Patent application number | Description | Published |
20090031512 | POST CMP SCRUBBING OF SUBSTRATES - A cleaning method is provided for brush cleaning a surface of a substrate. The method comprises scrubbing a first surface of the substrate with a brush having a first surface geometry; and then scrubbing the first surface of the substrate with a brush having a second surface geometry, wherein the first and the second surface geometries are different. Numerous other aspects are provided. | 02-05-2009 |
20090084413 | VAPOR DRYER HAVING HYDROPHILIC END EFFECTOR - Embodiments of the present invention generally relate to an apparatus and methods for rinsing and drying substrates. One embodiment provides an end effector comprising a body having a contact tip for contacting an edge area of a substrate, wherein the end effector is configured to support the substrate while the substrate is in a rinsing bath and while the substrate is being dried from the rinsing bath, and the contact tip comprises a hydrophilic material. | 04-02-2009 |
20100120333 | In-Line Wafer Thickness Sensing - A method of forming bare silicon substrates is described. A bare silicon substrate is measured, wherein measuring is performed by a non-contact capacitance measurement device to obtain a signal at a point on the substrate. The signal or a thickness indicated by the signal is communicated to a controller. An adjusted polishing parameter according to the signal or thickness indicated by the signal is determined. After determining an adjusted polishing parameter, the bare silicon substrate is polished on a polisher using the adjusted polishing parameter. | 05-13-2010 |
20110266736 | VAPOR DRYER HAVING HYDROPHILIC END EFFECTOR - Embodiments of the present invention generally relate to an apparatus and methods for rinsing and drying substrates. One embodiment provides an end effector comprising a body having a contact tip for contacting an edge area of a substrate, wherein the end effector is configured to support the substrate while the substrate is in a rinsing bath and while the substrate is being dried from the rinsing bath, and the contact tip comprises a hydrophilic material. | 11-03-2011 |
20130139851 | POST CMP SCRUBBING OF SUBSTRATES - A cleaning method is provided for brush cleaning a surface of a substrate. The method comprises scrubbing a first surface of the substrate with a brush having a first surface geometry; and then scrubbing the first surface of the substrate with a brush having a second surface geometry, wherein the first and the second surface geometries are different. Numerous other aspects are provided. | 06-06-2013 |
Patent application number | Description | Published |
20110275167 | Endpoint Method Using Peak Location Of Modified Spectra - A method of optically monitoring a substrate during polishing includes receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a first spectrum from the substrate during polishing, the first spectrum measured within an initial time following initiation of polishing, measuring a sequence of second spectra from the substrate during polishing, the sequence of second spectra measured after the initial time, for each second spectrum in the sequence of second spectra, removing the first spectrum from the second spectrum to generate a sequence of modified third spectra, determining a value of a characteristic of the selected spectral feature for each third spectrum in the sequence of third spectra to generate a sequence of values for the characteristic, and determining a polishing endpoint or an adjustment for a polishing rate based on the sequence of values. | 11-10-2011 |
20120277897 | SELECTION OF POLISHING PARAMETERS TO GENERATE REMOVAL PROFILE - Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored. | 11-01-2012 |
20140277670 | Selection of Polishing Parameters to Generate Removal or Pressure Profile - Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored. | 09-18-2014 |
20160096251 | Selection of Polishing Parameters to Generate Removal or Pressure Profile - Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored. | 04-07-2016 |
Patent application number | Description | Published |
20140361671 | COMPUTER INTERNAL ARCHITECTURE - An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU). | 12-11-2014 |
20140361893 | COMPUTER INPUT/OUTPUT INTERFACE - An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU). | 12-11-2014 |
20140362519 | COMPUTER SYSTEM - A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing. | 12-11-2014 |
20140362576 | COMPUTER ARCHITECTURE - An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU). | 12-11-2014 |
20150106638 | REDUCED ENERGY CONSUMPTION IN A COMPUTER SYSTEM THROUGH SOFTWARE AND HARDWARE COORDINATED CONTROL OF MULTIPLE POWER SUPPLIES - The embodiments discussed herein relate to systems, methods, and apparatus for controlling power consumption of a computing device in a standby or sleep mode. During the standby or sleep mode an external device can be plugged into the computing device. The external device can be provided power from a standby power supply until a determination is made as to whether a main power supply is operating. The determination can be based on comparing the output of the main power supply to an output of the standby power supply. If the main power supply is operating, a switch in the computing device can close to allow the main power supply to provide power to the external device. Moreover, in some embodiments, the switch can close based exclusively on a current demand of the external device from the standby power supply. | 04-16-2015 |
Patent application number | Description | Published |
