a bolt, a fastening member, and a pin-spring washer coupled between the bolt and the fastening member. The pin-spring washer includes a spring washer portion, a curved portion of which one end is connected to the spring washer portion to be curved upward and the other end is positioned in an inward direction of the spring washer portion, and a pin portion which extends in one direction from the other end of the curved portion tightens the bolt to couple the pin portion to an insertion groove formed in the bolt, thereby preventing the bolt and the fastening member from being loosened from each other. | 05-17-2012 |
20120273116 | HEAT DISSPIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same. | 11-01-2012 |
20130001759 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - Disclosed herein is a semiconductor package including: first power device; second power device formed in an upper portion of the first power device; a first lead frame formed in a lower portion of the first power device; a second lead frame formed in the upper portion of the first power device and a lower portion of the second power device; a third lead frame formed in an upper portion of the second power device; a fourth lead frame electrically connected to at least one of the power device and the second power device; and a sealing substance exposing a part of the first through fourth lead frames and sealing the other parts thereof. | 01-03-2013 |
20130069210 | POWER MODULE PACKAGE - Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one side of one surface of the first substrate; and a first lead frame contacting the other side of one surface of the first substrate. The power module package further includes: a first metal layer formed on one side of one surface of the first substrate; a first bonding layer formed on the first metal layer and contacting a lower surface of the second substrate; a second metal layer formed on the other side of one surface of the first substrate; and a second bonding layer formed on the second metal layer and contacting a lower surface of the first lead frame. | 03-21-2013 |
20130069213 | POWER MODULE PACKAGE - Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one surface of the first substrate; a third substrate contacting one side of the other surface of the first substrate; a first lead frame contacting the other side of the other surface of the first substrate; and a second lead frame electrically connected to the third substrate. | 03-21-2013 |
20130105956 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 05-02-2013 |
20130343001 | HEAT DISSIPATION SYSTEM FOR POWER MODULE - Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein. | 12-26-2013 |
20130343002 | HEAT DISSIPATION SYSTEM FOR POWER MODULE - Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively. | 12-26-2013 |
20140000839 | COOLING APPARATUS | 01-02-2014 |
20140014313 | MULTI-STAGE HEAT SINK, COOLING SYSTEM WITH THE SAME AND METHOD FOR CONTROLLING THE SAME - Disclosed herein is a multi-stage heat sink cooling system, including: at least one step surface in a direction of a surface to which cooling air is injected, wherein the step surface is any one of a step surface having a stair shape that is provided with a plurality of heat radiating plates each having a curve, a step surface provided with a plurality of heat radiating plates having a streamlined smooth curve, and a step surface provided with a plurality of heat radiating fins having a height difference. According to the preferred embodiments of the present invention, the cooling system with the multi-stage heat sink can cool heat generated from a heat radiating element using the multi-stage heat sink and the air injection part to improve a heat release rate. | 01-16-2014 |