20090274652 | Hepatitis C Virus Inhibitors - Hepatitis C virus inhibitors having the general formula | 11-05-2009 |
20090274656 | HEPATITIS C VIRUS INHIBITORS - Hepatitis C virus inhibitors are disclosed having the general formula: | 11-05-2009 |
20090285774 | Hepatitis C Virus Inhibitors - Hepatitis C virus inhibitors having the general formula | 11-19-2009 |
20110311482 | Hepatitis C Virus Inhibitors - Hepatitis C virus inhibitors are disclosed having the general formula: | 12-22-2011 |
20120142653 | C-28 AMIDES OF MODIFIED C-3 BETULINIC ACID DERIVATIVES AS HIV MATURATION INHIBITORS - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, modified C-3 and C-28 betulinic acid derivatives that possess unique antiviral activity are provided as HIV maturation inhibitors. These compounds are useful for the treatment of HIV and AIDS. | 06-07-2012 |
20120330019 | Hepatitis C Virus Inhibitors - Hepatitis C virus inhibitors are disclosed having the general formula: | 12-27-2012 |
20130035318 | C-17 AND C-3 MODIFIED TRITERPENOIDS WITH HIV MATURATION INHIBITORY ACTIVITY - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, C-17 and C-3 modified triterpenoids that possess unique antiviral activity are provided as HIV maturation inhibitors, as represented by compounds of Formulas I, II and III: | 02-07-2013 |
20130267713 | Hepatitis C Virus Inhibitors - Hepatitis C virus inhibitors are disclosed having the general formula: | 10-10-2013 |
20130296554 | C-17 BICYCLIC AMINES OF TRITERPENOIDS WITH HIV MATURATION INHIBITORY ACTIVITY - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, C-17 bicyclic amines of triterpenoids that possess unique antiviral activity are provided as HIV maturation inhibitors, as represented by compounds of Formulas I, II and III: | 11-07-2013 |
20140163231 | Hepatitis C Virus Inhibitors - Hepatitis C virus inhibitors are disclosed having the general formula: | 06-12-2014 |
20140221361 | C-19 MODIFIED TRITERPENOIDS WITH HIV MATURATION INHIBITORY ACTIVITY - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, C-19 modified triterpenoids that possess unique antiviral activity are provided as HIV maturation inhibitors, as represented by compounds of Formulas I and II: | 08-07-2014 |
20140343000 | COMPOSITIONS HAVING C-17 AND C-3 MODIFIED TRITERPENOIDS WITH HIV MATURATION INHIBITORY ACTIVITY - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, C-17 and C-3 modified triterpenoids that possess unique antiviral activity are provided as HIV maturation inhibitors, as represented by compounds of Formulas I, II and III: | 11-20-2014 |
20150291655 | TRITERPENOIDS WITH HIV MATURATION INHIBITORY ACTIVITY - Compounds having drug and bio-affecting properties, their pharmaceutical compositions and methods of use are set forth. In particular, triterpenoids that possess unique antiviral activity are provided as HIV maturation inhibitors, as represented by compounds of Formula I: | 10-15-2015 |
20160067302 | Hepatitis C Virus Inhibitors - Hepatitis C virus inhibitors are disclosed having the general formula: | 03-10-2016 |
Patent application number | Description | Published |
20130019951 | Multi-vane throttle valve - A multi-vane throttling valve for a vacuum process chamber includes a throttle chamber body having an inside exposed to the vacuum process chamber and an outside exposed to atmospheric pressure, the chamber body defining a through-opening for controlling vacuum within the vacuum process chamber, a plurality of rotatable vanes mounted within the through-opening for controlling a flow of gases through the through-opening where each rotatable vane includes a cooling flow pathway in fluid communication with and disposed longitudinally along each rotatable vane, and a drive mechanism disposed on and connected to an outside of the throttle chamber body for rotating the plurality of rotatable vanes to vary the flow of process gases. | 01-24-2013 |
20140345698 | Multi-vane throttle valve - A multi-vane throttling valve for a vacuum process chamber includes a reciprocal vane pivotally connected to and extending backwardly away from a back side of each of a plurality of rotatable vanes, and a stationary reciprocal vane angling assembly fixed in a predefined position and having an assembly pin extending transversely toward the reciprocal vane a predefined distance sufficient to support the reciprocal vane whereby the stationary angling assembly causes the reciprocal vane to pivot in a range between a substantially parallel position with the respective rotatable vane and a transverse position with the respective rotatable vane when the respective rotatable vane is rotated. | 11-27-2014 |
20150300705 | Integrated thermoelectric-powered fluid heat exchanger - A fluid heat exchanger has an impeller assembly with first and second impeller bodies mated together, each having a substantially circular shape and at least one opening therethrough. Impeller vanes extend axially from the first impeller body and away from the second impeller body. Impeller vanes extend axially from the second impeller body away from the first impeller body. A thermoelectric module is disposed between the first impeller body and the second impeller body. Heat sinks are connected to each side of the thermoelectric module and extend through at least one opening in the first and second impeller bodies, where the impeller vanes are configured to move a fluid through the heat sinks during rotation of the first and second impeller bodies. Electrically-conductive windings disposed in the impeller assembly are configured to deliver induced electric current to the thermoelectric module(s). | 10-22-2015 |